{"id":3227,"date":"2021-10-12T11:18:10","date_gmt":"2021-10-12T03:18:10","guid":{"rendered":"https:\/\/3diclab.pro7.designworks.tw\/?page_id=3227"},"modified":"2026-05-17T15:24:18","modified_gmt":"2026-05-17T07:24:18","slug":"conference","status":"publish","type":"page","link":"https:\/\/3dic.lab.nycu.edu.tw\/zh-hant\/publications\/conference\/","title":{"rendered":"\u570b\u969b\u6703\u8b70"},"content":{"rendered":"\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-eonyyl7-4a2e166b573d81c17b861983e3e72a75\">\n.avia-section.av-eonyyl7-4a2e166b573d81c17b861983e3e72a75{\nbackground-repeat:no-repeat;\nbackground-image:url(https:\/\/3dic.lab.nycu.edu.tw\/wp-content\/uploads\/2021\/10\/banner-publications.jpg);\nbackground-position:50% 50%;\nbackground-attachment:scroll;\n}\n.avia-section.av-eonyyl7-4a2e166b573d81c17b861983e3e72a75 .av-section-color-overlay{\nopacity:0.5;\nbackground-color:#515151;\n}\n<\/style>\n<div id='banner'  class='avia-section av-eonyyl7-4a2e166b573d81c17b861983e3e72a75 main_color avia-section-default avia-no-border-styling  avia-builder-el-0  el_before_av_section  avia-builder-el-first  avia-full-stretch avia-bg-style-scroll av-section-color-overlay-active  av-minimum-height av-minimum-height-custom  container_wrap sidebar_right'  data-section-bg-repeat='stretch'><div class='av-section-color-overlay-wrap'><div class=\"av-section-color-overlay\"><\/div><div class='container av-section-cont-open' style='height:300px'><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3227'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-emqibfv-04f79e9ef0ccac9885f98e2ad717eaf1 sc-av_one_fifth av-equal-height-column-flextable'><div class='flex_column av-emqibfv-04f79e9ef0ccac9885f98e2ad717eaf1 av_one_fifth  avia-builder-el-1  el_before_av_three_fifth  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-ek0naqj-44a8cf7617da1a7c25ecb9493de98c28 av_three_fifth  avia-builder-el-3  el_after_av_one_fifth  el_before_av_one_fifth  flex_column_table_cell av-equal-height-column av-align-bottom '   ><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  av_inherit_color '  style='color:#ffffff; '  itemprop=\"text\" ><h2 style=\"text-align: center; font-size: 23px; margin-bottom: -30px;\">&#8211; \u8457\u4f5c\u5c08\u5229 &#8211;<\/h2>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kunry9b6-cc9b4f81e9952c5586405f32c3c2c939\">\n#top .av-special-heading.av-kunry9b6-cc9b4f81e9952c5586405f32c3c2c939{\npadding-bottom:10px;\ncolor:#ffffff;\n}\n.av-special-heading.av-kunry9b6-cc9b4f81e9952c5586405f32c3c2c939 .special-heading-inner-border{\nborder-color:#ffffff;\n}\n<\/style>\n<div  class='av-special-heading av-kunry9b6-cc9b4f81e9952c5586405f32c3c2c939 av-special-heading-h1 custom-color-heading blockquote modern-quote modern-centered  avia-builder-el-5  el_after_av_textblock  avia-builder-el-last  linkline av-thin-font '><h1 class='av-special-heading-tag '  itemprop=\"headline\"  ><strong>\u570b\u969b\u6703\u8b70<\/strong><\/h1><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/p><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-egp6ghn-1b04005a57fa0e60c961a3430ffa1722 av_one_fifth  avia-builder-el-6  el_after_av_three_fifth  avia-builder-el-last  flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><\/div><!--close column table wrapper. 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Autoclose: 1 --><div class='flex_column_table av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b sc-av_one_half av-equal-height-column-flextable'>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b\">\n.flex_column.av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b{\npadding:30px 30px 30px 30px;\nbackground-color:#ffffff;\n}\n<\/style>\n<div class='flex_column av-av_one_half-dc86ee3117e08d81d14d4cfc17ffa61b av_one_half  avia-builder-el-28  el_after_av_one_fifth  el_before_av_one_half  first flex_column_table_cell av-equal-height-column av-align-top column-top-margin'   ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mp9g8a6u-26deb69fa9d6ac5b6a14da8a38c0da6a\">\n#top .av-special-heading.av-mp9g8a6u-26deb69fa9d6ac5b6a14da8a38c0da6a{\npadding-bottom:0px;\n}\n<\/style>\n<div  class='av-special-heading av-mp9g8a6u-26deb69fa9d6ac5b6a14da8a38c0da6a av-special-heading-h4 blockquote modern-quote modern-centered  avia-builder-el-29  el_before_av_hr  avia-builder-el-first  '><h4 class='av-special-heading-tag '  itemprop=\"headline\"  >\u53d7\u9080\u6f14\u8b1b<\/h4><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-35d53d7be2491954ac97ecc375137ffb\">\n#top .hr.hr-invisible.av-av_hr-35d53d7be2491954ac97ecc375137ffb{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-av_hr-35d53d7be2491954ac97ecc375137ffb hr-invisible  avia-builder-el-30  el_after_av_heading  el_before_av_animated_numbers  '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class=\"avia-animated-number av-av_animated_numbers-132953e936933a357be2a88c5c1fc060 av-force-default-color avia_animate_when_visible  avia-builder-el-31  el_after_av_hr  avia-builder-el-last  \" data-timer=\"3000\"><strong class=\"heading avia-animated-number-title\"><span class=\"avia-single-number __av-single-number\" data-number_format=\"\" data-number=\"88\" data-start_from=\"0\">88<\/span><\/strong><div class=\"avia-animated-number-content\"><\/div><\/div><\/p><\/div><div class='av-flex-placeholder'><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_one_half-a9999d5109ba2680a0272de90d970905\">\n.flex_column.av-av_one_half-a9999d5109ba2680a0272de90d970905{\npadding:30px 30px 30px 30px;\nbackground-color:#ffffff;\n}\n<\/style>\n<div class='flex_column av-av_one_half-a9999d5109ba2680a0272de90d970905 av_one_half  avia-builder-el-32  el_after_av_one_half  avia-builder-el-last  flex_column_table_cell av-equal-height-column av-align-top column-top-margin'   ><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mp9g8nw7-fda43b27b80a13203224fb1c755e0f01\">\n#top .av-special-heading.av-mp9g8nw7-fda43b27b80a13203224fb1c755e0f01{\npadding-bottom:0px;\n}\n<\/style>\n<div  class='av-special-heading av-mp9g8nw7-fda43b27b80a13203224fb1c755e0f01 av-special-heading-h4 blockquote modern-quote modern-centered  avia-builder-el-33  el_before_av_hr  avia-builder-el-first  '><h4 class='av-special-heading-tag '  itemprop=\"headline\"  >\u53d7\u9080\u6280\u8853\u5831\u544a<\/h4><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-35d53d7be2491954ac97ecc375137ffb\">\n#top .hr.hr-invisible.av-av_hr-35d53d7be2491954ac97ecc375137ffb{\nheight:15px;\n}\n<\/style>\n<div  class='hr av-av_hr-35d53d7be2491954ac97ecc375137ffb hr-invisible  avia-builder-el-34  el_after_av_heading  el_before_av_animated_numbers  '><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><br \/>\n<div  class=\"avia-animated-number av-av_animated_numbers-0563ea7a2567aa8e43321c9d683c5315 av-force-default-color avia_animate_when_visible  avia-builder-el-35  el_after_av_hr  avia-builder-el-last  \" data-timer=\"3000\"><strong class=\"heading avia-animated-number-title\"><span class=\"avia-single-number __av-single-number\" data-number_format=\"\" data-number=\"7\" data-start_from=\"0\">7<\/span><\/strong><div class=\"avia-animated-number-content\"><\/div><\/div><\/p><\/div><\/div><!--close column table wrapper. Autoclose: 1 --><\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='after_section_2'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3227'><div class='entry-content-wrapper clearfix'><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li>Kai-Yu Chao, Yen-An Chen, Mu-Ping Hsu, Yuan-Chiu Huang, Chung-Hsiang Wang, Chee-Ping Lee, Audrey Charles, and <strong>Kuan-Neng Chen<\/strong>, \u201cNovel CMP-Free Cu\/Polymer Low Temperature Hybrid Bonding with Wide Process Window for Advanced Packaging and 3D Integration,\u201d 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, May 26 -May 29, 2026.<\/li>\n<li>Shang-Lun Pai, Shie-Ping Chang, Chen-Chai Chang, Po-Jung Sung, Nine-Chih Lin, Chih-Chao Yang, Kyle Huang, Gary Huang, Jeremy Lin, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdvanced Thermal Solutions for Thin 3D: AlN 3D Heat Dissipation Network,\u201d 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, May 26 -May 29, 2026.<\/li>\n<li>Chi Hsueh, Jia-Rui Lin, Chung-Hsuan Wu, Chun-Che Cheng, Mu-Ping Hsu, and <strong>Kuan-NengChen<\/strong>, &#8220;Toward Reliable and Thermally Robust BSPDN: A Dual-Path Design based BN\u2013BN Bonding, &#8220;2026 IEEE 76th Electronic\u00a0 Components and Technology Conference (ECTC), Orlando, FL, May 26 -May 29, 2026.<\/li>\n<li>Ching-Lin Chen, Yu-Chun Chen, Yu-Ming Pan, Chiao-Yen Wang, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu,\u00a0 \u201cReflectivity-Tunable Localized Epitaxy for Multi-Tier Monolithic 3D ICs,\u201d\u00a0 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, May 26 -May 29, 2026.<\/li>\n<li>Chen-Chia Chang, Shie-Ping Chang, Ting Ray Chung, Nien-Chih Lin, Po-Jung Sung, Chih-ChaoYang, Ming-Yang Li, Iuliana P. Radu, and <strong>Kuan-Neng Chen<\/strong>, \u201cHigh-Precision Wafer-Level Bonding in Thin-3D: A Moir\u00e9\u00a0 Pattern and Deep-Learning Alignment Approach,\u201d 2026 IEEE\u00a0 76th Electronic Components and Technology Conference (ECTC), Orlando, FL, May 26 -May 29, 2026.<\/li>\n<li>Lin-Chun Su, Jou-Yun Yeh, Yu-Lun Liu, Chun-Ta Li, Chien-Kang Hsiung, Yu-Tao Yang, Shang-Hsuan Wu, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>,\u201cNext-Generation Optical-Electrical Co-Design Interconnect Using Low-Temperature Hybrid Bonding Technology,\u201d2026 IEEE 76th Electronic\u00a0 Components and Technology Conference (ECTC), Orlando, FL,May 26-May 29, 2026.<\/li>\n<li>Tzu-Yu Chen, Yu-Lun Liu, Kazuaki Ebisawa, Makiko Irie, Jia-Rui Lin,Ya-Chien Chuang, Hsiao-Wei Yeh,Satoshi Fujimura, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>,\u201cReliability Evaluation of 10-Second Cu\/Polymer Hybrid Bonding for Next-Generation 3D Integration,\u201d2026 IEEE 76th Electronic\u00a0 Components and Technology Conference (ECTC), Orlando, FL, May 26-May29, 2026.<\/li>\n<li>Ou-Hsiang Lee, Wei-Lan Chiu, Hsiang-Hung Chang, Chia-Wen Chiang, Shih-Cheng Yu, Yu-PingChan, Da-Cheng Chien, <strong>Kuan-Neng Chen<\/strong>, Meng-Hsuan Chen, Chin-Hung Wang, Wei-Chung Lo, Shih-Chieh Chang, Chia-Hsin Lee, and Chung-An Tan, \u201cHierarchical 3D-vertically Multi-layers Staking by Transferable Cu\/polymer Hybrid Bonding,\u201d 2026 IEEE 76th Electronic\u00a0 Components andTechnology Conference (ECTC), Orlando, FL, May 26-May 29, 2026.<\/li>\n<li><strong><em>[Invited]<\/em> Kuan-Neng Chen<\/strong>,\u201cRedefining Integration: Nanoscale Platformsfor 3D IC, andAdvanced Packaging\u201d, IEEE Electron Devices Technology and Manufacturing (EDTM), Penang,Malaysia, Mar. 1-4, 2026.<\/li>\n<li><strong><em>[Invited]<\/em> Kuan-Neng Chen,<\/strong> \u201cEnabling Innovation with 3D IC, Heterogeneous Integration, and Advanced Packaging\u201d, MRS-Taiwan Annual Meeting, Hsinchu, Taiwan, Nov. 15-16, 2025.<\/li>\n<li>Chieh-Ling Lee, Chu-Hsiu Hsu, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, Po-Tsang Huang, and Chenming Hu, \u201cMonolithic Hybrid-3D Standard Cell Library with Sandwiched Inter-Metal Layer for 3D Digital Computation-in-Memory Circuits,\u201d 2025 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Busan, Korea, Oct. 12 &#8211; 15, 2025.<\/li>\n<li>Chun-Che Cheng, Mu-Ping Hsu, Chiao-Yen Wang, Li-Hsin Cheng, and <strong>Kuan-Neng Chen<\/strong>,\u201cThermal Performance Analysis of BSPDN and FSPDN from Chip to Package Level,\u201d IEEE International Interconnect Technology Conference (IITC), Busan, Korea, Jun. 1 &#8211; 4, 2025.<\/li>\n<li>Tzu-Yu Chen, Yu-Lun Liu and <strong>Kuan-Neng Chen<\/strong>, \u201cAdvanced CMP Optimization for Enhanced Cu\/Polymer Hybrid Bonding in 3D IC,\u201d IEEE International Interconnect Technology Conference(IITC), Busan, Korea, Jun. 1 &#8211; 4, 2025.<\/li>\n<li>Yu-Chun Chen, Ching-Lin Chen, Yu-Ming Pan, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cSimulation-based Process Optimization for Maximizing Device Area and Integration Efficiency in Elevated Epitaxy Technique for Monolithic 3D ICs,\u201d IEEE International Interconnect Technology Conference (IITC), Busan, Korea, Jun. 1 &#8211; 4, 2025.<\/li>\n<li>Jia-Rui Lin, Yi-Hsuan Chen, Yuan-Chiu Huang, Jumpei Fujikata, Keiko Abe, Naoko Araki, Takayuki Ohba, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-Temperature Epoxy-Based Cu\/Polymer Hybrid Bonding for 3D IC Packaging with Optimized CMP,\u201d IEEE International Interconnect Technology Conference (IITC), Busan, Korea, Jun. 1 &#8211; 4, 2025.<\/li>\n<li>Yu-Chun Yang, Ching-Lin Chen, Yu-Chun Chen, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cField-Size Single-Crystalline Silicon-on-Dielectric Film via Laser Recrystallization for Monolithic 3DICs,\u201d SNDCT 2025, Hsinchu, Taiwan, May. 27, 2025.<\/li>\n<li>Yu-Lun Liu, Tzu-Yu Chen, Kazuaki Ebisawa, Makiko Irie, Chun-Ta Li, Jia-Rui Lin, Yi-Hsuan Chen, Ya-Chien Chuang, Hsiao-Wei Yeh, Satoshi Fujimura, and <strong>Kuan-Neng Chen<\/strong>, \u201cUltra-Fast Cu\/Polymer Hybrid Bonding with Electroless Passivation Layer for Cost-effective High I\/O Interconnection Stacking,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li>Chun-Ta Li, Yu-Lun Liu, Tzu-Han Sun, Chien-Kang Hsiung, Yu-Tao Yang, Wen-Tzu Tsai, MuPing Hsu, Yuan-Chiu Huang, and<strong> Kuan-Neng Chen<\/strong>, \u201cFabrication Optimization and Reliability<br \/>\nStudy of Hyper RDL (HRDL) Interposer for Advanced Packaging and Heterogeneous Integration,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li>Ting-Yu Chen, Shie-Ping Chang, Bo-Jheng Shih, Zih-Yang Chen, Yu-Lun Liu, Po-Jung Sung, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Ming-Yang Li, Iuliana P. Radu, and <strong>KuanNeng Chen<\/strong>, \u201cThin 3D: An Innovative Approach to Ultra-Thin Wafer-Level Active Device Transfer Technology with Optimized Material and Thermal Solution for 3D IC,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li>Li-Hsin Cheng, Chiao-Yen Wang, Kai-Fang Lai, Mu-Ping Hsu, and <strong>Kuan-Neng Chen<\/strong>, \u201cFirst Demonstration of Superior Characteristics of Co-Co Bonding with Passivation Structure at Low Thermal Budget for Advanced Packaging\u00a0 nd Ultra-Fine Pitch Applications,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li>Yu-Ming Pan, Ching-Lin Chen, Hao-Tung Chung, Chiao-Yen Wang, Nien-Chih Lin, Chih-Chao Yang, Chang-Hong Shen, and <strong>Kuan-Neng Chen<\/strong>, \u201cCapping Layers for Enhanced Crystallinity of Single-Crystal Germanium on Insulator in Monolithic 3D ICs,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li>Pei-Ru Lee, Mu-Ping Hsu, Yi-Chieh Tsai, An-Yuan Hou, Wen-Wei Wu, and <strong>Kuan-Neng Chen<\/strong>, \u201cVoid Formation Elimination in Ultra-Thin Au-Sn Solid-Liquid Interdiffusion Bonding Using Rapid Cooling Process for Advanced Packaging and MEMS Applications,\u201d 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Tx, May 27 &#8211; May 30, 2025.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen<\/strong>, \u201cInnovations in Hybrid Bonding and Thermal Management for Advanced Packaging\u201d, 2025 International Conference on Electronics Packaging (ICEP) Conference, Nagano Pref., Japan, Apr. 15-19, 2025.<\/li>\n<li>Cheng-Yu Wei, Chiao-Yen Wang, Pei-Ru Lee, Mu-Ping Hsu, Yi-Chieh Tsai, Wun-Kai Wang, and <strong>Kuan-Neng Chen<\/strong>, \u201cSuperior Electrical Characteristics of Au-Sn Intermetallic Compound with Ultra-Thin Buffer Layer Structure in Eutectic Bonding Technology for 3D Integrated Circuits Applications,\u201d 2025 International Conference on Electronics Packaging (ICEP) Conference, Nagano\u00a0 Pref., Japan, Apr. 15-19, 2025.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201cHybrid Bonding Innovations: Ultra-Low Temperature Cu-Cu Bonding Based Passivation Technology and HRDL Platform Development for RDL Interposer Applications\u201d, IEEE Hybrid Bonding Symposium, Milpitas, CA, Jan. 16-17, 2025.<\/li>\n<li><strong><em>[Invited]<\/em> Kuan-Neng Chen<\/strong>, \u201cInnovation of key technologies and platforms in 3D IC and advanced packaging\u201d, MRS-Taiwan Annual Meeting, Taichung, Taiwan, Nov. 15-16, 2024.<\/li>\n<li>Yi-Hsuan Chen, Yuan-Chiu Huang, Ya-Ting Chang, Jumpei Fujikata, Keiko Abe, Naoko Araki, Takayuki Ohba, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Polymer Material for Low-Temperature Hybrid Bonding and Flexible Substrate Applications,\u201d IMPACT 2024, Taipei, Taiwan, Oct. 22-25, 2024.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Hybrid Bonding: Perspectives on Material Selection, Structural Design, and Applications\u201d, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024<\/li>\n<li>Yu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cCost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology\u201d, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024.<\/li>\n<li>Tzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai, Mu-Ping Hsu, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-temperature Adhesive Hybrid Bonding Technology with Novel Aera-selective Passivation Layer\u201d, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024.<\/li>\n<li>Wen-Tzu Tsai, Mu-Ping Hsu, Yi-Hsuan Chen, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Hybrid Bonding Using Area-Selective Passivation Layer Deposition Technology on Various Substrates for Heterogeneous Integrated Structure\u201d, 2024 IEEE International Conference on Solid State Devices and Materials (SSDM), Hyogo, Japan, Sep 1-4, 2024.<\/li>\n<li>Yu-Ming Pan, Huan-Yu Chiu, Nien-Chih Lin, Hao-Tung Chung, Bo-Jheng Shih, Chih-Chao Yang, Po-Tsang Huang, Chang-Hong Shen, Po-Jung Sung, Wen-Fa Wu, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cLarge-Area Single-Crystal Ge Using Elevated Epitaxy Technique for Monolithic 3D Integration\u201d, 2024 IEEE International Conference on Solid State Devices and Materials (SSDM), Hyogo, Japan, Sep 1-4, 2024.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201cResearch and Technology Advances of 3D IC\u201d, IEDMS &amp; SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024.<\/li>\n<li>Kai-Fang Lai, Li-Hsin Cheng, Chiao-Yen Wang, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Wafer-level Cobalt-to-Cobalt Bonding with Passivation Structure for Three-dimensional Integrated Circuits Applications\u201d, IEDMS &amp; SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024.<\/li>\n<li>Ching-Lin Chen, Yu-Chun Chen, Huan-Yu Chiu, Yu-Ming Pan, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cInvestigating the Impact of Nitride Capping Thickness on Monolithic 3DICs Through Thermal Simulation\u201d, IEDMS &amp; SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024<\/li>\n<li>Chien Kang Hsiung, Terry Wang, Sarah Wozny, Marvvin L Bernt, and <strong>Kuan-Neng Chen<\/strong>, \u201cGlass Panel Process Integrated Low Stress Organic Dielectric RDL Structure,\u201d 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 &#8211; May 31, 2024.<\/li>\n<li>Mu-Ping Hsu, Wen-Tsu Tsai, Ou-Hsiang Lee, Chi-Yu Chen, Tzu-Ying Kuo, Hsiang-Hung Chang, Hsin-Chi Chang, Zhong-Jie Hong, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu\/SiO2 Hybrid Bonding Using Area-Selective Metal Passivation (Interface Metal) Technology for 3D IC and Advanced Packaging,\u201d 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 &#8211; May 31, 2024.<\/li>\n<li>Bo-Jheng Shih, Yu-Ming Pan, Chiao-Yen Wang, Huan-Yu Chiu, Chih-Chao Yang, Chang-Hong Shen, and <strong>Kuan-Neng Chen<\/strong>, \u201cApplication of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration,\u201d 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 &#8211; May 31, 2024.<\/li>\n<li>Chiao-Yen Wang, Tzu-Heng Hung, Ping-Jung Liu, and <strong>Kuan-Neng Chen<\/strong>, \u201cComparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging,\u201d 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 &#8211; May 31, 2024.<\/li>\n<li>Y. T. Hung, J. Z. Huang, H. H. Chang, K. P. Huang, O. H. Lee, H. C. Chien, C. H. Wang, W. C. Lo, C. I. Wu, and <strong>K. N. Chen<\/strong>, \u201cReliability Investigation of Cobalt and Copper Damascene Interconnects with Capped Graphene,\u201d 2024 International Conference on Electronics Packaging (ICEP) Conference, Toyama, Japan, Apr. 17-20, 2024.<\/li>\n<li>Kai-Yu Chao, Chiao-Yen Wang, Ping-Jung Liu, Tzu-Heng Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cEvaluation of Copper Nitride Passivation Layer by Plasma Pretreatment for Low Temperature Copper-to-Copper Bonding,\u201d International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.<\/li>\n<li>Huan-Yu Chiu, Chen-Wen Chou, Yu-Ming Pan, Hao-Tung Chung, Chih-Chao Yang, Chang-Hong Shen, and <strong>Kuan-Neng Chen<\/strong>, \u201cLocation-controlled-grain Technique using Green Nanosecond Laser to Germanium Crystallization for Monolithic 3D IC,\u201d International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.<\/li>\n<li>Yao-Cheng Yang, Jui-Han Liu, Yuan-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow-Temperature Wafer-Level Polyimide to Polyimide Bonding in Advanced Packaging\u201d, International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201cFrom Backend 3D to Frontend 3D: New Platforms for 3DIC and Advanced Packaging,\u201d Heterogeneous Integration Global Summit, SEMICON Taiwan, Taipei, Taiwan, Sep. 5-8, 2023.<\/li>\n<li>Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Nei-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Wen-Fa Wu, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cMiddle-End of Line Si FinFETs Using Laser-Liquid-Phase-Epitaxy Technique for Monolithic 3DIC\u201d, 2023 IEEE International Conference on Solid State Devices and Materials (SSDM), Nagoya, Japan, Sep 5-8, 2023.<\/li>\n<li>Mu-Ping Hsu, Hsin-Chi Chang, Yi-Chieh Tsai, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology\u201d, 2023 IEEE International Conference on Solid State Devices and Materials (SSDM), Nagoya, Japan, Sep 5-8, 2023.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201cHybrid Bonding: The Key Technology to Reach Fine Pitch and High Density Stacking in Heterogeneous Integration,\u201d 2023 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 17-20, 2023.<\/li>\n<li><em><strong>[Invited]<\/strong><\/em> <strong>Kuan-Neng Chen<\/strong>, \u201c3DIC Introduction and What Can ALD Do in 3DIC,\u201d 7th Area Selective Deposition (ASD) Workshop, Incheon, Korea, Apr. 2-5, 2023.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong><strong>Kuan-Neng Chen<\/strong>, \u201c3D IC and Advanced Packaging,\u201d 2022 IEEE Asian Solid-State Circuit Technology Conference (A-SSCC), Taipei, Taiwan, Nov. 6-9, 2022.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong>Tzu-Heng Hung, and <strong>Kuan-Neng Chen<\/strong>, \u201cSurface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration,\u201d 2022 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Virtual Conference, Nov. 3-6, 2022.<\/li>\n<li>Ming-Wei Weng, Zhong-Jie Hong, Tai-Yu Lin, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of the Effect of Crystallinity on Low-temperature Cu-Cu Bonding with Passivation Layer\u201d, International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Oct. 27-28, 2022.<\/li>\n<li>Chun-Ta Li, Ming-Chih Chen, Jui-Han Liu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Roomtemperature Adhesive Bonding in 3D Integration and Packaging\u201d, International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Oct. 27-28, 2022.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong><strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Hybrid Bonding, Innovation Applications and Platform for 3DIC,\u201d IMPACT 2022, Taipei, Taiwan, Oct. 26-28, 2022.<\/li>\n<li>Demin Liu, Kuan-Chun Mei, Han-Wen Hu, Yi-Chieh Tsai, Huang-Chung Cheng, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct Bonding,\u201d 2022 IEEE 72th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 31 &#8211; Jun. 3, 2022.<\/li>\n<li>Yu-Tao Yang, Haoxiang Ren, Su Kong Chong, Gang Qiu, Shu-Yun Ku, Yang Cheng, Chaowei Hu, Tiema Qian, <strong>Kuan-Neng Chen<\/strong>, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, \u201cRF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for future large-scale quantum applications,\u201d 2022 IEEE 72th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 31 &#8211; Jun. 3, 2022.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong><strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Hybrid Bonding: The Evolution from 400\u00b0C to Near Room Temperature,\u201d 2022 International Conference on Electronics Packaging (ICEP) Conference, Hokkaido, Japan, May 11-14, 2022.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding and Platform Development,\u201d IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.<\/li>\n<li>Demin Liu, Yi-Chieh Tsai, Han-Wen Hu, Po-Chi Chen, Chia-Yong Lim, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding and Platform Development,\u201d IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.<\/li>\n<li>Hao-Tung Chung, Yu-Ming Pan, Bo-Jheng Shih, Han-Wen Hu, Chih-Chao Yang, Chang-Hong Shen, Huang-Chung Cheng, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cGreen Nanosecond Laser Crystallized Ge FinFETs for Monolithic 3-D ICs\u201d, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.<\/li>\n<li>Jui-Han Liu, Demin Liu, Han-Wen Hu, Bruce Peng, Yuang-Chiu Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdjustable Curing Parameters for Flexible Polymer Adhesive Bonding in 3DIC Applications\u201d, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.<\/li>\n<li>Chia-Hsin Lee, Baron Huang, Jennifer See, Xiao Liu, Yu-Min Lin, Chao-Jung Chen, and <strong>Kuan-Neng Chen<\/strong>, \u201cVersatile laser release material development for chip-first and chip-last fan-out wafer level packaging,\u201d 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 &#8211; Jul. 4,<\/li>\n<li>Tzu-Heng Hung, Ting-Cih Kang, Shan-Yu Mao, Tzu-Chieh Chou, Han-Wen Hu, Hsih-Yang Chiu, Chiang-Lin Shih, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications,\u201d 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 &#8211; Jul. 4,<\/li>\n<li>Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Ming-Chang Lin, Tsau-Hua Hsieh, and <strong>Kuan-Neng Chen<\/strong>, \u201cUltra-High Strength Cu-Cu Bonding under Low Thermal Budget for Chiplet Heterogeneous Applications,\u201d 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 &#8211; Jul. 4,<\/li>\n<li>Yuan-Chiu Huang, Demin Liu, Kuma Hsiung, Tzu-Chieh Chou, Han-Wen Hu, Arvind Sundarrajan, Hsin-Chi Chang, Yi-Yu Pan, Ming-Wei Weng, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging,\u201d 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 &#8211; Jul. 4,<\/li>\n<li>Shu-Yun Ku, Tzu-Chieh Chou, Yi-Chieh Tsai, Han-Wen Hu, Yu-Ren Fang, Yu-Ju Lin, Po-Tsang Huang, Jin-Chern Chiou, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdvanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System,\u201d 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 &#8211; Jul. 4,<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding: The Evolution of Bonding Technology,\u201d SNDCT 2021, Hsinchu, Taiwan, May 20-21, 2021.<\/li>\n<li>Ming-Wei Weng, Shan-Yu Mao, Demin Liu, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cAsymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation Layer,\u201d 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 19-22, 2021.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Bonding Temperature Development for High Throughput 3D Heterogeneous Integration Platform,\u201d 2020 IEEE 14th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Virtual Conference, Nov. 3-6, 2020.<\/li>\n<li><strong><em>[IEDMS 2020 Best Paper Award]<\/em><\/strong> Yu-Wei Liu, Yi-Jui Chang, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cInvestigation of Cooling Hole Structure in Location-Controlled-Grain Technique for Monolithic 3DIC\u201d, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.<\/li>\n<li>Jui-Han Liu, Hsin-Chi Chang, Yi-Chieh Tsai, Chia-Hsuan Lee, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and <strong>Kuan-Neng Chen<\/strong>, \u201cHighly Accelerated Stress Test Reliability of WOW Bumpless Through Silicon Vias\u201d, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.<\/li>\n<li>Hsin-Chi Chang, Ming-Wei Weng, Yi-Yu Pan, Demin Liu, Yuan-Chiu Huang, Han-Wen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cUsing Annealing Process to Improve Electrical Properties in Low-Temperature Cu-to-Cu Bonding with Passivation Layer\u201d, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.<\/li>\n<li>Yu-Wei Liu, Yi-Jui Chang, Chih-Chao Yang, Chang-Hong Shen, <strong>Kuan-Neng Chen<\/strong>, and Chenming Hu, \u201cEffect of Dielectric Layer Scheme for High-Quality Silicon Channel in Monolithic 3DIC\u201d, 2020 IEEE International Conference on Solid State Devices and Materials (SSDM), Sep. 27-30, 2020.<\/li>\n<li>Demin Liu, Po-Chih Chen, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer,\u201d 2020 IEEE Electronic Components and Technology Conference (ECTC), Jun. 3 \u2013 30, 2020.<\/li>\n<li>Ming-Yu Huang, Hung-Ming Chen, <strong>Kuan-Neng Chen<\/strong>, Shih-Hsien Wu, Yu-Min Lee, and An-Yu Su, \u201cA Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design,\u201d 2020 IEEE Electronic Components and Technology Conference (ECTC), Jun. 3 \u2013 30, 2020.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cCu-Based Bonded Interconnects for 3D Integration and Advanced Packaging Applications,\u201d 2019 MRS-T Annual Meeting, Tainan, Taiwan, Nov. 15-16, 2019.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, \u201cApplications and Schemes based on 3D Heterogeneous Integration,\u201d The\u00a013<sup>th<\/sup>International Conference on ASIC (ASICON 2019), Chonqing, China, Oct. 29-Nov.1, 2019.<\/li>\n<li>Pin-Jun Chen, Chih-Ming Shen, Chih-Chao Yang, Ming-Chi Tai, Wei-Chung Lo, Chang-Hong Shen, Chenming Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cTransient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC\u201d, IMPACT-IAAC 2019, Taipei, Taiwan, Oct. 23-25, 2019.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, \u201cLow Temperature Cu-Cu Direct Bonding for 3D Integration and Advanced Packaging,\u201d ADMETA Plus 2019, Tokyo, Japan, Oct. 10 &#8211; Oct. 11, 2019.<\/li>\n<li>Yi-Chieh Tsai, Chia-Hsuan Lee, and <strong>Kuan-Neng Chen,<\/strong> \u201cInvestigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology\u201d, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 \u2013 Oct 10, 2019.<\/li>\n<li>Po-Chih Chen, Demin Liu, and <strong>Kuan-Neng Chen,<\/strong> \u201cLow-Temperature Wafer-Level Au-Au Bonding at 100\u00b0C\u201d, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 \u2013 Oct 10, 2019.<\/li>\n<li>Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, and <strong>Kuan-Neng Chen,<\/strong> \u201cLow Temperature Cu-Cu Direct Bonding Below 150\u00b0C with Au Passivation Layer\u201d, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 \u2013 Oct 10, 2019.<\/li>\n<li>Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young Suk Kim, <strong>Kuan-Neng Chen,<\/strong> and Takayuki Ohba, \u201cTemperature Cycling Reliability of Wow Bumpless Through Silicon Vias\u201d, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 \u2013 Oct 10, 2019.<\/li>\n<li>Yu-Min Lin, Sheng-Tsai Wu, Chun-Min Wang, Chia-Hsin Lee, Shin-Yi Huang, Ang-Ying Lin, Tao-Chih Chang, Puru Bruce Lin, Cheng-Ta Ko, Yu-Hua Chen, Jay Su, Xiao Liu, Qi Wu, and <strong>Kuan-Neng Chen,<\/strong> \u201cAn RDL-First Fan-out Panel Level Package for Heterogeneous Integration Applications,\u201d 2019 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 \u2013 May 31, 2019.<\/li>\n<li>Kai-Ming Yang, Tzu-Chieh Chou, Cheng-Ta Ko, Chen-Hao Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Wen-Wei Wu, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package,\u201d 6th International Workshop on Low Temperature Bonding for 3D Integration, Kanazawa, Japan, May 21-25, 2019.<\/li>\n<li>Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, <strong>Kuan-Neng Chen<\/strong>, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, \u201cHighly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation,\u201d 2019 International Conference on Electronics Packaging (ICEP) Conference, Toki Messe, Niigata, Japan, Apr. 17-20, 2019.<\/li>\n<li>Shu-Yun Ku, Yi-Chieh Tsai, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Fine-pitch Chip-level Cu-Cu Bonding Under Low Temperature,\u201d International Electron Devices and Materials Symposium (IEDMS), Keelung, Taiwan, Nov 14-16, 2018.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Bonding Technology Development for 3D and Heterogeneous Integration,\u201d 2018 IEEE 14th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Qingdao, China, Oct. 31 &#8211; Nov. 3, 2018.<\/li>\n<li>Yu-Ming Pan, Yu-Tao Yang, Tzu-Chieh Chou, Ting-Yang Yu, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and <strong>Kuan-Neng Chen<\/strong>, \u201cSimulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems\u201d, IMPACT 2018, Taipei, Taiwan, Oct. 25-27, 2018.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Bonding Technology for Advanced Packaging and 3D Integration,\u201d ADMETA Plus 2018, Beijing, China, Oct. 10 &#8211; Oct. 12, 2018.<\/li>\n<li>Yi-Lun Yang, Cheng-Hsien Lu, Yu-Pei Chen, Chiao-Pei Chen, Tsung-Tai Hung, Chiu-Feng Chen and <strong>Kuan-Neng Chen<\/strong>, \u201cEffect of Electroplating on Adhesion between Copper\/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications\u201d, 2018 IEEE International Conference on Solid State Devices and Materials (SSDM), Tokyo, Japan, Sep 9-13, 2018.<\/li>\n<li>Chia-Hsin Lee, Jay Su, Xiao Liu, Qi Wu, Jim-Wein Lin, Puru Lin, Cheng-Ta Ko, Yu-Hua Chen, Wen-Wei Shen, Tzu-Ying Kou, Yu-Min Lin, and <strong>Kuan-Neng Chen,<\/strong> \u201cOptimization of laser release process for throughput enhancement of fan-out wafer-level packaging,\u201d 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 \u2013 Jun. 1, 2018.<\/li>\n<li>Yu-Min Lin, Sheng-Tsai Wu, Wen-Wei Shen, Shin-Yi Huang, Tzu-Ying Kuo, Ang-Ying Lin, Tao-Chih Chang, Hsiang-Hung Chang, Shu-Man Lee, Chia-Hsin Lee, Jay Su, Xiao Liu, Qi Wu, and <strong>Kuan-Neng Chen,<\/strong> \u201cAn RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications,\u201d 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 \u2013 Jun. 1, 2018.<\/li>\n<li>Cheng-Hsien Lu, Yi-Tung Kho, Yu-Tao Yang, Yu-Pei Chen, Chiao-Pei Chen, Tsung-Tai Hung, Chiu-Feng Chen, and <strong>Kuan-Neng Chen,<\/strong> \u201cAdhesion Property of Polyimide and Passivation Layer for Polymer\/metal Wafer-level Hybrid Bonding in 3D Integration,\u201d 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 \u2013 Jun. 1, 2018.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Bonding Technology for 3D Integration and Advanced Packaging,\u201d 2018 International Conference on Electronics Packaging (ICEP) Conference, Kuwana, Mie, Japan, Apr. 17-21, 2018.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cResearch Achievements of Key Technologies in 3D Integration and Heterogeneous Integration,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar. 11-12, 2018.<\/li>\n<li>-T. Huang, Y.-C. Huang, S.-L. Wu, Y.-C. Hu, M.-W. Lu, T.W. Sheng, F.K. Chang, C.-P. Lin, N.-S. Chang, H.-L. Chne, C.-S. Chen, T.-W. Chiu, W. Hwang, <strong>K. N. Chen<\/strong>, C.-T. Chuang and J.-C. Chiou, \u201cWireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable \u03bc-Needle Array and Flexible Interposer,\u201d 2018 Symposium on Engineering, Medicine, and Biology Applications (SEMBA), Taipei, Taiwan, Feb. 2-4, 2018.<\/li>\n<li>Hsiu-Chi Chen, Yi-Tung Kho, Yen-Jun Huang, Yu-Sheng Hsieh, Yao-Jen Chang, Ya-Sheng Tang, Ting-Yang Yu and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu\/Sn Bonding and Asymmetric Cu\/Sn-Cu Bonding for Advanced 3D Integration Applications\u201d, IMPACT 2017, Taipei, Taiwan, Oct. 25-27, 2017.<\/li>\n<li>Yen-Jun Huang, Hsiu-Chi Chen, Ting-Yang Yu, Bo-Hung Lai, Yu-Chiao Shih, and <strong>Kuan-Neng Chen<\/strong>, \u201cAsymmetry Hybrid Bonding Using Cu\/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications\u201d, IMPACT 2017, Taipei, Taiwan, Oct. 25-27, 2017.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cResearch Advances and Applications of 3D Integration,\u201d The\u00a012<sup>th<\/sup>International Conference on ASIC (ASICON 2017), Guiyang, China, Oct. 25-28, 2017.<\/li>\n<li>Tzu-Chieh Chou, Yu-Tao Yang, Ting-Yang Yu, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration\u201d, 2017 IEEE International Conference on Solid State Devices and Materials (SSDM), Sendai, Japan, Sep 19-22, 2017.<\/li>\n<li>Yu-Wei Liu, Shih-Feng Liu, Cheng-Hsien Lu, De-Min Liu, and <strong>Kuan-Neng Chen<\/strong>, \u201cStudy of Adhesion Strength and Reliability between Ti\/Cu, Cu RDL and Polyimide in 3D Integration and Advanced Packaging\u201d, International Electron Devices and Materials Symposium (IEDMS), Hsinchu, Taiwan, Sep 5-7, 2017.<\/li>\n<li>Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Yung-Kuei Wang, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, <strong>Kuan-Neng Chen<\/strong>, Ching-Te Chuang, Jin-Chern Chiou, \u201cA 64-Channel Neural-Sensing Microsystem with TSV-Embedded Micro-Probe Array for Neural Signal Acquisition,\u201d The 19th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2017), Kaohsiung, Taiwan, Jun. 18-22, 2017.<\/li>\n<li>Yu-Tao Yang, Ting-Yang Yu, Shu-Chiao Kuo, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and <strong>Kuan-Neng Chen,<\/strong> \u201cBreakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration,\u201d 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 \u2013 Jun. 2, 2017.<\/li>\n<li>Nai-Chen Chi, Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and <strong>Kuan-Neng Chen,<\/strong> \u201cHigh Transmittance Broadband THz Polarizer Using 3D-IC Technologies,\u201d 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 \u2013 Jun. 2, 2017.<\/li>\n<li>Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Shu-Man Lee, Ang-Ying Lin, Hsiang-Hung Chang, Tao-Chih Chang, Alvin Lee, Jay Su, Baron Huang, Ram Trichur, Dongshun Bai, Xiao Liu, and <strong>Kuan-Neng Chen,<\/strong> \u201cProcess Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP,\u201d 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 \u2013 Jun. 2, 2017.<\/li>\n<li>Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, <strong>Kuan-Neng Chen<\/strong>, Ching-Te Chuang, Jin-Chern Chiou, \u201cAn Implantable 128-Channel Wireless Neural-Sensing Microsystem Using TSV-Embedded Dissolvable m-Needle Array and Flexible Interposer,\u201d 2017 IEEE International Symposium on Circuits and Systems (ISCAS), Baltimore, MD, USA, May 28-31, 2017.<\/li>\n<li>Cheng-Ta Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, Tzu-Chieh Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, <strong>Kuan-Neng Chen<\/strong>, and Tzyy-Jang Tseng, \u201cStudy on Low Temperature Cu Bonding and Temporary Bond\/De-Bond for RDL-First Fan-Out Panel Level Package,\u201d 5th International Workshop on Low Temperature Bonding for 3D Integration, Tokyo, Japan, May 16-18, 2017.<\/li>\n<li>Geng-Ming Chang, Shih-Wei Lee, Ching-Yun Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration,\u201d 2017 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 24-27, 201<\/li>\n<li>Nai-Chen Chi, Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and <strong>Kuan-Neng Chen,<\/strong> \u201cHigh Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si Substrate,\u201d SPIE Optics + Optoelectronics 2017, Prague, Czech Republic, Apr. 24-27, 201<\/li>\n<li>Cheng-Hsien Lu, Yi-Tung Kho, Chuan-An Cheng, Yen-Jun Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cPolymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration,\u201d 2017 International Conference on Electronics Packaging (ICEP), Tendo, Yamagata, Japan, Apr. 19-21, 2017.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cKey Technologies and Application Demonstrations of 3D Heterogeneous Integration and FOWLP,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar. 12-13, 2017.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, <strong>Kuan-Neng Chen<\/strong>, and King-Ning Tu, \u201cLow-Temperature Cu-to-Cu Direct Bonding Enabled by Highly (111)-oriented and Nanotwinned Cu,\u201d TMS 2017 146<sup>th<\/sup> Annual Meeting and Exhibition, San Diego, CA, USA, Feb. 27- Mar. 2, 2017.<\/li>\n<li>Yan-Pin Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDry-Film Technology Development for Advanced 3D IC and Heterogeneous Integration Applications,\u201d International Electron Devices and Materials Symposium (IEDMS), Taipei, Taiwan, Nov 24-25, 2016.<\/li>\n<li>Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cThe Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer,\u201d IEEE 3D System Integration Conference, San Francisco, CA, USA, Nov. 8-11, 2016.<\/li>\n<li>Yu-Tao Yang, Yu-Chen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cReliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration,\u201d IEEE 3D System Integration Conference, San Francisco, CA, USA, Nov. 8-11, 2016.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cKey Technologies and Materials Investigation for FOWLP and 3D Integration,\u201d 2016 IEEE 13th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Hangzhou, China, Oct. 25-28, 2016.<\/li>\n<li>Ching-Yun Chang, Shih-Wei Lee, Geng-Ming Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cSingle Sided Heating Method for Chip-to-Wafer Bonding with Submicron Cu\/In Interconnects,\u201d IMPACT 2016, Taipei, Taiwan, Oct. 26-28, 2016.<\/li>\n<li>Alvin Lee, Jay Su, Baron Huang, Ram Trichur, Dongshun Bai, Xiao Liu, Wen-Wei Shen, Yu-Min Lin, Tao-Chih Chang, Hsiang-Hung Chang, Chia-Wei Chiang, Huan-Chun Fu, K. C. Chen, Yu-Lan Lu, and <strong>Kuan-Neng Chen<\/strong>, \u201cOptimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging,\u201d IMAPS 2016, Pasadena, CA, USA, Oct. 11-13, 2016.<\/li>\n<li>Ting-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cQuality and Reliability Investigation of Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique,\u201d 2016 IEEE International Conference on Solid State Devices and Materials (SSDM), Tsukuba, Japan, Sep 26-29, 2016.<\/li>\n<li>Hsiao-Chun Chang, Yu-Chen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cUneven-Topography-Chip 3D Heterogeneous Integration Using Double Self Assembly Technology for MEMS and Biomedical Microsystem Applications,\u201d The 42th International Conference on Micro and Nano Engineering (MNE 2016), Vienna, Austria, Sep. 19-23, 2016.<\/li>\n<li><strong><em>[IPFA 2016 Best Paper Award]<\/em><\/strong> Hao-Wen Liang, Ting-Yang Yu, Yao-Jen Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAsymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer layer Technique for 3D Integration,\u201d 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016), Singapore, Jul. 18-21, 2016.<\/li>\n<li>Yu-Chen Hu, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment and Electrical Performance of Low Temperature Cu-Sn\/In Bonding for 3D Flexible Substrate Integration,\u201d IEEE Silicon Nanoelectronics Workshop (SNW), Honolulu, HI, USA, Jun. 12-13, 2016.<\/li>\n<li>Yu-Hsiang Huang, Hao-Wen Liang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen,<\/strong> \u201cStudy of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology,\u201d 2016 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31 \u2013 Jun. 3, 2016.<\/li>\n<li>Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, <strong>Kuan-Neng Chen<\/strong>, Ching-Te Chuang, Jin-Chern Chiou, \u201cAn Ultra-High-Density 256-channel\/25mm<sup>2<\/sup> Neural Sensing Microsystem using TSV-embedded Neural Probes,\u201d 2016 IEEE International Symposium on Circuits and Systems (ISCAS), Montreal, Canada, May 22-25, 2016.<\/li>\n<li>Chuan-An Cheng, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cWafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application,\u201d 2016 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 25-27, 201<\/li>\n<li>Shih-Wei Lee, Shu-Chiao Kuo, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical Testing Structure for Stacking Error Measurement in 3D Integration,\u201d 2016 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 25-27, 2016.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of 3D IC Technologies for Heterogeneous Integration and Neural Sensing Applications,\u201d 2016 International Conference on Electronics Packaging (ICEP) Conference, Sapporo, Japan, Apr. 20-22, 2016.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cResearch Advances of Low Temperature Bonding Technology in 3D Integration and Heterogeneous Integration,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar. 13-14, 2016.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> Chien-Hung Lin, and <strong>Kuan-Neng Chen<\/strong>, \u201cSubmicron Polymer Temporary Bonding with Ultra-Fast Laser Ablation Application in 3D Semiconductor Package,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar. 13-14, 2016.<\/li>\n<li>Yu-Hsiang Huang, Yan-Pin Huang, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical and Stability Investigation of Copper Pillars in 3D LSI Technologies,\u201d International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov 19-20, 2015.<\/li>\n<li>Hsiao-Chun Chang, Cheng-Han Fan, Yi-Chia Chou, and <strong>Kuan-Neng Chen<\/strong>, \u201cStudy of Self-Assembly Technology for 3D Integration Applications,\u201d IMPACT 2015, Taipei, Taiwan, Oct. 21-23, 2015.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201c3D IC and Heterogeneous Integration: A Game Changer to Semiconductor, or Not?\u201d, CIE-GNYC 2015 Annual Convention, New York, NY, USA, Oct 17, 2015.<\/li>\n<li>Shu-Lin Lu, Yen-Pin Huang, Yu-Shang Huang, Yi-Hsiu Tseng, Min-Fong Shu, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications,\u201d 2015 IEEE International Conference on Solid State Devices and Materials (SSDM), Sapporo, Japan, Sep 27-30, 2015.<\/li>\n<li>Cheng-Hsien Lu, Jian-Yu Shih, Yu-Wei Chang, Yi-Tung Kho, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Packaging Approach of SAW Devices Using 3D IC Technology,\u201d Symposium on Nano Device Technology, Hsinchu, Taiwan, Sep. 10, 2015.<\/li>\n<li>Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D Integration,\u201d IEEE 3D System Integration Conference, Sendai, Japan, Aug. 31-Sep 2, 2015.<\/li>\n<li>Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAn Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration,\u201d IEEE 3D System Integration Conference, Sendai, Japan, Aug. 31-Sep 2, 2015.<\/li>\n<li>Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and <strong>Kuan-Neng Chen<\/strong>, \u201cHigh Transmittance Silicon Terahertz Polarizer Using Wafer Bonding Technology,\u201d SPIE Optics + Photonics 2015, San Diego, CA, USA, Aug. 9-13, 2015.<\/li>\n<li>Yu-Wei Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cFabrication and Reliability Investigation of Copper Pillar and Tapered Through Silicon Via (TSV) for Direct Bonding in 3D Integration,\u201d The 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015), Hsinchu, Taiwan, Jun. 29 \u2013 July 2, 2015.<\/li>\n<li>Tsung-Yen Tsai, Yao-Jen Chang, and <strong>Kuan-Neng Chen,<\/strong> \u201cQuality and Reliability Investigation of Ni\/Sn Transient Liquid Phase Bonding Technology,\u201d The 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015), Hsinchu, Taiwan, Jun. 29 \u2013 July 2, 2015.<\/li>\n<li>Yu-Sheng Hsieh, Ting-Ting Shen, Yu-San Chien, Yuko Shinozaki, Naohiko Kawasaki, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Cu\/In Bonding in 3D Integration,\u201d 2015 IEEE Conference on Electron Devices and Solid-State Circuits (EDSSC), Singapore, Jun. 1-4, 2015.<\/li>\n<li>Wen-Wei Shen, Hsiang-Hung Chang, Cheng-Ta Ko, Leon Tsai, Bor Kai Wang, Aric Shorey, Alvin Lee, Jay Su, Baron Chen, Wei-Chung Lo, and <strong>Kuan-Neng Chen<\/strong>, \u201cUltra-thin Glass Wafer Lamination and Laser De-bonding to Enable Glass Interposer Fabrication,\u201d 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 \u2013 29, 2015.<\/li>\n<li>Yu-Chen Hu, Yu-Sheng Hsieh, Anthony J. Gallegos, Wei-Chia Chen and <strong>Kuan-Neng Chen<\/strong>, \u201c3D Heterogeneous Integration Structure Based on 40 nm- and 0.18 \u03bcm- Technology Nodes,\u201d 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 \u2013 29, 2015.<\/li>\n<li>S. Hsieh, Y. J. Chang, and <strong>K. N. Chen<\/strong>, \u201cDevelopment and Electrical Investigation of Novel Fine-Pitch Cu\/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D Integration,\u201d 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 \u201329, 2015.<\/li>\n<li>Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Bonding of Cu\/Pd-Pd\/Cu Interconnects for Three-Dimensional Integration Applications\u201d, 2015 IEEE International Interconnect Technology Conference (IITC), Grenoble, France, May 18 -21, 2015.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cResearch Achievements and Application Demonstrations of 3D IC and Heterogeneous Integration,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar 15-16, 2015.<\/li>\n<li>Cheng-Hsien Lu, Yao-Jen Chang, Yu-Sheng Hsieh, Chuan-An Cheng, and <strong>Kuan-Neng Chen<\/strong>, \u201cHeterogeneous Integration of Si\/GaAs Wafer-Level Polyimide Bonding,\u201d International Electron Devices and Materials Symposium (IEDMS), Hualien, Taiwan, Nov 20-21, 2014.<\/li>\n<li>Jian-Yu Shih, Shih-Wei Lee, Yu-Chen Hu, Yen-Chi Chen, Chih-Hung Chiu, Chi-Chung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cAdvanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure,\u201d IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.<\/li>\n<li><strong><em>[IMPACT-EMAP 2014 Paper Award]<\/em><\/strong> Shih-Wei Lee, Jian-Yu Shih, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, and <strong>Kuan-Neng Chen<\/strong>, \u201cPolymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicle,\u201d IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.<\/li>\n<li><strong><em>[IMPACT-EMAP 2014 Paper Award]<\/em><\/strong> Chien-Min Liu, Han-wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, <strong>Kuan-Neng Chen<\/strong>, and K. N. Tu, \u201cLow-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces,\u201d IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.<\/li>\n<li>Cheng-Han Fan, Yao-Jen Chang, Yi-Chia Chou, and <strong>Kuan-Neng Chen<\/strong>, \u201cInterdiffusion of Cu-Sn System with Ni Ultra-thin Buffer Layer and Material Analysis of IMC Growth Mechanism,\u201d IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.<\/li>\n<li>Yu-Chen Hu, Yao-Jen Chang, Chun-Shen Wu, Yung Mao Cheng, Wei Jen Chen, and <strong>Kuan-Neng Chen<\/strong>, \u201cResearch of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous Integration,\u201d IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.<\/li>\n<li>Yao-Jen Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment and Material Analyses of Novel Sub-10\u03bcm Cu\/Sn Wafer Bonding Technology for 3D Integration,\u201d The 40th International Conference on Micro and Nano Engineering (MNE 2014), Lausanne, Switzerland, Sep 22-26, 2014.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, and <strong>Kuan-Neng Chen<\/strong>, \u201cImprovement of Motional Resistance through Concave TSV Design and Modification for Static Capacitance of TSV-Based Resonator,\u201d 2014 International Conference on Solid State Devices and Materials (SSDM), Tsukuba, Japan, Sep 8-11, 2014.<\/li>\n<li>Yao-Jen Chang, Yu-Sheng Hsieh, Cheng-Ta Ko, Wei-Chung Lo, Fan-Yi Ouyang, Chun-Shen Wu, Yung Mao Cheng, Wei Jen Chen, and <strong>Kuan-Neng Chen<\/strong>, \u201cJoule Heating Induced Bonding Interface Improvement and Ti Breakthrough by Electron Bombardment for 40-\u03bcm Pitch of Cu TSV and Cu\/Sn \u03bc-Bump Pair\u201d, 2014 International Conference on Solid State Devices and Materials (SSDM 2014), Tsukuba, Japan, Sep 8-11, 2014.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cMaterial Design for Challenging Heterogeneous Applications of 3D IC and Low Temperature Wafer Bonding,\u201d IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> Chien-Min Liu, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, <strong>Kuan-Neng Chen<\/strong>, and K. N. Tu, \u201cLow-Temperature and Low-Pressure Direct Copper-to-copper Bonding,\u201d IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.<\/li>\n<li>Yao-Jen Chang, Cheng-Han Fan, and <strong>Kuan-Neng Chen<\/strong>, \u201cMechanism of Novel Sub-Micron Cu\/Sn Bond System with Ultra-Thin Ni Buffer Layer for 3D Integration,\u201d IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.<\/li>\n<li>Y. Shih, W. C. Huang, C. T. Ko, Z. Yang, S. X. Hu, J. P. Leu, K. C. Chou, and <strong>K. N. Chen<\/strong>, \u201cInvestigations of Interfacial Adhesion between Cu, Al, Co or Ti and Benzocyclobutene (BCB) Polymer Dielectric in 3D Integration,\u201d IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.<\/li>\n<li>Tang-Hsuan Wang, Po-Tsang Huang, <strong>Kuan-Neng Chen<\/strong>, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, and Wei Hwang, \u201cEnergy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing Applications,\u201d 2014 IEEE International Symposium on Circuits and Systems (ISCAS), Melbourne, Australia, June 1-5, 2014.<\/li>\n<li>Lei-Chun Chou, Shih-Wei Lee, Po-Tsang Huang, Chih-Wei Chang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cIntegrated Microprobe Array and CMOS MEMS by TSV Technology for Bio-Signal Recording Application,\u201d 2014 IEEE Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, May 27 \u2013 May 30, 2014.<\/li>\n<li>Shimin Sun, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Temporary Bonding\/De-Bonding Solution to Realize High Compatibility and Cost Performance in 3D Integration,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE 2014), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Tsung-Han Yu, Shih-Wei Lee, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Adhesive to Oxide Temporary Bonding for 3-D IC Applications,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Wan-Lin Tsai, Kuang-Yu Wang, Yao-Jen Chang, Yun-Shan Chien, <strong>Kuan-Neng Chen<\/strong>, Huang-Chung Cheng, \u201cConductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Chih Chen, Chien-Min Liu, <strong>Kuan-Neng Chen<\/strong>, King-Ning Tu, \u201cLow-temperature and low-pressure direct copper-to-copper bonding,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Shu-Chiao Kuo, Shih-Wei Lee, Yao-Jen Chang, Yan-Pin Huang, Ting-Yang Yu, and <strong>Kuan-Neng Chen<\/strong>, \u201cElectrical Stacking Error Measurement Structure in Three-Dimensional Integration,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cNovel Quartz Resonator Device Using TSV, 3D Integration, and Si Hermetic Packaging Technologies,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Chuan-An Cheng, Cheng-Hsien Lu, Dian-Rong Lyu, Yu-Sheng Hsieh, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Low Temperature Polymer Wafer Bonding for Heterogeneous Integration in 3D Application,\u201d IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, and <strong>Kuan-Neng Chen<\/strong>, \u201cA Novel Si-based X\u2019tal Oscillator Device Using 3D Integration Technologies,\u201d 2014 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 28-30, 2014.<\/li>\n<li>Lei-Chun Chou, Shih-Wei Lee, Chuan-An Cheng, Po-Tsang Huang, Chih-Wei Chang, Cheng-Hao Chiang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cA TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array,\u201d 2014 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 28-30, 2014.<\/li>\n<li>Shang-Lin Wu, Po-Tsang Huang, Teng-Chieh Huang, <strong>Kuan-Neng Chen<\/strong>, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang and Wei Hwang, \u201cEnergy-Efficient Low-Noise 16-Channel Analog Front-End Circuit for Bio-potential Acquisition,\u201d 2014 IEEE International Symposium on VLSI Design, Automation and Test (VLSI-DAT), Hsinchu, Taiwan, April 28-30, 2014.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment of Key Technologies, Schemes, and Applications in 3D\/2.5D Integration,\u201d China Semiconductor Technology International Conference, Shanghai, China, Mar 16-17, 2014.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> Shu-Chiao Kuo, Yao-Jen Chang, Jian-Yu Shih, Cheng-Ta Ko, and <strong>Kuan-Neng Chen<\/strong>, \u201cDevelopment and Investigation of 3D Integration Schemes Using TSV, Bonding and Thinning Technologies,\u201d International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Nov 28-29, 2013.<\/li>\n<li>Ming-Fang Lai, Cheng-Hsien Lu, and <strong>Kuan-Neng Chen,<\/strong> \u201cAn Overview of ESD Issue with TSV in 3D-IC Fabrication\u201d, 2013 Taiwan ESD and Reliability Conference, Hsinchu, Taiwan, Nov 4-6, 2013.<\/li>\n<li>Teng-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, <strong>Kuan-Neng Chen<\/strong>, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang and Wei Hwang, \u201cArea-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing Applications,\u201d 2013 IEEE Biomedical Circuits and Systems Conference (BiOCAS), Rotterdam, the Netherlands, Oct. 31 \u2013 Nov. 2, 2013, pp. 238-241.<\/li>\n<li>P. Huang, Y. S. Chien, R. N. Tzeng, M. S. Shy, T. H. Lin, K. H. Chen, C. T. Chuang, W. Hwang, C. T. Chiu, H. M. Tong, and <strong>K. N. Chen<\/strong>, \u201cLow Temperature (&lt;180<strong>\uf0b0C<\/strong>) Bonding for 3D Integration\u201d, IEEE 3D System Integration Conference, San Francisco, CA, USA, Oct. 2-4, 2013.<\/li>\n<li>Yao-Jen Chang, Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, Tsung-Han Yu, Wei-Chung Lo, and <strong>Kuan-Neng Chen,<\/strong> \u201cEvaluation of Power Dissipation and Delay for New TSV Design Based on Cu\/Sn to BCB Hybrid Bonding,\u201d 2013 International Conference on Solid State Devices and Materials (SSDM 2013), Fukuoku, Japan, Sep 24-27, 2013.<\/li>\n<li>Ruoh-Ning Tzeng, Yen-Pin Huang, Yu-San Chien, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Bonding of Sn\/In-Cu Interconnects for Three-Dimensional Integration Applications,\u201d 2013 IEEE International Interconnect Technology Conference (IITC), Kyoto, Japan, Jun 13-15, 2013.<\/li>\n<li>Jian-Yu Shih, Yen-Chi Chen, Cheng-Hao Chiang, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, and <strong>Kuan-Neng Chen<\/strong>, \u201cTSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies,\u201d 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 \u2013 May 31, 2013.<\/li>\n<li>J. Chang, C. T. Ko, Z. C. Hsiao, J. H. Huang, C. H. Chiang, H. C. Fu, T. H. Yu, F. C. Han, W. C. Lo, <strong>K. N. Chen<\/strong>, \u201cElectrical Investigation and Reliability of 3D Integration Platform Using Cu TSVs and \u03bc-bumps with Cu\/Sn-BCB Hybrid Bonding,\u201d 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 \u2013 May 31, 2013.<\/li>\n<li>S. Chien, Y. P. Huang, R. N. Tzeng, M. S. Shy, T. H. Lin, K. H. Chen, C. T. Chuang, W. Hwang, C. T. Chiu, H. M. Tong, <strong>K. N. Chen<\/strong>, \u201cLow Temperature (&lt;180 C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D Integration,\u201d 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 \u2013 May 31, 2013, pp. 1146-1152.<\/li>\n<li>Ming-Hung Chang, Wei-Chih Hsieh, Pei-Chen Wu, Ching-Te Chuang, <strong>Kuan-Neng Chen<\/strong>, Wei Hwang, Chen-Chao Wang, Kuo-Hua Chen, Chi-Tsung Chiu, and Ho-Ming Tong, \u201cMulti-Layer Adaptive Power Management Architecture for TSV 3-D IC Technology,\u201d 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 \u2013 May 31, 2013, pp. 1179-1185.<\/li>\n<li>Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Olesya Zakoretska, Ching-Te Chuang, <strong>Kuan-Neng Chen<\/strong>, Chen-Chao Wang, Kua-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Wei Hwang, \u201cNear-\/Sub-Vth Process, Voltage, and Temperature (PVT) Sensors with Dynamic Voltage Selection\u201d, 2013 IEEE International Symposium on Circuits and Systems (ISCAS), Beijing China, May 19-23, 2013, pp. 133-136.<\/li>\n<li>Hsiao-Yu Chen, Sheng-Yao Hsu, and <strong>Kuan-Neng Chen<\/strong>, \u201cCo-sputtered Cu\/Ti Bonded Interconnects for 3D Integration Applications,\u201d The 20<sup>th<\/sup> International Symposium on VLSI Technology, Systems and Applications (2013 VLSI-TSA), Hsinchu, Taiwan, Apr 22-24, 2013.<\/li>\n<li>Shih-Wei Lee, Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, &#8220;Integration, Electrical Performance and Reliability Investigation of TSV&#8221;, IMAPS 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, USA, Mar 12-14, 2013.<\/li>\n<li>P. Huang, R. N. Tzeng, Y. S. Chien, M. S. Shy, H. S. Chang, T. H. Lin, K. H. Chen, C. T. Chiu, Y. E. Yeh, W. Hwang, C. T. Chuang, J. C. Chiou, H. M. Tong, <strong>K. N. Chen<\/strong>, \u201cLow Temperature Cu-Sn and Sn-Sn Bonding Development for 3D Interconnect Applications\u201d, International Electron Devices and Materials Symposium (IEDMS) 2012, Kaohsiung, Taiwan, Nov 29-30, 2012.<\/li>\n<li>Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cStudy of TSV Formation with ICP Parameter Control\u201d, Proceedings of the 34th International Symposium on Dry Process, Tokyo, Japan, Nov 15-16, 2012, pp. 127-128.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cFabrication and Evaluation of TSV and Bonded Structures for 3D Integration,\u201d The 7<sup>th<\/sup> IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.<\/li>\n<li>Cheng-Hao Chiang, Yu-Chen Hu, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration\u201d, Proceedings of the 7<sup>th<\/sup> IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012, pp. 56-59.<\/li>\n<li>Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and <strong>Kuan-Neng Chen, <\/strong>\u201cMicro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations\u201d, Proceedings of the 7<sup>th<\/sup> IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012, pp. 367-369.<\/li>\n<li>Hsing-Han Ho, Cheng-Ta Ko, Yao-Jen Chang, <strong>Kuan-Neng Chen<\/strong>, \u201cInvestigation of Oxide Bonding from Different Species for 3D Integration and MEMS Applications\u201d, The 7<sup>th<\/sup> IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong> C. Lo, C. Ta Ko, and <strong>K. N. Chen<\/strong>, \u201c3D Integration with Wafer-to-Wafer Bonding,\u201d 2012 International Conference on Solid State Devices and Materials (SSDM 2012), Kyoto, Japan, Sep 25-27, 2012.<\/li>\n<li>Chuan-An Cheng, Cheng-Hsien Lu, Chia-Hua Ho, and <strong>Kuan-Neng Chen,<\/strong> \u201cInvestigation of Electrical Performances for n-MOSFET Devices Integrating with Bonding and Thinning Technologies in 3D Integration,\u201d 2012 International Conference on Solid State Devices and Materials (SSDM 2012), Kyoto, Japan, Sep 25-27, 2012.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cMaterial Analyses and Morphology Investigations of Cu-Based Bonding Technology for 3D Integration,\u201d IUMRS-ICEM 2012, Yokohama, Japan, Sep 23-28, 2012.<\/li>\n<li>Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, <strong>Kuan-Neng Chen<\/strong>, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong and Wei Hwang, \u201cOn-Chip Self-Calibrated Process-Temperature Sensor For TSV 3D Integration\u201d\u00a0 2012 IEEE International SoC Conference (SOCC), Niagara Falls, NY, USA, Sept. 12 -14, 2012, pp. 370-375.<\/li>\n<li>Po-Tsang Huang, Tzu-Ting Chiang, Herming Chiueh, Ching-Te Chuang, Jin-Chern Chiou, <strong>Kuan-Neng Chen,<\/strong> Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Wei Hwang, \u201cThermal Management with In-Situ Process-Temperature Sensor for TSV 3D-ICs\u201d, The 23<sup>rd<\/sup> VLSI Design\/CAD Symposium, Kenting, Taiwan, Aug 7-10, 2012.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cElectrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects,\u201d 2012 IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA, Jun 03-06, 2012.<\/li>\n<li>T. Ko, Z. C. Hsiao, Y. J. Chang, P. S. Chen, J. H. Huang, H. C. Fu, Y. J. Huang, C. W. Chiang, C. K. Lee, H. H. Chang, W. L. Tsai, S. H. Wu, S. S. Sheu, Y. H. Chen, W. C. Lo, and <strong>K. N. Chen<\/strong>, \u201cStructural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump\/Adhesive Hybrid Wafer Bonding,\u201d Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 &#8211; Jun 1, 2012.<\/li>\n<li>J. Chang, C. T. Ko, Z. C. Hsiao, T. H. Yu, Y. H. Chen, W. C. Lo, and <strong>K. N. Chen<\/strong>, \u201cElectrical Characterization and Reliability Investigations of Cu TSVs with Wafer-Level Cu\/Sn-BCB Hybrid Bonding,\u201d The 19<sup>th<\/sup> International Symposium on VLSI Technology, Systems and Applications (2012 VLSI-TSA), Hsinchu, Taiwan, Apr. 23-25, 2012.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cKey Technologies of 3D Integration: Schemes, Achievements, and Outlook\u201d, China Semiconductor Technology International Conference 2012, Shanghai, China, Mar 18-19, 2012.<\/li>\n<li><strong>K. N. Chen<\/strong>, Z. Xu, F. Liu, C. T. Ko, C. A. Cheng, W. C. Huang, H. L. Lin, C. Cabral, Z. C. Hsiao, N. Klymko, H. C. Fu, Y. H. Chen, J. Q. Lu, and W. C. Lo \u201cCu-Based Bonding Technology for 3D Integration Applications\u201d, IEEE 3D System Integration Conference, Osaka, Japan, Jan 31 \u2013 Feb 2, 2012.<\/li>\n<li>T. Ko, Z. C. Hsiao, Y. J. Chang, P. S. Chen, J. H. Huang, H. C. Fu, Y. J. Huang, C. W. Chiang, W. L. Tsai, Y. H. Chen, W. C. Lo, and <strong>K. N. Chen,<\/strong> \u201cWafer-Level 3D Integration with Cu TSV and Micro-bump\/Adhesive Hybrid Bonding Technologies\u201d, IEEE 3D System Integration Conference, Osaka, Japan, Jan 31 \u2013 Feb 2, 2012.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cThree-Dimensional Integrated Circuits (3D IC): Schemes, Technologies, and Recent Research Achievements\u201d, International Electron Devices and Materials Symposium (IEDMS) 2011, Taipei, Taiwan, Nov 17-18, 2011.<\/li>\n<li>Yen-Pin Huang, Chuan-An Cheng, Cho-Lun Hsu, Chia-Hua Ho, and <strong>Kuan-Neng Chen<\/strong>, \u201cAchievement of Dense Through Silicon Via (TSV) for 3D Integration by Micro-Masking Free Process\u201d, International Electron Devices and Materials Symposium (IEDMS) 2011, Taipei, Taiwan, Nov 17-18, 2011.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cSchemes, Achievements, and Challenges of Key Technologies in Three-Dimensional Integrated Circuits (3D IC)\u201d, The 13<sup>th<\/sup> Photonics and Semiconductor Device Reliability Workshop, Hsinchu, Taiwan, Nov 4, 2011.<\/li>\n<li>C. Huang, C. T. Ko, S. H. Hu, J. P. Leu, and <strong>K. N. Chen,<\/strong> \u201cInvestigations of Adhesion between Cu and Benzocyclobutene (BCB) Polymer Dielectric for 3D Integration Applications\u201d, International Microsystems, Packaging, Assembly, and Circuit Technology Conference (IMPACT 2011), Taipei, Taiwan, Oct. 18-21, 2011.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen, <\/strong>\u201cWafer-Level Hybrid Bonding for 3D Integration\u201d, IUMRS-ICA 2011, Taipei, Taiwan, Sep 19-22, 2011.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen<\/strong> and Chuan Seng Tan, \u201c3-D Integration: Materials, Technologies, Schemes, and Applications\u201d, 2011 IEEE Custom Integrated Circuits Conference (CICC), San Jose, CA, Sep 18-21, 2011.<\/li>\n<li>Y. Hsu, J. Y. Shih, and <strong>K. N. Chen<\/strong>, \u201cDiffusion Behavior and Mechanism of Co-Sputtering Metals as Bonding Materials for 3D IC Interconnects during Annealing Treatment\u201d, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.<\/li>\n<li>L. Lin, W. C. Huang, and <strong>K. N. Chen,<\/strong> \u201cStudies of Oxide to Polymer Bonding for 3D IC\u201d, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.<\/li>\n<li>A. Cheng, C. T. Ko, and <strong>K. N. Chen,<\/strong> \u201cInvestigation of bonding temperature for SU-8 materials in wafer-level hybrid bonding technology for 3D IC\u201d, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen, <\/strong>\u201cThree-Dimensional Integrated Circuits (3D IC): Concept, Technology, and Outlook\u201d, 18<sup>TH<\/sup> Symposium on Nano Device Technology (SNDT), Hsinchu, Taiwan, Apr. 21-22, 2011.<\/li>\n<li><strong>K. N. Chen,<\/strong> C. A. Cheng, W. C. Huang, and C. T. Ko, \u201cAdhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration\u201d, 2011 TMS Meeting, San Diego, CA, Feb 27-Mar. 3, 2011.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen<\/strong>, \u201cTaiwan Research and Development Activities for 3D Integrated Circuits\u201d, 2010 International Conference of 3-D Architectures for Semiconductor Integration and Packaging, San Francisco CA, Dec. 8-10, 2010.<\/li>\n<li>Cheng-Ta Ko, <strong>Kuan-Neng Chen,<\/strong> Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, and Yu-Hua Chen, \u201cWafer-Level 3D Integration Using Hybrid Bonding\u201d, IEEE 3D IC International Conference, Munich, Germany, Nov. 16-18, 2010.<\/li>\n<li>Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, <strong>Kuan-neng Chen,<\/strong> Kenneth Rose, and Jian-Qiang Lu, \u201cCrosstalk Evaluation, Suppression and Modeling in 3D Through-Strata-Via (TSV) Network\u201d, IEEE 3D IC International Conference, Munich, Germany, Nov. 16-18, 2010.<\/li>\n<li>Ming-Fang Lai, Shu-Chuan Chen, Yen-Hsien Chen, Yu-Ti Su, Che-Hung Chen, Po-An Chen, Hung-Ming Chen and <strong>Kuan-Neng Chen<\/strong>, \u201cArea Efficient I\/O Circuit in High Pin Count IC\u201d, 2010 Taiwan ESD and Reliability Conference, Hsinchu, Taiwan, Oct. 25-27, 2010.<\/li>\n<li>Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, <strong>Kuan-Neng Chen, <\/strong>Wei-Chung Lo, and Yu-Hua Chen, \u201cWafer-to-Wafer Hybrid Bonding Technology for 3D IC\u201d, Electronics System Integration Technology Conferences (ESTC 2010), Berlin, Germany, Sep. 13-16, 2010.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Ming-Fang Lai, and Hung-Ming Chen, \u201cWafer-Level Three-Dimensional Integrated Circuits (3D IC): Schemes and Key Technologies\u201d, IUMRS-ICEM, Seoul, Korea, Aug. 22-27, 2010.<\/li>\n<li><strong>K. N. Chen, <\/strong>C. Cabral, Jr., S. H. Lee, P. S. Andry, and J. Q. Lu, \u201cInvestigations of Cu Bond Structures and Demonstration of a Wafer-Level 3D Integration Scheme with W TSVs\u201d, The 17<sup>th<\/sup> International Symposium on VLSI Technology, Systems and Applications (2010 VLSI-TSA), Hsinchu, Taiwan, Apr. 26-28, 2010.<\/li>\n<li><strong>K. N. Chen, <\/strong>Y. Zhu, W.W. Wu, and R. Reif, \u201cInvestigation and Effects of Wafer Bow in Different 3D Stacking Schemes\u201d, 2010 TMS, Seattle, WA, Feb 14-18, 2010.<\/li>\n<li>Cheng-Ta Ko, Wei-Chung Lo, <strong>Kuan-Neng Chen,<\/strong> Huan-Chun Fu, Zhi-Cheng, Hsiao, and Yu-Hua Chen \u201cPolymers Investigation for 3D IC Stacking Technology\u201d, 2010 TMS Meeting, Seattle, WA, Feb 14-18, 2010.<\/li>\n<li><strong><em>K. N. Chen,<\/em><\/strong> Y. Zhu, W. W. Wu, C. K. Tsang, S. H. Lee, and J. Q. Lu, \u201cFabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications\u201d, IEEE International NanoElectronics Conference (INEC) 2010, Hong Kong, Jan 3-8, 2010.<\/li>\n<li>W. Wu, K. C. Lu, <strong>K. N. Chen<\/strong>, and C. W. Wang, \u201cControlled large strain of Si in the NiSi\/Si\/NiSi nanowire heterostructure\u201d, IEEE International NanoElectronics Conference (INEC) 2010, Hong Kong, Jan 3-8, 2010.<\/li>\n<li><strong>K. N. Chen,<\/strong> Y. Zhu, W.W. Wu, and R. Reif, \u201cCopper Thin Film Research and Development for Wafer Bonding\u201d, TACT 2009 International Thin Films Conference, Taipei, Taiwan, Dec 14-16, 2009.<\/li>\n<li>W. Wu, <strong>K.N. Chen,<\/strong> and C. W. Wang, \u201cEnhanced growth of low-resistivity titanium silicides on epitaxial Si<sub>0.7<\/sub>Ge<sub>0.3<\/sub>on (001)Si with a sacrificial amorphous Si interlayer\u201d, TACT 2009 International Thin Films Conference, Taipei, Taiwan, Dec 14-16, 2009.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen<\/strong>, \u201cWafer-Level Alignment Technology for 3D Integration\u201d, The 4<sup>th<\/sup> IMPACT 2009 Conference and International 3D IC Conference, Taipei, Taiwan, Oct. 21-23, 2009.<\/li>\n<li><strong><em>[Invited] <\/em><\/strong>Chuan Seng Tan and <strong>Kuan-Neng Chen<\/strong>, \u201cLow Temperature Cu-Cu Bonding and Hybrid Cu\/Dielectric Bonding: An Enabling Technology for 3-D ICs Application\u201d, The 4<sup>th<\/sup> IMPACT 2009 Conference and International 3D IC Conference, Taipei, Taiwan, Oct. 21-23, 2009.<\/li>\n<li><strong><em>[Invited] <\/em>Kuan-Neng Chen<\/strong>, \u201cWafer-Level Copper Bonding Technology in 3D ICs\u201d, 21<sup>6th<\/sup> ECS Meeting, Vienna, Austria, Oct. 4-9, 2009.<\/li>\n<li><strong>K. N. Chen<\/strong> and L. Krusin-Elbaum, \u201cCMOS-Technology Compatible Programmable Via using Phase-Change Materials\u201d, 2009 Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Hamilton, Ontario, Canada, Aug 10-14, 2009.<\/li>\n<li><strong>K. N. Chen,<\/strong> E.A. Joseph, J.C. Arnold, and N. Ruiz, \u201cFabrication of robust self-aligned nano-scale tubular structures and templates for device applications\u201d, 2009 Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Hamilton, Ontario, Canada, Aug 10-14, 2009.<\/li>\n<li><strong>K. N. Chen<\/strong>, C. Cabral Jr., L. Krusin-Elbaum, \u201cSegregation of Te and Irreversible Modification in Ge<sub>2<\/sub>Sb<sub>2<\/sub>Te<sub>5<\/sub> Phase Change Material\u201d, E-MRS 2008 Spring Meeting, Strasburg, France, May 26-30, 2008.<\/li>\n<li>Sang Hwui Lee,<strong> Kuan-Neng Chen<\/strong>, Douglas C. La Tulipe, Albert M. Young, and Jian-Qiang Lu, \u201cThermal Process Induced Wafer-to-Wafer Misalignment for 3D Interconnects\u201d, 2008 International Conference and Exhibition on Device Packaging, Scottsdale AZ, March 17-20, 2008.<\/li>\n<li>Albert M. Young, Douglas C. La Tulipe, Leathen Shi, <strong>Kuan-Neng Chen<\/strong>, Roy R. Yu, and Steven J. Koester, \u201cCritical process technologies in 3D integration\u201d, Government Microcircuit Applications &amp; Critical Technology Conference, Las Vegas NV, March 17-20, 2008.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>Kuan-Neng Chen<\/strong>, \u201cScience, Materials, and Process Technology of Cu Bonding for 3D Integration\u201d, 2007 International Conference and Exhibition on Device Packaging, Scottsdale AZ, March 19-22, 2007.<\/li>\n<li>Cabral Jr., L. Krusin-Elbaum, <strong>K.N. Chen<\/strong>, M. Copel, J. Bruley, V.R. Deline, \u201cEvidence for segregation of Te in \u201cphase-change\u201d thin chalcogenide Ge-Sb-Te films\u201d, APS March Meeting 2007, Denver CO, March 5-9, 2007.<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> S. Tan, <strong>K. N. Chen<\/strong>, A. Fan, A. Chandrakasan, and R. Reif, \u201cSilicon Layer Stacking Enabled by Wafer Bonding,\u201d Materials Research Society Symposium Proceedings 970, pp. 193-204, Boston, MA, Nov 27 \u2013 Dec 1, 2006<\/li>\n<li><strong><em>[Invited]<\/em><\/strong> <strong>K. N. Chen<\/strong>, C.K. Tsang, A.W. Topol, S.H. Lee, B.K. Furman, D.L. Rath, J.-Q. Lu, A.M. Young, S. Purushothaman, and W. Haensch, \u201cImproved Manufacturability of Cu Bond Pads and Implementation of Seal Design in 3D Integrated Circuits and Packages\u201d, 23<sup>rd<\/sup> International VLSI Multilevel Interconnection (VMIC) Conference, Fremont CA, Sep.25-28, 2006.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Muhannad Bakir, James Meindl, and Rafael Reif, \u201cCopper Interconnect Bonding for Polymer Pillar I\/O Interconnects and Three-Dimensional (3D) Integration Application\u201d, 2006 Electronic Materials Conference, University PA, June 28-30, 2006.<\/li>\n<li><strong>K. N. Chen, <\/strong>and R. Reif, \u201cWafer Bow and Copper Wafer Bonding\u201d, APS March Meeting 2006, Baltimore MD, March 13-17, 2006.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> <strong>Kuan-Neng Chen,<\/strong> \u201cCopper Wafer Bonding for 3D Integration,\u201d IBM 3D Silicon Workshop on Silicon, Through Vias, Packaging and Module Assemblies, Yorktown Heights NY, March 7, 2006.<\/li>\n<li><strong>K. N. Chen,<\/strong> L Krusin-Elbaum, C. Cabral, C. Lavoie, J. Sun, S. Rossnagel, \u201cThermal stress evaluation of a PCRAM material Ge<sub>2<\/sub>Sb<sub>2<\/sub>Te<sub>5<\/sub>\u201d, 21st IEEE NVSMW (Non-Volatile Semiconductor Memory Workshop), pp. 97-98, Monterey CA, February 12-16, 2006.<\/li>\n<li>S. Tan, <strong>K. N. Chen,<\/strong> A. Fan,\u00a0and R. Reif, \u201cA Back-to-Face Silicon Layer Stacking for Three-Dimensional Integration\u201d, Proceedings of 2005 IEEE International SOI Conference, pp. 87-89, Honolulu Hi, October 3-6, 2005.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan and R. Reif, \u201cCopper Wafer Bonding: Interface Analysis and Characterization\u201d, Microscopy and Microanalysis 2005, Honolulu Hi, July 31 \u2013Aug. 4, 2005.<\/li>\n<li><strong><em>[<u>Invited<\/u>]<\/em><\/strong> Gutmann, J. Lu, J. Yu, <strong>K. N. Chen,<\/strong> and R. Reif, &#8220;Copper Metallization Needs for Wafer-Level, Three-Dimensional Integration&#8221;, 207th ECS meeting, Quebec City, Canada, May 15-20, 2005.<\/li>\n<li><strong>K. N. Chen, <\/strong>A. Fan, C. S. Tan and R. Reif, \u201cEffects of surface roughness and oxide formation of Cu film on the quality of Cu wafer bonding\u201d, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.<\/li>\n<li><strong><em>[<u>Invited<\/u>]<\/em>K. N. Chen, <\/strong>A. Fan, C. S. Tan and R. Reif, \u201cBonding parameters of Cu wafer bonding for 3D Integration\u201d, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.<\/li>\n<li><strong>K. N. Chen,<\/strong> S. M. Chang, L. C. Shen and R. Reif, \u201cUsing different test techniques to investigate the bond strength of Cu wafer bonding\u201d, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.<\/li>\n<li>S. Tan, A. Fan, <strong>K. N. Chen,<\/strong> and R. Reif, \u201cMultilayered Three-Dimensional Integration Enabled by Wafer Bonding,\u201d <em>SRC\/ISMT 7<sup>th<\/sup> Annual Topical Research Conference on Reliability<\/em>, University of Texas, Austin, TX, October 25-27, pp. 27, 2004.<\/li>\n<li><strong><em><u>[<\/u><\/em><\/strong><strong><em><u>Invited<\/u><\/em><\/strong><strong><em><u>]<\/u><\/em><\/strong> Reif, C. S. Tan, A. Fan, <strong>K. N. Chen,<\/strong> S. Das, and N. Checka, &#8220;Technology and Applications of Three-Dimensional Integration,\u201d 206<sup>th<\/sup> <em>Electrochemical Society Fall Meeting, <\/em>Honolulu, Hawaii, October 3-8, 2004<em>. <\/em>In <em>Dielectrics for Nanosystems: Materials, Science, Processing, Reliability, and Manufacturing<\/em>, R. Singh, H. Iwai, R. R. Tummala, and S. C. Sun, Editors, PV 2004-04, The Electrochemical Society Proceedings Series, Pennington, NJ, 2004.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> Reif, S. Das, A. Fan, <strong>K.-N. Chen,<\/strong> C. S. Tan, and N. Checka, \u201cTechnology, Performance, and Computer-Aided Design of Three-Dimensional Integrated Circuits,\u201d <em>International Symposium on Physical Design (ISPD 2004)<\/em>, Phoenix, Arizona, April 18-21, 2004.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> Reif, C.S. Tan, A. Fan, <strong>K. N. Chen,<\/strong> S. Das, and N. Checka, &#8220;Technology and Applications of Three-Dimensional Integration,\u201d <em>Pre-conference Symposium, RTI\/ISMT 3D Architectures for Semiconductor Integration and Packaging Conference<\/em>, April 13-15, 2004, Burlingame, CA.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> Reif, C. S. Tan, A. Fan, and <strong>K. N. Chen,<\/strong> \u201cThree-dimensional Integration Enabled by Wafer Bonding and Layer Transfer,\u201d <em>Applied Materials Inc Workshop<\/em>, Santa Clara, CA, January 16, 2004.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan and R. Reif, \u201cAbnormal Contact Resistance Reduction in Bonded Cu Interconnects Using Pre-Bonding HCl Cleaning&#8221;,\u00a0MRS Fall Meeting, Boston MA, December 2003.<\/li>\n<li><strong>K. N. Chen,<\/strong> A. Fan, C. S. Tan and R. Reif, \u201cRelation of Contact Resistance Reduction and Process Parameters of Bonded Copper Interconnects in Three-Dimensional Integration Technology\u201d, Proceedings of 2003 ECS meeting, Orlando FL, October 2003.<\/li>\n<li><strong>K. N. Chen,<\/strong> Andy Fan, Chuan Seng Tan, and Rafael Reif, \u201cEvolution of Microstructure During Copper Wafer Bonding\u201d, 2003 TMS meeting, San Diego CA, March 2003.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> Reif, C. S. Tan, A. Fan, <strong>K. N. Chen,<\/strong> S. Das, and N. Checka, \u201c3-D Interconnects Using Cu Wafer Bonding : Technology and Applications,\u201d <em>Adcanced Metallization Conference (AMC), <\/em>October 1-3, 2002, San Diego, CA. In Melnick <em>et<\/em> <em>al<\/em>, Advanced Metallization Conference 2002, Materials Research Society, pp 37-45, Spring 2003.<\/li>\n<li><strong><em><u>[Invited]<\/u><\/em><\/strong> Reif, C. S. Tan, A. Fan, <strong>K. N. Chen,<\/strong> S. Das, and N. Checka, &#8220;3-D Integration using Cu-Cu Wafer Bonding,&#8221; <em>DARPA 3-D Microelectronics Integration Workshop<\/em>, San Diego, CA, July 10, 2002.<\/li>\n<li>Fan, S. Das, <strong>K. N. Chen,<\/strong> and R. Reif, \u201cFabrication Technologies for Three-Dimensional Integrated Circuits,\u201d IEEE International Symposium on Quality Electronic Design, pp. 33-37, 2002.<\/li>\n<li><strong><em>[<u>Invited<\/u>]<\/em><\/strong> Fan, <strong>K. N. Chen,<\/strong> and R. Reif, \u201cThree-Dimensional Integration with Copper Wafer Bonding\u201d, Electrochemical Society Spring Meeting, ULSI Process Integration Symposium, pp. 124-132, Proceedings Volume 2001-2, Washington D.C., March 25-29, 2001.<\/li>\n<li>Woei Wu Pai, Y. H. Peng, W. F. Chung, S. Y. Wang, <strong>K. N. Chen<\/strong><strong>,<\/strong> and H. H. Cheng, &#8220;Unusual Surface Undulations Observed in Low Temperature Ge\/Si(100) Epitaxy&#8221;, MRS fall meeting proceedings, Session P10.7, Boston MA, December 2000.<\/li>\n<li>H. Lin, <strong>K. N. Chen<\/strong><strong>,<\/strong> S. L. Cheng, Y.C. Peng, G.H. Shen, L.J. Chen, and C.R. Chen, &#8220;Interfacial Reaction of Metal Thin Films on Ion Implanted Silicon Under High Current Density&#8221;, IUMRS-ICEM-98, Korea.<\/li>\n<li><strong><em>[<u>Invited<\/u>]<\/em><\/strong> J. Chen, <strong>K. N. Chen,<\/strong> H. H. Lin; S. L. Cheng, Y. C. Peng, G. H. Shen, C.R. Chen, &#8220;Silicide Formation in Implanted Channels and Polarity Effects of Ni and Co Contacts Under High Current Density&#8221;, IEEE International Conference on Ion Implantation Technology, Kyoto, Japan, pp. 837-840, June 1998.<\/li>\n<\/ol>\n<\/div><\/section><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":10,"featured_media":0,"parent":3221,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v16.8 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>\u570b\u969b\u6703\u8b70 - \u570b\u7acb\u967d\u660e\u4ea4\u901a\u5927\u5b78 \u96fb\u5b50\u6240 3DIC LAB<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/3dic.lab.nycu.edu.tw\/zh-hant\/publications\/conference\/\" \/>\n<meta property=\"og:locale\" content=\"zh_TW\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"\u570b\u969b\u6703\u8b70 - 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