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Hybrid Bonding & TCB Technologies
Low Temperature Cu-Cu Direct Bonding
Cu / Polymer Hybrid Bonding
Cu / Dielectric Hybrid Bonding
Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
3D IC Platforms
Novel Material – Polyimide
Monolithic 3DIC
Wafer-level Bumpless Through-Silicon-Via (TSV)
Novel Low-Warpage Hyper RDL (HRDL) Interposer
Innovative Applications
Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
Advanced Wafer-level Packaging for MEMS Applications
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– 3DIC Lab –
Activities
2020 3DIC Annual Spring Banquet
2020 3DIC Moon Festival BBQ
Koyanagi Professor Lecture
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Koyanagi Professor Lecture