{"id":3224,"date":"2021-10-12T11:18:00","date_gmt":"2021-10-12T03:18:00","guid":{"rendered":"https:\/\/3diclab.pro7.designworks.tw\/?page_id=3224"},"modified":"2026-05-17T15:31:16","modified_gmt":"2026-05-17T07:31:16","slug":"journal","status":"publish","type":"page","link":"https:\/\/3dic.lab.nycu.edu.tw\/zh-hant\/publications\/journal\/","title":{"rendered":"\u671f\u520a"},"content":{"rendered":"\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-21zyuhk-4a4c073632dde4879d1fa5b35189a3fc\">\n.avia-section.av-21zyuhk-4a4c073632dde4879d1fa5b35189a3fc{\nbackground-repeat:no-repeat;\nbackground-image:url(https:\/\/3dic.lab.nycu.edu.tw\/wp-content\/uploads\/2021\/10\/banner-publications.jpg);\nbackground-position:50% 50%;\nbackground-attachment:scroll;\n}\n.avia-section.av-21zyuhk-4a4c073632dde4879d1fa5b35189a3fc .av-section-color-overlay{\nopacity:0.5;\nbackground-color:#515151;\n}\n<\/style>\n<div id='banner'  class='avia-section av-21zyuhk-4a4c073632dde4879d1fa5b35189a3fc main_color avia-section-default avia-no-border-styling  avia-builder-el-0  el_before_av_section  avia-builder-el-first  avia-full-stretch avia-bg-style-scroll av-section-color-overlay-active  av-minimum-height av-minimum-height-custom  container_wrap sidebar_right'  data-section-bg-repeat='stretch'><div class='av-section-color-overlay-wrap'><div class=\"av-section-color-overlay\"><\/div><div class='container av-section-cont-open' style='height:300px'><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3224'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-2002brc-d6ec7a1849cac77d3909e695795865eb sc-av_one_fifth av-equal-height-column-flextable'><div class='flex_column av-2002brc-d6ec7a1849cac77d3909e695795865eb av_one_fifth  avia-builder-el-1  el_before_av_three_fifth  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-1ygrddk-9edc8be5b6de8ffdff397d3f837a329f av_three_fifth  avia-builder-el-3  el_after_av_one_fifth  el_before_av_one_fifth  flex_column_table_cell av-equal-height-column av-align-bottom '   ><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  av_inherit_color '  style='color:#ffffff; '  itemprop=\"text\" ><h2 style=\"text-align: center; font-size: 23px; margin-bottom: -30px;\">&#8211; \u8457\u4f5c\u5c08\u5229 &#8211;<\/h2>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kunrlsg0-1d3fbfed64872efda77f7adee1739ef6\">\n#top .av-special-heading.av-kunrlsg0-1d3fbfed64872efda77f7adee1739ef6{\npadding-bottom:10px;\ncolor:#ffffff;\n}\n.av-special-heading.av-kunrlsg0-1d3fbfed64872efda77f7adee1739ef6 .special-heading-inner-border{\nborder-color:#ffffff;\n}\n<\/style>\n<div  class='av-special-heading av-kunrlsg0-1d3fbfed64872efda77f7adee1739ef6 av-special-heading-h1 custom-color-heading blockquote modern-quote modern-centered  avia-builder-el-5  el_after_av_textblock  avia-builder-el-last  linkline av-thin-font '><h1 class='av-special-heading-tag '  itemprop=\"headline\"  ><strong>\u671f\u520a<\/strong><\/h1><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/p><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-1wox9w8-1670427325cf7ab522e416e4b3f4cdb6 av_one_fifth  avia-builder-el-6  el_after_av_three_fifth  avia-builder-el-last  flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><\/div><!--close column table wrapper. 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Autoclose: 1 --><div class='flex_column_table av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b sc-av_one_half av-equal-height-column-flextable'>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b\">\n.flex_column.av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b{\npadding:30px 30px 30px 30px;\nbackground-color:#ffffff;\n}\n<\/style>\n<div class='flex_column av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b av_one_half  avia-builder-el-28  el_after_av_one_fifth  el_before_av_one_half  first flex_column_table_cell av-equal-height-column av-align-top column-top-margin'   ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_heading-f81abdc0ba8dc28506a40d69d6f4e286\">\n#top .av-special-heading.av-av_heading-f81abdc0ba8dc28506a40d69d6f4e286{\npadding-bottom:0px;\n}\n<\/style>\n<div  class='av-special-heading av-av_heading-f81abdc0ba8dc28506a40d69d6f4e286 av-special-heading-h4 blockquote modern-quote modern-centered  avia-builder-el-29  el_before_av_hr  avia-builder-el-first  '><h4 class='av-special-heading-tag '  itemprop=\"headline\"  >\u53d7\u9080\u6f14\u8b1b<\/h4><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-35d53d7be2491954ac97ecc375137ffb\">\n#top .hr.hr-invisible.av-av_hr-35d53d7be2491954ac97ecc375137ffb{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-av_hr-35d53d7be2491954ac97ecc375137ffb hr-invisible  avia-builder-el-30  el_after_av_heading  el_before_av_animated_numbers  '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class=\"avia-animated-number av-av_animated_numbers-132953e936933a357be2a88c5c1fc060 av-force-default-color avia_animate_when_visible  avia-builder-el-31  el_after_av_hr  avia-builder-el-last  \" data-timer=\"3000\"><strong class=\"heading avia-animated-number-title\"><span class=\"avia-single-number __av-single-number\" data-number_format=\"\" data-number=\"88\" data-start_from=\"0\">88<\/span><\/strong><div class=\"avia-animated-number-content\"><\/div><\/div><\/p><\/div><div class='av-flex-placeholder'><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_one_half-a9999d5109ba2680a0272de90d970905\">\n.flex_column.av-av_one_half-a9999d5109ba2680a0272de90d970905{\npadding:30px 30px 30px 30px;\nbackground-color:#ffffff;\n}\n<\/style>\n<div class='flex_column av-av_one_half-a9999d5109ba2680a0272de90d970905 av_one_half  avia-builder-el-32  el_after_av_one_half  avia-builder-el-last  flex_column_table_cell av-equal-height-column av-align-top column-top-margin'   ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_heading-6838ebb1c6221e999fde95fe03c0593e\">\n#top .av-special-heading.av-av_heading-6838ebb1c6221e999fde95fe03c0593e{\npadding-bottom:0px;\n}\n<\/style>\n<div  class='av-special-heading av-av_heading-6838ebb1c6221e999fde95fe03c0593e av-special-heading-h4 blockquote modern-quote modern-centered  avia-builder-el-33  el_before_av_hr  avia-builder-el-first  '><h4 class='av-special-heading-tag '  itemprop=\"headline\"  >\u53d7\u9080\u6280\u8853\u5831\u544a<\/h4><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-35d53d7be2491954ac97ecc375137ffb\">\n#top .hr.hr-invisible.av-av_hr-35d53d7be2491954ac97ecc375137ffb{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-av_hr-35d53d7be2491954ac97ecc375137ffb hr-invisible  avia-builder-el-34  el_after_av_heading  el_before_av_animated_numbers  '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class=\"avia-animated-number av-av_animated_numbers-0563ea7a2567aa8e43321c9d683c5315 av-force-default-color avia_animate_when_visible  avia-builder-el-35  el_after_av_hr  avia-builder-el-last  \" data-timer=\"3000\"><strong class=\"heading avia-animated-number-title\"><span class=\"avia-single-number __av-single-number\" data-number_format=\"\" data-number=\"7\" data-start_from=\"0\">7<\/span><\/strong><div class=\"avia-animated-number-content\"><\/div><\/div><\/p><\/div><\/div><!--close column table wrapper. Autoclose: 1 -->\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='after_section_2'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3224'><div class='entry-content-wrapper clearfix'>\n<section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li>Pin-Syuan He, Hung-Ying Chen, Yun-Wei Chiang, Cheng-Chieh Kao, Bo-Cheng Huang, Guanyu Song, Pengyi Zhang, Wei-Lan Chiu, Mu-Ping Hsu, <strong>Kuan-Neng Chen<\/strong>, Chang-ChunLee, Yu-Lan Liu, Kuang-Yu Chen, and Chih Chen, \u201cMechanismsof room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN\/nanocrystalline-nanotwinned Cu hybridjoints\u201d, <em>Applied Surface Science<\/em>, 736, 166787,Apr. 2026. DOI:10.1016\/j.apsusc.2026.166787<\/li>\n<li>Nam Phuong Nguyena, Nhi Y. T. Khonga, Chia-Huan Liu, Liang-Yin Kuo, Tran Van Mana, <strong>Kuan-Neng Chen<\/strong>, and Nguyet N. T. Pham, \u201cTuning interlayer water content for optimized stability andmechanistic insights in bilayered V2O5\u2219nH2O cathode material for Zinc (Magnesium)-ion batteries: ADFT and AIMD study,\u201d <em>Applied Surface Science Advance<\/em>, 32,100948,Feb. 2026. DOI:10.1016\/j.apsadv.2026.100948<\/li>\n<li>Mu-Ping Hsu, Tai-Yu Lin, Hua-Jing Huang, Chiao-Yen Wang, Tsai-Fu Chung, Wen-Wei Wu, and <strong>Kuan-Neng Chen<\/strong>, \u201cThermal Stability Enhancement of Low Temperature Cu-Cu Bonding Using Metal Passivation Technology for Advanced Electronic Packaging,\u201d<em> Communications Engineering<\/em>,\u00a04(1), p. 216, Dec. 2025. DOI: 10.1038\/s44172-025-00551-x.<\/li>\n<li>Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Ching-Iang Li, Yung-Sheng Chang, Ming-Ji Dai, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, and <strong>Kuan-Neng Chen<\/strong>, Po-Tsang Huang, \u201cMiniaturized and Cost-Effective Programmable 2.5D\/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset,\u201d IEEE Journal on Emerging and Selected Topics in Circuits and Systems, 15(3), pp. 379-391, Sep. 2025. DOI: 10.1109\/JETCAS.2025.3594169<\/li>\n<li>Yu-Lun Liu, Chao-Kai Hsu, Zhi-Cheng Xiao, Chun-Ta Li, Jia-Rui Lin, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Transfer Bonding Technology for Advanced 2.5D Integration with Reduced Warpage and Improved Stacking Flexibility,\u201d IEEE Electron Devices Letters, 46(9), pp. 1069-1071, Sep. 2025. DOI: 10.1109\/LED.2025.3587748<\/li>\n<li>Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAchieving LowTemperature Cu-Cu Bonding Platform via Area-Selective Metal Films with Superior Surface Roughness for Advanced Packaging,\u201d Journal of Materials Research and Technology, 36(5), pp. 7748-7754, May 2025. DOI: 10.1016\/j.jmrt.2025.05.041<\/li>\n<li>Yu-Lun Liu, Tzu-Yu Chen, Kazuaki Ebisawa, Makiko Irie, Ya-Chien Chuang, Hsiao-Wei Yeh, Satoshi Fujimura, and <strong>Kuan-Neng Chen<\/strong>, \u201c10-second Cu\/Polymer Hybrid Bonding Using Areaselective Metal Passivation for 3D Integration,\u201d IEEE Electron Devices Letters, 46(5), pp. 833-836, May 2025. DOI: 10.1109\/LED.2025.3554768<\/li>\n<li>Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, and <strong>Kuan-Neng Chen<\/strong>, \u201cRoom Temperature Polymer-based Hybrid Bonding Scheme for 3D Integration and Advanced Packaging,\u201d IEEE Electron Devices Letters, 46(5), pp. 829-832, May 2025. DOI: 10.1109\/LED.2025.3545557<\/li>\n<li>Yu-Ming Pan, Huan-Yu Chiu, Nien-Chih Lin, Hao-Tung Chung, Chiao-Yen Wang, Ching-Lin Chen, Bo-Jheng Shih, Chih-Chao Yang, Po-Tsang Huang, Chang-Hong Shen, Po-Jung Sung, WenFa Wu, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cContinuous Single-Crystal Germanium Films Using Elevated-Laser-Liquid-Phase-Epitaxy Technique for Monolithic 3D Integration,\u201d Japanese Journal of Applied Physics, 64, 04SP56, Apr. 2025. DOI: 10.35848\/1347-4065\/adc9b8<\/li>\n<li>Shie-Ping Chang, Zih-I Chuang, Yun-Jung Wu, E-Ming Ho, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-temperature Photo Imageable Dielectric for Redistribution Layers in Advanced<br \/>\nPackaging Application\u201d, Materials Science in Semiconductor Processing, 186, 109083, Feb. 2025. DOI: 10.1016\/j.mssp.2024.109083<\/li>\n<li>Bo-Jheng Shih, Zih-Yang Chen, Shie-Ping Chang, Ting-Yu Chen, Po-Jung Sung, Nien-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Huang-Chung Cheng, Ming-Yang Li, Iuliana P. Radu, and <strong>Kuan-Neng Chen<\/strong>, \u201cSurface Characteristics Optimization during Wafer-Level Backside Silicon Removal for SOI Wafers in 3D Integration\u201d, Applied Surface Science, 688, 162366, Jan. 2025.<\/li>\n<li>Wen-Tzu Tsai, Mu-Ping Hsu, Yi-Hsuan Chen, Yu-Lun Liu, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Hybrid Bonding Using Area-selective Passivation Layer Deposition Technology on Various Substrates for Heterogeneous Integrated Structure\u201d, Japanese Journal of Applied Physics, 63, 12SP06, Dec. 2024. DOI: 10.35848\/1347-4065\/ad9481<\/li>\n<li>Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, HuangChung Cheng, Chang-Hong Shen, Wen-Fa Wu, Tuo-Hung Hou, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cElevated-Epi Technique for 3D IC with Stacked FinFETs, Inter-Level Metal, and 25x33mm\u00b2 Single-Crystalline Silicon on SiO\u2082,\u201d To be published in IEEE Transactions on Electron Devices.<\/li>\n<li><em><strong>[Invited Paper]<\/strong><\/em> Yu-Lun Liu, Chien-Kang Hsiung, Tzu-Han Sun, Chun-Ta Li, Yuan-Chiu Huang, Yu-Tao Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cThe HRDL Interposer Technology Using Metal\/Polymer Hybrid Bonding and Its Characteristics,\u201d IEEE Transactions on Materials for Electron Devices,1(1), pp. 15-22, Dec. 2024. DOI: 10.1109\/TMAT.2024.3417888<\/li>\n<li>Mu-Ping Hsu, Chih-Han Chen, Zhong-Jie Hong, Tai-Yu Lin, Ying-Chan Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cEnhancement of Low Temperature Cu-to-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere,\u201d IEEE Electron Devices Letters, 45(8), pp. 1500-1503, Aug. 2024. DOI: 10.1109\/LED.2024.3416180<\/li>\n<li>Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Wen-Fa Wu, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cAdvancements in Single-Crystal Silicon with Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) for Monolithic 3D ICs\u201d,\u00a0 Japanese Journal of Applied Physics, 63(4), 04SP30, Apr. 2024. DOI: 10.35848\/1347-4065\/ad2fdc<\/li>\n<li>Mu-Ping Hsu, Wen-Tsu Tsai, Chi-Yu Chen, Tzu-Ying Kuo, Ou-Hsiang Lee, Hsiang-Hung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-Temperature Area-Selective Metal Passivation Bonding Platform for Heterogeneous Integration,\u201d IEEE Electron Devices Letters, 45(7), pp. 1273-1276, Jul. 2024. DOI: 10.1109\/LED.2024.301222<\/li>\n<li><em><strong>[Invited Paper]<\/strong><\/em> Chien-Kang Hsiung, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Review on Hybrid Bonding Interconnection and Its Characterization\u201d, IEEE Nanotechnology Magazine, 18(2), pp.41-50, Apr. 2024. DOI: 10.1109\/MNANO.2024.3358714<\/li>\n<li>Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Yu-Tao Yang, Tzu-Heng Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications\u201d, IEEE Electron Devices Letters, 45(3), pp.452-455, Mar. 2024. DOI:10.1109\/LED.2024.3352252<\/li>\n<li>Yuan-Chiu Huang, Han-Wen Hu, Yun-Hsi Liu, Hui-Ching Hsieh, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Photosensitive Polyimide with Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications\u201d, IEEE Journal of the Electron Devices Society, 12, pp. 96-103, Jan. 2024. DOI: 10.1109\/JEDS.2024.3358830<\/li>\n<li>Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, Zhong-Jie Hong, Ming-Wei Weng, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Low-Temperature Bonding Platform Using Ultra-Thin Area Selective Deposition for Heterogeneous Integration\u201d, Applied Surface Science, 635, 157645, Oct. 2023.<\/li>\n<li><em><strong>[Invited Paper]<\/strong><\/em> Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cCu-Based Thermocompression Bonding and Cu\/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application,\u201d Nanomaterials, 13(17), 2490, Sep. 2023. DOI: 10.3390\/nano13172490<\/li>\n<li>Tzu-Heng Hung, Ping-Jung Liu, Chiao-Yen Wang, Tsai-Fu Chung, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-deposited Cu3N\u201d, IEEE Journal of the Electron Devices Society, 11, pp.473-479, Sep. 2023. DOI:10.1109\/JEDS.2023.3308368<\/li>\n<li>Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, and <strong>Kuan-Neng Chen<\/strong>, \u201cNegative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu\/Polymer Hybrid Bonding\u201d, IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(8), pp.1316-1323, Aug. 2023. DOI:10.1109\/TCPMT.2022.3301005<\/li>\n<li>Tzu-Heng Hung, James Yi-Jen Lo, Tzu-Ying Kuo, Shing-Yih Shih, Sheng-Fu Huang, Yen-Ling Lin, Hsih-Yang Chiu, Wei-Zhong Li, Han-Wen Hu, Hsiang-Hung Chang, Chiang-Lin Shih, Jeff J.P. Lin, and <strong>Kuan-Neng Chen<\/strong>, \u201cTSV Integration with Chip Level TSV-to-Pad Cu\/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking\u201d, IEEE Electron Devices Letters, 44(7), pp. 1176-1179, Jul. 2023. DOI: 10.1109\/LED.2023.3279828<\/li>\n<li>Hao-Tung Chung, Yu-Ming Pan, Nein-Chih Lin, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, Po-Tsang Huang, Huang-Chung Cheng, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cSingle-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique for Monolithic 3D ICs\u201d,\u00a0 IEEE Electron Devices Letters, 44(7), pp. 1036-1039, Jul. 2023. DOI:10.1109\/LED.2023.3275181<\/li>\n<li>Tzu-Heng Hung, Yu-Ming Pan, and <strong>Kuan-Neng Chen<\/strong>, \u201cStress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications\u201d, Memories &#8211; Materials, Devices, Circuits and Systems, 4, 100024, Jul. 2023.<\/li>\n<li>Hao-Tung Chung, Yu-Ming Pan, Nein-Chih Lin, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, Huang-Chung Cheng, and <strong>Kuan-Neng Chen<\/strong>, \u201cHigh-Performance P-Type Germanium Tri-Gate FETs via Green Nanosecond Laser Crystallization and Counter Doping for Monolithic 3-DICs\u201d, IEEE Journal of the Electron Devices Society, 11, pp. 262-268, Apr. 2023. DOI:10.1109\/JEDS.2023.3270634<\/li>\n<li>Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen, Mu-Ping Hsu, Han-Wen Hu, Tai-Yu Lin, Ying-Chan Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cScheme for Multi-Chiplet Integration with Low Thermal Budget by Asymmetric Cu-Cu Bonding with Au Passivation Bonding Structure\u201d, IEEE Electron Devices Letters, 44(3), pp. 492-495, Mar. 2023. DOI: 10.1109\/LED.2023.32390112<\/li>\n<li>Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Chien-Kang Hsiung, Chih-I Cho, Chih-Han Chen, Ming-Wei Weng, Jui-Han Liu, Mu-Ping Hsu, Ying-Chan Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cLowtemperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration\u201d, Applied Surface Science, 610, 155470, Feb. 2023.<\/li>\n<li>Yu-Ting Huang, Yi-Chieh Tsai, Yi-Cheng Huang, Han-Wen Hu, and<strong> Kuan-Neng Chen<\/strong>, \u201cUltra-Thin Glass-based Wafer-level Integration for Miniaturized Hermetic MEMS Application\u201d, IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(1), pp. 120-126, Jan.2023.<\/li>\n<li>Han-Wen Hu, Yu-Wei Huang, Yi-Chieh Tsai, Meng-Kai Shih and <strong>Kuan-Neng Chen<\/strong>, &#8220;Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost,&#8221; in\u00a0<em>IEEE Journal of the Electron Devices Society<\/em>, Sep 2022.<\/li>\n<li>Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Chih-I Cho, Ming-Wei Weng, Jui-Han Liu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Bonding Mechanism for Low-Temperature Cu-Cu Bonding with Passivation Layer\u201d, <em>Applied Surface Science<\/em>, 592, 153243, Aug. 2022.<\/li>\n<li>Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, and <strong>Kuan-Neng Chen<\/strong>, \u201cStudy of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-first and Die-first Fan-Out Wafer-Level Packaging (FOWLP)\u201d, To be published in <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>.<\/li>\n<li>Leh-Ping Chang, Jian-Jie Wang, Tzu-Heng Hung, <strong>Kuan-Neng Chen<\/strong>, and Fan-Yi Ouyang, \u201cDirect metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration\u201d, <em>Applied Surface Science<\/em>, 576, 151845, Feb 2022.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Han-Wen Hu, and <strong>Kaun-Neng Chen<\/strong>, \u201cDevelopment of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)\u201d, <em>Microelectronics Reliability<\/em>, 127, 114412, Nov. 2021.<\/li>\n<li>Yi-Chieh Tsai, Yi-Cheng Huang, Yu-Ting Huang, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Metal Interconnect for Wafer-level and Sealable Miniaturized MEMS Encapsulation\u201d, <em>IEEE Transactions on Electron Devices<\/em>, 68(11), pp. 5779-5783, Nov. 2021. DOI: 10.1109\/TED.2021.3113628<\/li>\n<li>Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cDemonstration of Low-Temperature Fine-Pitch Cu\/SiO<sub>2<\/sub> Hybrid Bonding by Au Passivation\u201d, <em>IEEE Journal of Electron Devices Society<\/em>, 9, pp. 868-875, Oct. 2021. DOI:10.1109\/JEDS.2021.3114648<\/li>\n<li>Demin Liu, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-Temperature (70\u00b0C) Cu-to-Cu Direct Bonding by Capping Metal Layers\u201d, <em>IEEE Electron Devices Letters,<\/em> 42(10), pp. 1524-1527, Oct. 2021. DOI: 10.1109\/LED.2021.3105434<\/li>\n<li>Yu-Wei Liu, Han-Wen Hu, Ping-Yi Hsieh, Hao-Tung Chung, Shu-Jui Chang, Jui-Han Liu, Po-Tsang Huang, Chih-Chao Yang, Chang-Hong Shen, Jia-Min Shieh, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cSingle-crystal islands (SCI) for monolithic 3D and back-end-of-line FinFET circuits\u201d, <em>IEEE Transactions on Electron Devices<\/em>, 68(10), pp. 5257-5262, Oct. 2021.<\/li>\n<li>Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Hao-Tung Chung, Wei-Shuo Li, Chun-Yu Liao, Pin-Guang Chen, <strong>Kuan-Neng Chen<\/strong>, Min-Hung Lee, and Huang-Chung Cheng, \u201cAtomic Layer Deposition Plasma-Based Undoped-HfO<sub>2<\/sub> Ferroelectric FETs for Non-Volatile Memory\u201d, <em>IEEE Electron Devices Letters<\/em>, 42(8), pp. 1152-1155, Aug. 2021.<\/li>\n<li>Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via\u201d, <em>IEEE Transactions on Electron Devices, <\/em>68(7), pp. 3520-3525, Jul. 2021. DOI: 10.1109\/TED.2021.3082497<\/li>\n<li>Demin Liu, Tsung-Yi Kuo, Yu-Wei Liu, Zhong-Jie Hong, Ying-Ting Chung, Tzu-Chieh Chou, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Cu-Cu Direct Bonding with Pt Passivation layer in 3D Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology,<\/em> 11(4), pp. 573-578, Apr. 2021.<\/li>\n<li>Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Yun-Tien Yeh, Hao-Tung Chung, Yi-Shao Li, Kai-Chi Chuang, Wei-Shuo Li, Chun-Yu Liao, Pin-Guang Chen, <strong>Kuan-Neng Chen<\/strong>, and Huang-Chung Cheng, \u201cFerroelectric Undoped HfOx Capacitor with Symmetric Synaptic for Neural Network Accelerator\u201d, <em>IEEE Transactions on Electron Devices<\/em>, 68(3), pp. 1374-1377, Mar. 2021.<\/li>\n<li>Hao-Tung Chung, Chun-Ting Chen, Yi-Shao Li, Yu-Wei Liu, Chan-Yu Liao, Wen-Hsien Huang, Jia-Min Shieh, Jun-Dao Luo, Wei-Shuo Li, Kai-Chi Chuang, <strong>Kuan-Neng Chen<\/strong>, and Huang-Chung Cheng, \u201cEffect of Crystallinity on the Electrical Characteristics of Poly-Si Tunneling FETs via Green Nanosecond Laser Crystallization\u201d, <em>IEEE Electron Devices Letters<\/em>, 42(2), pp. 164-167, Feb. 2021.<\/li>\n<li>Tzu-Chieh Chou, Shin-Yi Huang, Pin-Jun Chen, Han-Wen Hu, Demin Liu, Chih-Wei Chang, Tzu-Hsuan Ni, Chao-Jung Chen, Yu-Min Lin, Tao-Chih Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical and Reliability Investigation of Cu-to-Cu Bonding with Silver Passivation Layer in 3D Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 11(1), pp. 36-42, Jan. 2021.<\/li>\n<li>Tzu-Chieh Chou, Kai-Ming Yang, Jian-Chen Li, Ting-Yang Yu, Yu-Tao Yang, Han-Wen Hu, Yu-Wei Liu, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D\/2.5D Heterogeneous Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 10(8), pp. 1296-1303, Aug. 2020.<\/li>\n<li>Yi-Chieh Tsai, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar with Passivation\u201d, <em>IEEE Electron Devices Letters<\/em>, 41(8), pp. 1229-1232, Aug. 2020. DOI: 10.1109\/LED.2020.3001163<\/li>\n<li>Yi-Lun Yang, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and <strong>Kuan-Neng Chen<\/strong>, \u201cEvaluation of Metal\/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 10(6), pp. 956-962, Jun. 2020.<\/li>\n<li>Cheng-Hsien Lu, Yi-Lun Yang, Chiao-Pei Chen, Bin-Ling Tsai, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer\/Metal Hybrid Bonding\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology, <\/em>10(1), pp. 168-175, Jan. 2020.<\/li>\n<li>Cheng-Hsien Lu, Shu-Yan Jhu, Chiao-Pei Chen, Bin-Ling Tsai, and <strong>Kuan-Neng Chen<\/strong>, \u201cAsymmetric Wafer-Level Polyimide and Cu\/Sn Hybrid Bonding for 3-D Heterogeneous Integration,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em><em>, <\/em>66(7), pp. 3073-3079, Jul. 2019. DOI: 10.1109\/TED.2019.2915332<\/li>\n<li>Cheng-Hsien Lu, Yi-Tung Kho, Chiao-Pei Chen, Bin-Ling Tsai, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdhesion and Material Properties between Polyimide and Passivation Layers for Polymer\/Metal Hybrid Bonding in 3D Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology, <\/em>9(3), pp. 412-418, Mar. 2019.<\/li>\n<li>Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Chia-Hsin Lee, Shin-Yi Huang, Hsiang-Hung Chang, Tao-Chih Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cWarpage Characteristics and Process Development of TSV-less Interconnection Technology\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 18(8), pp. 5558-5565, Aug. 2018.<\/li>\n<li>Ting-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAsymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-thin Buffer Layer\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 18(8), pp. 5397-5403, Aug. 2018.<\/li>\n<li>Ya-Sheng Tang, Hsiu-Chi Chen, Yi-Tung Kho, Yu-Sheng Hsieh, Yao-Jen Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation and Optimization of Ultrathin Buffer Layers Used in Cu\/Sn Eutectic Bonding\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 8(7), pp. 1225-1230, Jul. 2018.<\/li>\n<li>Wen-Wei Shen, Yu-Min Lin, Shang-Chun Chen, Hsiang-Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chien-Chung Lin, Yung-Fa Chou, Ding-Ming Kwai, Ming-Jer Kao, and <strong>Kuan-Neng Chen<\/strong>, \u201c3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)\u201d, <em>IEEE Journal of the Electron Devices Society<\/em>, 6, pp. 396-402, Mar. 2018.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Asisa Kumar Panigrahy and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review\u201d, <em>Journal of Electronic Packaging<\/em>, 140(1), pp. 010801-1-010801-11, Mar. 2018.<\/li>\n<li>Yen-Hui Hsieh, Yen-Jun Huang, Jian-Yu Shih, Jih-Perng Leu, and <strong>Kuan-Neng Chen<\/strong>, \u201cExploring the correspondence between chemical states and adhesion property for Cr, Co metal \/AZ 4620, BCB polymer interface\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 8(2), pp. 195-201, Feb. 2018.<\/li>\n<li>Wen-Wei Shen, Hsiao-Chun Chang, Yu-Tao Yang, Yu-Chen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cUneven-Topography-Chip Packing Approach Using Double Self-Assembly Technology for 3-D Heterogeneous Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 8(2), pp. 310-316, Feb. 2018.<\/li>\n<li>Shih-Wei Lee, Shu-Chiao Kuo, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Method of Electrical Measurement for Stacking Error in 3D\/2.5D Integration\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 18(2), pp. 1066-1069, Feb. 2018<em>.<\/em><\/li>\n<li>Ting-Yang Yu, Nai-Chen Chi, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and <strong>Kuan-Neng Chen<\/strong>, \u201cRobust Terahertz Polarizers with High Transmittance at Selected Frequencies through Si Wafer Bonding Technologies\u201d, <em>Optics Letters<\/em>, 42(23), pp. 4917-4920, Dec. 2017.<\/li>\n<li><strong><em>[Invited Paper] <\/em><\/strong>Wen-Wei Shen, and <strong>Kuan-Neng Chen<\/strong>, \u201cThree-Dimensional Integrated Circuits (3D IC) Key Technology: Through-Silicon-Via (TSV),\u201d <em>Nanoscale Research Letters<\/em>, 12, pp. 56-64, Dec. 2017.<\/li>\n<li>Yan-Pin Huang, Shu-Lin Lu, Yu-Shiang Huang, Yi-Hsiu Tseng, Min-Fong Shu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Cu\/In Thermosonic Bonding\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 17(12), pp. 8890-8893, Dec. 2017<em>.<\/em><\/li>\n<li>Ya-Sheng Tang, Jaber Derakhshandeh, Yi-Tung Kho, Yao-Jen Chang, John Slabbekoorn, Inge De Preter, Kris Vanstreels, Kenneth June Rebibis, Eric Beyne, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Co Thin-Film as Buffer Layer Applied to Cu\/Sn Eutectic Bonding and UBM with Sn, SnCu and SAC Solders Joints\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 7(11), pp. 1899-1905, Nov. 2017.<\/li>\n<li>Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, <strong>Kuan-Neng Chen<\/strong>, Ching-Te Chuang, and Jin-Chern Chiou, \u201cUltra-High-Density 256-channel Neural Sensing Microsystem using TSV-embedded Neural Probes,\u201d <em>IEEE Transactions\u200b on Biomedical Circuits and Systems<\/em><em>, <\/em>11(5), pp. 1013-1025, Oct. 2017.<\/li>\n<li>Yu-Tao Yang, Tzu-Chieh Chou, Ting-Yang Yu, Yu-Wei Chang, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3D Heterogeneous Integration\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 7(9), pp. 1560-1566, Sep. 2017.<\/li>\n<li>Shih-Wei Lee, Jian-Yu Shih, Kuo-Hua Chen, Chi-Tsung Chiu, and <strong>Kuan-Neng Chen<\/strong>, \u201cPolymer-Based Liner TSV Fabrication Scheme and Its Resistance Variation\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 17(7), pp. 4712-4715, Jul. 2017.<\/li>\n<li>Yu-Chen Hu, Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Hsiao-Chun Chang, Yu-Tao Yang, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Ching-Te Chuang, Jin-Chern Chiou, and <strong>Kuan-Neng Chen,<\/strong> \u201cAn Advanced 2.5D Heterogeneous Integration Packaging for High Density Neural Sensing Microsystem,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em>, 64(4), pp. 1666-1673, Apr. 2017.<\/li>\n<li>Shih-Wei Lee, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Bump-less Stacking with Bottom-up TSV Fabrication,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em>, 64(4), pp. 1660-1665, Apr. 2017.<\/li>\n<li>Chuan-An Cheng, Tsung-Yen Tsai, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cCharacterization of Temporary Bonding and Laser Release Using a Polyimide and 300-nm Photolysis Polymer System for High-Throughput 3D IC Applications\u201d, <em>IEEE Transactions on Components, Packaging and Manufacturing Technology<\/em>, 7(3), pp. 456-462, Mar. 2017.<\/li>\n<li>Chuan-An Cheng, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cFeasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3D Integration and FOWLP Scheme\u201d, <em>IEEE Journal of the Electron Devices Society<\/em>, 5(2), pp. 136-140, Mar. 2017.<\/li>\n<li>Shih-Wei Lee, Geng-Ming Chang, Ching-Yun Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Sealing Redistribution Layer Approach for Through-Glass Via Fabrication\u201d, <em>IEEE Journal of the Electron Devices Society<\/em>, 5(2), pp. 132-135, Mar. 2017.<\/li>\n<li>Shih-Wei Lee, Ching-Yun Chang, Geng-Ming Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cFine-Feature Cu\/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology\u201d, <em>IEEE Journal of the Electron Devices Society<\/em>, 5(2), pp. 128-131, Mar. 2017.<\/li>\n<li>Yu-Chen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration,\u201d <em>IEEE Journal of the Electron Devices Society<\/em>, 4(4), pp. 185-188, Jul. 2016.<\/li>\n<li>Yen-Jun Huang, Yen-Hui Hsieh, Jian-Yu Shih, Han-Chun Chen, Jihperng Leu, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric,\u201d <em>Journal of Nanoscience and Nanotechnology<\/em>, 16(7), 7546-7550, Jul. 2016.<\/li>\n<li>Yu-Chen Hu, Chun-Pin Lin, Yao-Jen Chang, Nien-Shyang Chang, Ming-Hwa Sheu,\u00a0Chi-Shi Chen, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Flexible 3-D Heterogeneous Integration Scheme Using Electro-less Plating on Chips with Advanced Technology Node,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em>, 62(12), 4148-4153, Dec. 2015.<\/li>\n<li>Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, and <strong>Kuan-Neng Chen<\/strong>, \u201cDemonstration and Electrical Performance of Cu\u2013Cu Bonding at 150 \u00b0C With Pd Passivation,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em>, 62(8), pp. 2587-2592, Aug. 2015.<\/li>\n<li>Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Yu-Sheng Hsieh, and <strong>Kuan-Neng Chen,<\/strong> \u201cModeling and Characterization of TSV Capacitor and Stable Low Capacitance Implementation for Wide-I\/O Application\u201d, <em>IEEE Transactions on Device and Materials Reliability<\/em>, 15(2), pp. 129-135, Jun. 2015.<\/li>\n<li>Chien-Min Liu, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, <strong>Kuan-Neng Chen<\/strong>, and King-Ning Tu, \u201cLow-temperature Direct Copper-to-Copper Bonding Enabled by Creep on (111) Surfaces of Nanotwinned Cu\u201d, <em>Scientific Reports<\/em>, 5, 9734, May 2015.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Chih Chen, Doug Yu, and <strong>Kuan-Neng Chen<\/strong>, \u201cVertical Interconnects of Microbumps in 3D Integration\u201d, <em>MRS Bulletin<\/em>, 40(3), pp. 257-263, Mar. 2015.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and King-Ning Tu, \u201cMaterials Challenges in Three-Dimensional Integrated Circuits\u201d, <em>MRS Bulletin<\/em>, 40(3), pp. 219-222, Mar. 2015.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevice Characteristics of TSV-Based Piezoelectric Resonator with Load Capacitance and Static Capacitance Modification,\u201d <em>IEEE Transactions\u200b on Electron Devices<\/em>, 62(3), pp. 927-933, Mar. 2015.<\/li>\n<li>Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, <strong>Kuan-Neng Chen<\/strong>, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Jin-Chern Chiou, \u201cA Double-Sided, Single-Chip Integration Scheme Using Through-Silicon-Via for Neural Sensing Applications,\u201d <em>Biomedical Microdevices<\/em>, 17(1), 11, Feb. 2015.<\/li>\n<li>Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, <strong>Kuan-Neng Chen<\/strong>, Jin-Chern Chiou, Wei Hwang, and Ho-Ming Tong, \u201c2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications,\u201d <em>IEEE Transactio\u200bns on Biomedical Circuits and Systems<\/em>, 8(6), pp. 810-823, Dec. 2014.<\/li>\n<li>Yao-Jen Chang, Yu-Sheng Hsieh, and <strong>Kuan-Neng Chen<\/strong>, \u201cSubmicron Cu\/Sn Bonding Technology with Transient Ni Diffusion Buffer Layer for 3DIC Application\u201d, <em>IEEE Electron Device Letters<\/em>, 35(11), pp. 118-120, Nov. 2014.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang and <strong>Kuan-Neng Chen<\/strong>, \u201cQuartz Resonator Assembling with TSV Interposer Using Polymer Sealing or Metal Bonding,\u201d Nanoscale Research Letters, 9, pp. 541-548, Oct. 2014.<\/li>\n<li>Jian-Yu Shih, Wen-Chun Huang, Cheng-Ta Ko, Zheng Yang, Sheng-Hsiang Hu, Jih-Perng Leu, Keng C. Chou, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdhesion Investigation between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications,\u201d <em>IEEE Transactions on Device and Materials Reliability<\/em>, 14(3), pp. 914-920, Sep. 2014.<\/li>\n<li>Wan-Lin Tsai, Kuang-Yu Wang, Yao-Jen Chang, Yu-Ren Li, Po-Yu Yang, <strong>Kuan-Neng Chen<\/strong>, and Huang-Chung Cheng, \u201cConductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method,\u201d Nanoscale Research Letters, 9, pp. 451-456, Aug. 2014.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, and <strong>Kuan-Neng Chen<\/strong>, \u201cMotional Resistance Issue of TSV-Based Resonator Device and Its Improvement with a Concave Cu TSV Structural Design,\u201d <em>IEEE Electron Device Letters<\/em>, 35(8), pp. 865-867, Aug. 2014.<\/li>\n<li>Cheng-Ta Ko, Zhi-Cheng Hsiao, Hsiang-Hung Chang, Dian-Rong Lyu, Chao-Kai Hsu, Huan-Chun Fu, Chun-Hsien Chien, Wei-Chung Lo, and <strong>Kuan-Neng Chen<\/strong>, \u201cA novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices,\u201d <em>IEEE Transactions on Device and Materials Reliability,<\/em> 14(2), pp. 715-720, Jun. 2014.<\/li>\n<li>Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, <strong>Kuan-Neng Chen<\/strong>, and K. N. Tu, \u201cLow-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces,\u201d <em>Scripta Materialia<\/em>, 78-79, pp. 65-68, May 2014.<\/li>\n<li>Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-Temperature Bonded Cu\/In Interconnect with High Thermal Stability for 3-D Integration,\u201d <em>IEEE Transactions on Electron Devices<\/em>, 61(4), pp. 1131-1136, Apr. 2014.<\/li>\n<li>Li-Min Kuo, Yi-Chia Chou, <strong>Kuan-Neng Chen<\/strong>, Chien-Chia Lu, and Shuchi Chao, \u201cA precise pH microsensor using RF-sputtering IrO<sub>2<\/sub> and Ta<sub>2<\/sub>O<sub>5<\/sub> films on Pt-electrode,\u201d <em>Sensors and Actuators B: Chemical<\/em>, 193, pp. 687-691, Mar. 2014.<\/li>\n<li>Lei-Chun Chou, Shih-Wei Lee, Po-Tsang Huang, Chih-Wei Chang, Cheng-Hao Chiang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cA TSV-Based Bio-Signal Package with \u03bc-probe Array,\u201d <em>IEEE Electron Device Letters<\/em>, 35(2), pp. 256-258, Feb. 2014.<\/li>\n<li>Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Ho-Ming Tong, and <strong>Kuan-Neng Chen,<\/strong> \u201cNovel Cu-to-Cu Bonding with Ti Passivation at 180C in 3D Integration\u201d, <em>IEEE Electron Device Letters<\/em>, 34(12), pp. 1551-1553, Dec. 2013.<\/li>\n<li>Hsiao-Yu Chen, Sheng-Yao Hsu, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical Performance and Reliability Investigation of Co-sputtered Cu\/Ti Bonded Interconnects\u201d, <em>IEEE Transactions on Electron Devices<\/em>, 60(10), pp. 3521-3526, Oct. 2013.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdvanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme with Hermetic Sealing\u201d, <em>IEEE Electron Device Letters<\/em>, 34(8), pp. 1041-1043, Aug. 2013.<\/li>\n<li>Cheng-Hao Chiang, Li-Min Kuo, Yu-Chen Hu, Wen-Chun Huang, Cheng-Ta Ko, and <strong>Kuan-Neng Chen<\/strong>, \u201cSealing Bump with Bottom-up Cu TSV Plating Fabrication in 3-D Integration Scheme\u201d, <em>IEEE Electron Device Letters<\/em>, 34(5), pp. 671-673, May 2013.<\/li>\n<li>Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Cheng-Hao Chiang, and <strong>Kuan-Neng Chen<\/strong>, \u201cBackside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu\/Sn and BCB Hybrid Bonding\u201d, <em>IEEE Electron Device Letters<\/em>, 34(3), pp. 435-437, Mar. 2013.<\/li>\n<li>Li-Min Kuo, <strong>Kuan-Neng Chen<\/strong>, Yi-Lin Chuang, and Shuchi Chao, \u201cFlexible pH-Sensing Structure using WO<sub>3<\/sub>\/IrO<sub>2<\/sub> Junction with Al<sub>2<\/sub>O<sub>3<\/sub> Encapsulation Layer\u201d, <em>ECS Solid-State Letters<\/em>, 2(3), pp. 28-30, 2013.<\/li>\n<li>Yao-Jen Chang, Cheng-Ta Ko, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical and Reliability Investigation of Cu TSVs with Low-Temperature Cu\/Sn and BCB Hybrid Bond Scheme\u201d, <em>IEEE Electron Device Letters<\/em>, 34(1), pp. 102-104, Jan. 2013.<\/li>\n<li>Yew Heng Tan, Kwang Sing Yew, Kwang Hong Lee, Yao-Jen Chang, <strong>Kuan-Neng Chen<\/strong>, Diing Shenp Ang, Eugene A. Fitzgerald, and Chuan Seng Tan \u201cAl<sub>2<\/sub>O<sub>3<\/sub> Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon\u201d, <em>IEEE Transactions on Electron Devices<\/em>, 60(1), pp. 56-62, Jan. 2013.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Cheng-Ta Ko, and <strong>Kuan-Neng Chen<\/strong>, \u201cReliability of Key Technologies in 3D Integration\u201d, <em>Microelectronics Reliability,<\/em> 53(1), pp. 7-16, Jan. 2013.<\/li>\n<li>Cheng-Hsien Lu, Chuan-An Cheng, Chia-Hua Ho, and <strong>Kuan-Neng Chen<\/strong>, \u201cEffects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device Characteristics\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 12, pp. 8050-8054, Oct. 2012.<\/li>\n<li>Sheng-Yao Hsu, Hsiao-Yu Chen, and <strong>Kuan-Neng Chen,<\/strong> \u201cCo-sputtered Cu\/Ti Bonded Interconnects with a Self-formed Adhesion Layer for 3D Integration Applications\u201d, <em>IEEE Electron Device Letters<\/em>, 33(7), pp. 1048-1050, July 2012.<\/li>\n<li>Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang, Peng-Shu Chen, Yu-Jiau Hwang, Huan-Chun Fu, Jui-Hsiung Huang, Chia-Wen Chiang, Shyh-Shyuan Sheu, Yu-Hua Chen, Wei-Chung Lo, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Wafer-level 3D Integration Scheme with Cu TSVs Based on Micro-bump\/Adhesive Hybrid Bonding for 3D Memory Application\u201d, <em>IEEE Transactions on Device and Materials Reliability<\/em>, 12(2), pp.209-216, June 2012.<\/li>\n<li>Y. Hsu, H. Y. Chen and <strong>K. N. Chen<\/strong>, \u201cDiffusion of Co-Sputtered Metals as Bonding Materials for 3D Interconnects during Thermal Treatments,\u201d <em>Journal of Nanoscience and Nanotechnology<\/em>, 12, pp.2467-2471, Mar 2012.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, and Wei-Chung Lo, \u201cAdhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration,\u201d <em>Journal of Nanoscience and Nanotechnology<\/em>, 12, pp.1821-1828, Mar 2012.<\/li>\n<li>L. Lin, W. C. Huang, C. T. Ko, and <strong>K. N. Chen<\/strong>, \u201cBCB-to-Oxide Bonding Technology for 3D Integration\u201d, <em>Microelectronics Reliability, <\/em>52, pp. 352-355, Feb 2012.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Ya-Sheng Tang, Yao-Jen Chang, and <strong>Kaun-Neng Chen<\/strong>, \u201cWafer-Level Cu-Cu Bonding Technology\u201d, <em>Microelectronics Reliability<\/em>, 52, pp. 312-320, Feb 2012.<\/li>\n<li><strong><em>[Invited Paper]<\/em><\/strong> Cheng-Ta Ko, and <strong>Kaun-Neng Chen<\/strong>, \u201cLow Temperature Bonding Technology for 3D Integration\u201d, <em>Microelectronics Reliability<\/em>, 52, pp. 302-311, Feb 2012.<\/li>\n<li>Ming-Fang Lai, Shih-Wei Li, Jian-Yu Shih, and <strong>Kuan-Neng Chen<\/strong>, \u201cWafer-Level Three-Dimensional Integrated Circuits (3D IC): Schemes and Key Technologies\u201d, <em>Microelectronic Engineering, <\/em>88, pp. 3282-3286, Nov 2011.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. A. Cheng, W. C. Huang and C. T. Ko, \u201cBonding Temperature Optimization and Property Evolution of SU-8 Material in Metal\/Adhesive Hybrid Wafer Bonding,\u201d <em>Journal of Nanoscience and Nanotechnology, <\/em>11, pp. 6969-6972, Aug 2011.<\/li>\n<li>Sang Hwui Lee, <strong>Kuan-Neng Chen<\/strong>, and Jian-Qiang Lu, \u201cWafer-to-wafer Alignment for 3D Integration: An Review\u201d, <em>IEEE Journal of Microelectromechanical Systems<\/em>. 20(4), pp. 885-898, Aug 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Zheng Xu, and Jiang-Qiang Lu, \u201cElectrical Performance and Alignment Investigation of Wafer-level Cu-oxide Hybrid Bonding,\u201d <em>IEEE Electron Device Letters,<\/em> 32(8), pp. 1119-1121, Aug 2011.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. M. Young, S. H. Lee, and J. -Q. Lu, \u201cElectrical Performances and Structural Designs of Copper Bonding in Wafer-Level Three-Dimensional Integration,\u201d <em>Journal of Nanoscience and Nanotechnology<\/em>, 11, pp. 5143-5147, June. 2011.<\/li>\n<li><strong><em>[Invited Paper] <\/em>Kuan-Neng Chen,<\/strong> and Chuan Seng Tan, \u201cIntegration Schemes and Enabling Technologies for Three-Dimensional Integrated Circuits (3D IC)\u201d, <em>IET Computers and Digital Techniques,<\/em> 5(3), pp. 160-168, May 2011.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. K. Tsang, W. W. Wu, S. H. Lee, and J. Q. Lu, \u201cFabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications\u201d, <em>Journal of Nanoscience and Nanotechnology<\/em>, 11, pp. 3336-3339, Apr. 2011.<\/li>\n<li>W. Wu, K. C. Lu, <strong>K. N. Chen<\/strong>, P. H. Yeh, C. W. Wang, Y. C. Lin, and Y. Huang \u201cControlled large strain of Si in the NiSi\/Si\/NiSi nanowire heterostructure\u201d, <em>Applied Physics Letters,<\/em> 97, pp 203110-1 \u2013 203110-3, Dec. 2010.<\/li>\n<li><strong>K. N. Chen, <\/strong>Y. Zhu, W.W. Wu, and R. Reif, \u201cInvestigation and Effects of Wafer Bow in 3D Integration Bonding Schemes\u201d, <em>Journal of Electronic Materials<\/em>. 39(12), pp. 2605-2610, Dec. 2010.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> and John C. Arnold, \u201cWafer-level Self-aligned Nano Tubular Structures and Templates for Device Applications\u201c, <em>Journal of Nanoscience and Nanotechnology, <\/em>10, pp. 8145-8150, Dec. 2010.<\/li>\n<li>W. Wu, C. W. Wang, <strong>K.N. Chen,<\/strong> S. L. Cheng, and S. W. Lee, \u201cEnhanced growth of low-resistivity titanium silicides on epitaxial Si<sub>0.7<\/sub>Ge<sub>0.3<\/sub>on (001)Si with a sacrificial amorphous Si interlayer\u201d, <em>Thin Solid Films, <\/em>518, pp. 7279-7282, Oct. 2010.<\/li>\n<li><strong><em>[Invited Paper] <\/em><\/strong>Cheng-Ta Ko and <strong>Kuan-Neng Chen<\/strong>, \u201cWafer Level Bonding\/Stacking Technology for 3D Integration\u201d, <em>Microelectronics Reliability<\/em>, 50 (4), pp. 481-488, April 2010.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> and Lia Krusin-Elbaum, \u201cThe fabrication of a programmable via using phase-change material in CMOS-compatible technology\u201c, <em>Nanotechnology<\/em>, 21 (13), 134001, April 2010.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. Cabral Jr. and L. Krusin-Elbaum, \u201cThermal stress effects of Ge<sub>2<\/sub>Sb<sub>2<\/sub>Te<sub>5<\/sub> phase change material: Irreversible modification with Ti adhesion layers and segregation of Te\u201d, <em>Microelectronic Engineering, <\/em>85, pp 2346-2349, Dec. 2008.<\/li>\n<li>J. Koester, A. M. Young, R. R. Yu, S. Purushothama, <strong>K. N. Chen<\/strong>, D. C. La Tulipe, N. Rana, L. Shi, Matt R. Wordeman, and E. J. Sprogis, \u201cWafer-Level 3D Integration Technology\u201d, <em>IBM Journal of Research and Development,<\/em> 52 (6), pp 583-597, Jul. 2008.<\/li>\n<li><strong>K. N. Chen<\/strong>, L. Krusin-Elbaum, D. Newns, B. Elmegreen, R. Cheek, N. Rana, A. Young, S. Koester, and C. Lam, \u201cProgrammable Via Using Indirectly Heated Phase-Change Switch for Reconfigurable Applications\u201d, <em>IEEE Electron Device Letters<\/em>, 29, pp 131-133, Jan. 2008.<\/li>\n<li>Krusin-Elbaum, C. Cabral Jr., <strong>K. N. Chen<\/strong>, M. Copel, D. W. Abraham, K. B. Reuter, S. M. Rossnagel, J. Bruley, and V. Deline, \u201cEvidence for segregation of Te in Ge2Sb2Te5 films: Effect on \u201cphase-change\u201d stress\u201d, <em>Applied Physics Letters<\/em>, 90, pp. 141902-1 \u2013 141902-3, April 2007.<\/li>\n<li><strong><em>[Selected Paper] <\/em><\/strong> Cabral Jr., <strong>K.N. Chen<\/strong>, L. Krusin-Elbaum, and V. Deline, \u201cIrreversible modification of Ge<sub>2<\/sub>Sb<sub>2<\/sub>Te<sub>5<\/sub> phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack\u201d,<em> Virtual Journal of Nanoscale Science &amp; Technology<\/em>, Feb 2007.<\/li>\n<li>Cabral Jr., <strong>K.N. Chen<\/strong>, L. Krusin-Elbaum, and V. Deline, \u201cIrreversible modification of Ge<sub>2<\/sub>Sb<sub>2<\/sub>Te<sub>5<\/sub> phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack\u201d, <em>Applied Physics Letters<\/em>, 90, pp. 051908-1 \u2013 051908-3, 2007.<\/li>\n<li><strong>K. N. Chen,<\/strong> S. M. Chang, L. C. Shen, and R. Reif, \u201cInvestigations of Strength of Copper Bonded Wafers with Several Quantitative and Qualitative Tests\u201d, <em>Journal of Electronic Materials<\/em>, 35(5), pp. 1082-1086, 2006.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan, and R. Reif, \u201cBonding Parameters of Blanket Copper Wafer Bonding\u201d, <em>Journal of Electronic Materials<\/em>, 35(2), pp 230-234, 2006.<\/li>\n<li><strong><em>[Invited Paper] <\/em>Kuan-Neng Chen,<\/strong> and R. Reif, \u201cReview Paper: <strong>Copper Wafer Bonding: Interface Analysis and Characterization,\u201d <\/strong><em>Journal of the Chinese Colloid and Interface Society<\/em>, 28(1), pp. 1-10, 2006.<\/li>\n<li>S. Tan, <strong>K. N. Chen<\/strong>, A. Fan, and R. Reif, \u201cThe effect of forming gas anneal on the oxygen content in bonded copper layer\u201d, <em>Journal of Electronic Materials, <\/em>34(12), pp 1598-1602, 2005.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. S. Tan, A. Fan, and R. Reif, \u201cCopper Bonded Layers Analysis and Effects of Copper Surface Conditions on Bonding Quality for Three-Dimensional Integration\u201d, <em>Journal of Electronic Materials, <\/em>34(12), pp 1464-1467, 2005.<\/li>\n<li><strong>K. N. Chen,<\/strong> S. M. Chang, L. C. Shen, C. S. Tan, A. Fan, and R. Reif, \u201cProcessing Development and Bonding Quality Investigations of Silicon Layer Stack Using Copper Wafer Bonding\u201d, <em>Applied Physics Letters<\/em>, 87(3), pp. 031909-1-031909-3, 2005.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan and R. Reif, \u201cAbnormal Contact Resistance Reduction of Bonded Copper Interconnects in 3-D Integration during Current Stressing\u201d, <em>Applied Physics Letters, <\/em>86(1), pp. 0011903-1-0011903-3, 2005.<\/li>\n<li>S. Tan, <strong>K. N. Chen<\/strong>, A. Fan, and R. Reif, \u201cLow temperature direct chemical-vapor-deposition (CVD) oxides to thermal oxide wafer bonding in silicon layer transfer\u201d, <em>Electrochemical and Solid-State Letters,<\/em> 8(1), pp. G1-G4, 2005<em>. <\/em><\/li>\n<li><strong>Kuan-Neng Chen, <\/strong>Mauro J. Kobrinsky, Brandon Barnett and Rafael Reif, \u201cComparisons of Conventional, 3D, Optical and RF Interconnect for Clock Distribution,\u201d <em>IEEE Trans. on Electron Devices, <\/em>51(2), pp 233-239, 2004.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan, and R. Reif, \u201cContact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology\u201d, <em>IEEE Electron Devices Letters, <\/em>25(1), pp 10-12, 2004.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. S. Tan, A. Fan and R. Reif, &#8220;Morphology and bond strength of copper wafer bonding&#8221;, <em>Electrochemical and Solid-State Letters,<\/em> 7(1), pp G14-G16, 2004.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan, and R. Reif, \u201cTemperature and Duration Effect on Microstructure Evolution during Copper Wafer Bonding\u201d, <em>Journal of Electronic Materials, <\/em>32(12), pp 1371-1374, 2003.<\/li>\n<li>S. Tan, A. Fan, <strong>K. N. Chen<\/strong>, and R. Reif, \u201cLow temperature thermal oxide to Plasma Enhanced Chemical Vapor Deposition oxide wafer bonding for thin film transfer application,\u201d <em>Applied Physics Letters,<\/em> 82(16), pp 2649-2651, 2003.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan and R. Reif, \u201cMicrostructure evolution and abnormal grain growth during copper wafer bonding,\u201d <em>Applied Physics Letters, <\/em>81(20), pp 3774-3776, 2002.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, and R. Reif, &#8220;Interfacial Morphologies and Possible Mechanisms of Copper Wafer Bonding,&#8221; <em>Journal of Materials Science, <\/em>37(16), pp 3441-3446, 2002.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Andy Fan, and Rafael Reif, &#8220;Microstructure Examination of Copper Wafer Bonding,&#8221; <em>Journal of Electronic Materials,<\/em> 30, pp 331-335, 2001.<\/li>\n<li>H. Lin, <strong>K. N. Chen,<\/strong> S. L. Cheng, Y.C. Peng, G.H. Shen, L.J. Chen, and C.R. Chen, \u201cInterfacial Reactions of Metal Thin Films on Ion Implanted Silicon under High Current Density,\u201d <em>J. Korean Phys. Soc.<\/em> 35, pp S264-266, 1999.<\/li>\n<li><strong>K. N. Chen,<\/strong> H.H. Lin, S.L. Cheng, Y.C. Peng, G.H. Shen, L. J. Chen, C.R. Chen, J.S. Huang, and K.N. Tu, &#8221; Silicide Formation in Implanted Channels and Interfacial Reactions of Metal Contacts under High Current Density,&#8221; <em>Journal of Materials Research.<\/em> 14, pp 4720-4726, 1999.<\/li>\n<li>Wen-Ku Chang, Shy-Feng Hsieh, Yuan-Haun Lee, <strong>Kuan-Neng Chen,<\/strong> Nan-Chung Wu, A. A WANG, &#8220;X-ray Diffraction Studies of Phase Transformations Between Tetragonal and Cubic Phases in Ba(Ti,Sn)O<sub>3<\/sub> Systems,&#8221; <em>Journal of Materials\u00a0Science<\/em>, 33(7), pp 1765, 1998.<\/li>\n<li>Po-Fu Yen, <strong>Kuan-Neng Chen<\/strong>, and Nan-Chung Wu, \u201cAlN Films Deposited by RF Magnetron Sputtering Techniques,\u201d <em>Proceedings of National Science Council ROC(A) <\/em>22, pp. 225-234, 1998.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> and Nan-Chung Wu, \u201cThe Research and Manufacturing of the Dielectric Materials in (Ba, Ca)(Ti, Sn)O<sub>3<\/sub> System,\u201d <em>Chinese Journal of Materials Science<\/em> 29, pp. 72-80, 1997.<\/li>\n<\/ol>\n<\/div><\/section>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":10,"featured_media":0,"parent":3221,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v16.8 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>\u671f\u520a - 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