{"id":3230,"date":"2021-10-12T11:18:19","date_gmt":"2021-10-12T03:18:19","guid":{"rendered":"https:\/\/3diclab.pro7.designworks.tw\/?page_id=3230"},"modified":"2026-05-17T15:27:31","modified_gmt":"2026-05-17T07:27:31","slug":"patent","status":"publish","type":"page","link":"https:\/\/3dic.lab.nycu.edu.tw\/zh-hant\/publications\/patent\/","title":{"rendered":"\u5c08\u5229"},"content":{"rendered":"\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-eo7nom6-cb20af6bc4f8fffdb9406d63997dc637\">\n.avia-section.av-eo7nom6-cb20af6bc4f8fffdb9406d63997dc637{\nbackground-repeat:no-repeat;\nbackground-image:url(https:\/\/3dic.lab.nycu.edu.tw\/wp-content\/uploads\/2021\/10\/banner-publications.jpg);\nbackground-position:50% 50%;\nbackground-attachment:scroll;\n}\n.avia-section.av-eo7nom6-cb20af6bc4f8fffdb9406d63997dc637 .av-section-color-overlay{\nopacity:0.5;\nbackground-color:#515151;\n}\n<\/style>\n<div id='banner'  class='avia-section av-eo7nom6-cb20af6bc4f8fffdb9406d63997dc637 main_color avia-section-default avia-no-border-styling  avia-builder-el-0  el_before_av_section  avia-builder-el-first  avia-full-stretch avia-bg-style-scroll av-section-color-overlay-active  av-minimum-height av-minimum-height-custom  container_wrap sidebar_right'  data-section-bg-repeat='stretch'><div class='av-section-color-overlay-wrap'><div class=\"av-section-color-overlay\"><\/div><div class='container av-section-cont-open' style='height:300px'><main  role=\"main\" itemprop=\"mainContentOfPage\"  class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-emc8zi6-750bff61fab37d3ec42cbf4668fdb669 sc-av_one_fifth av-equal-height-column-flextable'><div class='flex_column av-emc8zi6-750bff61fab37d3ec42cbf4668fdb669 av_one_fifth  avia-builder-el-1  el_before_av_three_fifth  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-ejoxwzi-59460b6572dffb8c13e336c5f2ab683d av_three_fifth  avia-builder-el-3  el_after_av_one_fifth  el_before_av_one_fifth  flex_column_table_cell av-equal-height-column av-align-bottom '   ><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  av_inherit_color '  style='color:#ffffff; '  itemprop=\"text\" ><h2 style=\"text-align: center; font-size: 23px; margin-bottom: -30px;\">&#8211; \u8457\u4f5c\u5c08\u5229 &#8211;<\/h2>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-kunryupd-5e1576e052643368ed4229852ca478a7\">\n#top .av-special-heading.av-kunryupd-5e1576e052643368ed4229852ca478a7{\npadding-bottom:10px;\ncolor:#ffffff;\n}\n.av-special-heading.av-kunryupd-5e1576e052643368ed4229852ca478a7 .special-heading-inner-border{\nborder-color:#ffffff;\n}\n<\/style>\n<div  class='av-special-heading av-kunryupd-5e1576e052643368ed4229852ca478a7 av-special-heading-h1 custom-color-heading blockquote modern-quote modern-centered  avia-builder-el-5  el_after_av_textblock  avia-builder-el-last  linkline av-thin-font '><h1 class='av-special-heading-tag '  itemprop=\"headline\"  ><strong>\u5c08\u5229<\/strong><\/h1><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/p><\/div><div class='av-flex-placeholder'><\/div><div class='flex_column av-efokxxq-a05c1599f0976af6effad316c258870a av_one_fifth  avia-builder-el-6  el_after_av_three_fifth  avia-builder-el-last  flex_column_table_cell av-equal-height-column av-align-bottom '   ><\/div><\/div><!--close column table wrapper. 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Autoclose: 1 --><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li><strong>Kuan-Neng Chen<\/strong>, Demin Liu, Yi-Chieh Tsai, and Han-Wen Hu, \u201cSemiconductor deviceand methodfor manufacturing the same,\u201d U.S. Patent12,601,866, filed onDec. 7, 2022, Issue Date: Apr.21, 2026.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Han-Wen Hu, Yi-Chieh Tsai, Yu-Jiu Wang, and Li Han Chang, \u201cAntenna Package Structure,\u201d U.S. Patent 12,418,103, filed on Dec. 14, 2022, Issue Date: Sep. 16, 2025.<\/li>\n<li>Han-Wen Hu, Demin Liu, Yi-Chieh Tsai, and <strong>Kuan-Neng Chen<\/strong>, and Shu-Chiao Kuo, \u201cBonding element and method for manufacturing the same,\u201d U.S. Patent 11,621,641, filed on Sep. 17, 2021, Issue Date: Apr. 4, 2023.<\/li>\n<li>Min-Fong Shu, Yi-Hsiu Tseng, <strong>Kuan-Neng Chen<\/strong>, and Shu-Chiao Kuo, \u201cBonding structure for semiconductor package and method of manufacturing the same,\u201d U.S. Patent 9,984,993, filed on Oct. 14, 2016, Issue Date: May. 29, 2018.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Wei-Chung Lo, and Cheng-Ta Ko, \u201cBonding structure and method of fabricating the same,\u201d U.S. Patent 9,931,813, filed on May 6, 2010, Issue Date: Apr. 3, 2018.<\/li>\n<li>Min-Fong Shu, Yi-Hsiu Tseng, <strong>Kuan-Neng Chen<\/strong>, and Shu-Chiao Kuo, \u201cSloped Bonding Structure for Semiconductor Package,\u201d U.S. Patent 9,496,238, filed on Feb. 13, 2015, Issue Date: Nov. 15, 2016.<\/li>\n<li>Wen-Wei Shen, <strong>Kuan-Neng Chen<\/strong>, and Cheng-Ta Ko, \u201cSemiconductor Device, Manufacturing Method and Stacking Structure Thereof,\u201d U.S. Patent 9,373,564, filed on Mar. 6, 2015, Issue Date: Jun. 21, 2016.<\/li>\n<li>Kuo-Hua Chen, Tzu-Hua Lin, <strong>Kuan-Neng Chen<\/strong>, and Yan-Pin Huang, \u201cSemiconductor Bonding Structure,\u201d U.S. Patent 9,196,595, filed on Feb. 27, 2014, Issue Date: Nov. 24, 2015.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Yao-Jen Chang, \u201cSubmicron Connection Layer and Method for Using The Same to Connect Wafers\u201d, U.S. Patent 8,951,837, filed on Sep. 6, 2012, Issue Date: Feb. 10, 2015.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang, \u201cBonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric,\u201d U.S. Patent 8,927,087, filed on Sep. 17, 2013, Issue Date: Jan. 6, 2015.<\/li>\n<li>Phaedon Avouris, <strong>Kuan-Neng Chen<\/strong>, Damon Farmer, and Yu-Ming Lin, \u201cGraphene Channel-Based Devices and Methods for Fabrication Thereof\u201d, U.S. Patent 8,900,918, filed on May 2, 2013, Issue Date: Dec. 2, 2014.<\/li>\n<li>Phaedon Avouris, <strong>Kuan-Neng Chen<\/strong>, Damon Farmer, and Yu-Ming Lin, \u201cGraphene Channel-Based Devices and Methods for Fabrication Thereof,\u201d U.S. Patent 8,878,193, filed on May 2, 2013, Issue Date: Nov. 4, 2014.<\/li>\n<li>Chi-Chung Chang, Chih-Hung Chiu, Yen-Chi Chen, <strong>Kuan-Neng Chen,<\/strong> Jian-Yu Shih, \u201cThrough Silicon Via-Based Oscillator Wafer-level-package Structure and Method for Fabricating the Same,\u201d U.S. Patent 8,766,734, filed on Jun. 22, 2012, Issue Date: Jul. 1, 2014.<\/li>\n<li>Phaedon Avouris, <strong>Kuan-Neng Chen, <\/strong>Damon Farmer, and Yu-Ming Lin, \u201cGraphene Channel-Based Devices and Methods for Fabrication Thereof\u201d, U.S. Patent 8,698,165, filed on May 2, 2013, Issued Date: Apr. 15, 2014.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Cheng-Ta Ko, and Wei-Chung Lo, \u201cHeterostructure Containing IC and LED and Method for Fabricating the Same,\u201d U.S. Patent 8,679,891, filed on Jan 2, 2014, Issue Date: Mar. 25, 2014.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Ming-Fang Lai, and Hung-Ming Chen, \u201cIntegrated Circuit Device\u201d, U.S. Patent 8,653,641, filed on Sep. 13, 2012, Issue Date: Feb. 18, 2014.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang, \u201cBonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric and Structures So Formed,\u201d U.S. Patent 8,617,689, filed on Apr. 10, 2012, Issue Date: Dec. 31, 2013.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Fei Liu, \u201cPrecise-aligned lock-and-key bonding structures\u201d, U.S. Patent 8,603,862, filed on May 14, 2010, Issue Date: Dec. 10, 2013.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Shih-Wei Li, \u201cStacking Error Measurement with Electrical Test Structure Applying 3D-ICs Bonding Technology\u201d, U.S. Patent 8,546,952, filed on Nov. 11, 2011, Issue Date: Oct. 1, 2013.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Cheng-Ta Ko, and Wei-Chung Lo, \u201cHeterostructure Containing IC and LED and Method For Fabricating the Same,\u201c U.S. Patent 8,536,613, filed on Sep 2, 2011, Issue Date: Sep. 17, 2013.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Sampath Purushothaman, \u201cProgrammable via devices\u201d, U.S. Patent 8,525,144, filed on Jul. 29, 2009, Issue Date: Sep. 3, 2013.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Sheng-Yao Hsu, \u201cBonding Method for Three-Dimensional Integrated Circuit and Three-Dimensional Integrated Circuit Thereof\u201d, U.S. Patent 8,508,041, filed on Dec. 14, 2011, Issued Date: Aug. 13, 2013.<\/li>\n<li>Phaedon Avouris, <strong>Kuan-Neng Chen,<\/strong> and Yu-Ming Lin, \u201cMethod to fabricate high performance carbon nanotube transistor integrated circuits by 3D integration technology\u201d, U.S. Patent 8,455,297, filed on July 7, 2010, Issued Date: Jun. 4, 2013.<\/li>\n<li>Phaedon Avouris, <strong>Kuan-Neng Chen, <\/strong>Damon Farmer, and Yu-Ming Lin, \u201cGraphene Channel-Based Devices and Methods for Fabrication Thereof\u201d, U.S. Patent 8,445,320, filed on May 20, 2010, Issued Date: May 21, 2013.<\/li>\n<li>Solomon Assefa, <strong>Kuan-Neng Chen<\/strong>, Yurii A. Vlasov, and Steven J. Koester, \u201cThree-dimensional integrated circuits and techniques for fabrication thereof\u201d, U.S. Patent 8,426,921, filed on Feb 1, 2011, Issued Date: Apr. 23, 2013.<\/li>\n<li>Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martna, Xiao Hu Liu, Dennis M. Newns, and <strong>Kuan-Neng Chen<\/strong>, \u201cCoupling piezoelectric material generated stresses to devices formed in integrated circuits\u201d, U.S. Patent 8,405,279, filed on Jun. 26, 2012, Issued Date: Mar. 26, 2013.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Sampath Purushothaman, \u201cProgrammable via devices\u201d, U.S. Patent 8,389,967, filed on Oct. 18, 2007, Issued Date: Mar. 5, 2013.<\/li>\n<li>Bruce G. Elmegreen, Lia Krusin-Elbaum, Glenn J. Martna, Xiao Hu Liu, Dennis M. Newns, and <strong>Kuan-Neng Chen<\/strong>, \u201cCoupling piezoelectric material generated stresses to devices formed in integrated circuits\u201d, U.S. Patent 8,247,947, filed on Dec. 7, 2009, Issued Date: Aug. 21, 2012.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman, \u201cProgrammable via devices in back of line level\u201d, U.S. Patent 8,243,507, filed on May 13, 2011, Issue Date: Aug. 21, 2012.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Bruce K. Furman, Sampath Purushothaman, David L. Rath, Anna W. Topol, and Cornelia K. Tsang, \u201cBonding of Substrates Including Metal-Dielectric Patterns with Metal Raised above Dielectric,\u201d U.S. Patent 8,241,995, filed on Sep. 18, 2006, Issue Date: Aug. 14, 2012.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, John Arnold and Niranja Ruiz, \u201cMethods of forming tubular objects\u201d, U.S. Patent 8,168,542, filed on Jan 3, 2008, Issue Date: May 1, 2012.<\/li>\n<li>Solomon Assefa, <strong>Kuan-Neng Chen,<\/strong> Yurii A. Vlasov, and Steven J. Koester, \u201cTechniques for three-dimensional circuit integration\u201d, U.S. Patent 8,129,811, filed on Apr 16, 2011, Issue Date: Dec 13, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Fei Liu, \u201cScalable transfer-join bonding lock-and-key structures\u201d, U.S. Patent 8,076,177, filed on May 14, 2010, Issue Date: Dec 13, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Lia Krusn-Elbaum, \u201cFour-terminal reconfigurable devices\u201d, U.S. Patent 8,053,752, filed on Jan. 8 2011, Issue Date: Nov 8, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, John Arnold, and Niranjana Ruiz, \u201cMethods of forming features in integrated circuits\u201d, U.S. Patent 8,012,811, Filing Date: Jan 3, 2008, Issue Date: Sep 6, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, \u201cCMOS-process-compatible programmable via device\u201d, U.S. Patent 7,982,203, Filing Date: Feb 1, 2010, Issue Date: Jul 19, 2011.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman, \u201cProgrammable via devices with air gap isolation\u201d, U.S. Patent 7,977,203, Filing Date: Aug 20, 2009, Issue Date: Jul 12, 2011.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Lia Krusn-Elbaum, Dennis Newns, and Sampath Purushothaman, \u201cProgrammable via devices in back of line level\u201d, U.S. Patent 7,969,770, Filing Date: Aug. 3, 2007, Issue Date: Jun. 28, 2011.<\/li>\n<li>Solomon Assefa, <strong>Kuan-Neng Chen<\/strong>, Yurii A. Vlasov, and Steven J. Koester, \u201cTechniques for three-dimensional circuit integration\u201d, U.S. Patent 7,955,887, Filing Date: Jun. 3, 2008, Issue Date: Jun. 7, 2011.<\/li>\n<li>Matthew J. Breitwisch and <strong>Kuan-Neng Chen<\/strong>, \u201cWafer bonded access device for multi-layer phase change memory using lock-and-key alignment\u201d, U.S. Patent 7,927,911, Filing Date: Aug. 28, 2009, Issue Date: Apr. 19, 2011.<\/li>\n<li>Solomon Assefa, <strong>Kuan-Neng Chen<\/strong>, Yurii A. Vlasov, and Steven J. Koester, \u201cThree-dimensional integrated circuits and techniques for fabrication thereof\u201d, U.S. Patent 7,897,428, Filing Date: Jun 3, 2008, Issue Date: Mar 1, 2011.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Lia Krusin-Elbaum, Chung H. Lam, and Albert M. Young, \u201cProgrammable Via Structure and Method of Fabricating Same\u201d, U.S. Patent 7,888,164, Filing Date: Aug 8, 2009, Issue Date: Feb 15, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Lia Krusn-Elbaum, \u201cFour-terminal reconfigurable devices\u201d, U.S. Patent 7,880,157, Filing Date: Aug 19, 2009, Issue Date: Feb 1, 2011.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, \u201cCMOS-process-compatible programmable via device\u201d, U.S. Patent 7,811,933, Filing Date: Feb 1, 2010, Issue Date: Oct 12, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young, \u201cHermetic Seal and Reliable Bonding Structures for 3D Applications\u201d, U.S. Patent 7,786,596, Filing Date: Feb 27, 2008, Issue Date: Aug 31, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Lia Krusn-Elbaum, \u201cFour-terminal reconfigurable devices\u201d, U.S. Patent 7,772,582, Filing Date: July 11, 2007, Issue Date: Aug 10, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, \u201cCMOS-process-compatible programmable via device\u201d, U.S. Patent 7,687,309, Filing Date: Jun 28, 2007, Issue Date: Mar 30, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman, and Albert M. Young, \u201cHermetic Seal and Reliable Bonding Structures for 3D Applications\u201d, U.S. Patent 7,683,478, Filing Date: Feb 6, 2008, Issue Date: Mar 23, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Dennis Newns, Sampath Purushothaman, and Lia Krusn-Elbaum, \u201cProgrammable via devices with air gap isolation\u201d, U.S. Patent 7,659,534, Filing Date: Aug 3, 2007, Issue Date: Feb 9, 2010.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Lia Krusin-Elbaum, Chung H. Lam, and Albert M. Young, \u201cProgrammable Via Structure and Method of Fabricating Same\u201d, U.S. Patent 7,652,278, Filing Date: Dec 19, 2006, Issue Date: Jan 26, 2010.<\/li>\n<li><strong>Kuang-Neng Chen<\/strong>, Bruce G. Elmegreen, Doek-Kee Kim, Chandrasekharan Kothandaraman, Lia Krusin-Elbaum, Chung H. Lam, Dennis Newns, Byeongju Park, and Sampath Purushothaman, \u201cProgrammable fuse\/non-volatile memory structures in BEOL regions using externally heated phase change material\u201d, U.S. Patent 7,633,079, Filing Date: Sep. 6, 2007, Issue Date: Dec. 15, 2009.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Chung H. Lam, \u201cSwitch array of circuit and system using programmable via structures with phase change materials\u201d, U.S. Patent 7,608,851, Filing Date: May 8, 2007, Issue Date: Oct 27, 2009.<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, and Chung H. Lam, \u201cFour-terminal programmable via-containing structure and method of fabricating same\u201d, U.S. Patent 7,579,616, Filing Date: Apr 10, 2007, Issue Date: Aug 25, 2009.<\/li>\n<li>Rafael Reif, <strong>Kuan-Neng Chen<\/strong>, Chuan Seng Tan, and Andy Fan, \u201cMethod of Forming a Multi-Layer Semiconductor Structure Incorporating a Processing Handle Member,\u201d U.S. Patent 7,307,003, Filing Date: Dec 30, 2003, Issue Date: Dec 11, 2007.<\/li>\n<\/ol>\n<\/div><\/section>\n\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='country2'  class='avia-section av-24lmrdq-cb2d5e7b8e2c6aed043bcd545f8244b4 main_color avia-section-default avia-no-border-styling  avia-builder-el-41  el_after_av_section  el_before_av_section  avia-bg-style-scroll  container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-2342tim-b2aff46045ba925e3a3ed1e0ea562e2a sc-av_one_full av-equal-height-column-flextable'><div class='flex_column av-2342tim-b2aff46045ba925e3a3ed1e0ea562e2a av_one_full  avia-builder-el-42  el_before_av_textblock  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-top '   ><style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-21u7l2m-f780b555dcfcb9607efa68af31901723\">\n#top .av-special-heading.av-21u7l2m-f780b555dcfcb9607efa68af31901723{\npadding-bottom:10px;\n}\n<\/style>\n<div  class='av-special-heading av-21u7l2m-f780b555dcfcb9607efa68af31901723 av-special-heading-h2 blockquote modern-quote  avia-builder-el-43  avia-builder-el-no-sibling  '><h2 class='av-special-heading-tag '  itemprop=\"headline\"  >\u5c08\u5229\u570b\u5225\uff1a\u65e5\u672c<\/h2><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. Autoclose: 1 --><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u80e1\u701a\u6587, \u8521\u9038\u6770, \u738b\u6bd3\u99d2, \u5f35\u7acb\u7ff0, \u201c\u30a2\u30f3\u30c6\u30ca\u30d1\u30c3\u30b1\u30fc\u30b8\u201d , \u7279\u8a31\u7b2c 7620343 \u865f, filed on Jun. 13, 2023, Issue Date: Jan. 15, 2025.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u674e\u4e16\u5049, \u201c\u4e09\u6b21\u5143\u96c6\u7a4d\u56de\u8def\u201d, \u7279\u8a31\u7b2c5624081\u865f, filed on May 22, 2012, Issue Date: Oct 3, 2014.<\/li>\n<\/ol>\n<\/div><\/section>\n\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='country3'  class='avia-section av-4vmiim-f60aec75e3cdb0e5ad27864a824554a4 main_color avia-section-default avia-no-border-styling  avia-builder-el-45  el_after_av_section  el_before_av_section  avia-bg-style-scroll  container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-1an2yge-212a90247b01362b19d60a821ecda25a sc-av_one_full av-equal-height-column-flextable'><div class='flex_column av-1an2yge-212a90247b01362b19d60a821ecda25a av_one_full  avia-builder-el-46  el_before_av_textblock  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-top '   ><style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-g5cf2-476bfacf8abf849fb1493a1fd485a2cc\">\n#top .av-special-heading.av-g5cf2-476bfacf8abf849fb1493a1fd485a2cc{\npadding-bottom:10px;\n}\n<\/style>\n<div  class='av-special-heading av-g5cf2-476bfacf8abf849fb1493a1fd485a2cc av-special-heading-h2 blockquote modern-quote  avia-builder-el-47  avia-builder-el-no-sibling  '><h2 class='av-special-heading-tag '  itemprop=\"headline\"  >\u5c08\u5229\u570b\u5225\uff1a\u97d3\u570b<\/h2><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. Autoclose: 1 --><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u80e1\u701a\u6587, \u8521\u9038\u6770, \u738b\u6bd3\u99d2, \u5f35\u7acb\u7ff0, \u201cAntenna Package Structure\u201d , Korea Patent No. 10-2774108, filed on Jun. 9, 2023, Issue Date: Feb. 24, 2025.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u5f90\u8056\u582f, \u201c\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u4e4b\u63a5\u5408\u65b9\u6cd5\u53ca\u5176\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u201d, Korea Patent No. 10-1384131, filed on Feb. 3, 2012, Issue Date: Apr. 4, 2014.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u674e\u4e16\u5049, \u201cStacking Error Measurement with Electrical Test Structure Applying 3D-ICs Bonding Technology\u201d, Korea Patent No. 10-1373267, filed on Nov. 10, 2011, Issue Date: Mar. 5, 201<\/li>\n<li><strong>Kuan-Neng Chen<\/strong>, Cheng-Ta Ko, and Wei-Chung Lo, \u201cHeterostructure Containing IC and LED and Method For Fabricating the Same,\u201c Korean Patent 10-1259308, filed on Aug 31, 2011, Issue Date: Apr. 23, 2013.<\/li>\n<li><strong>Kuan-Neng Chen,<\/strong> Ming-Fang Lai, and Hung-Ming Chen, \u201cESD Protection Structure for 3D IC\u201d, Korea Patent 10-1227872, filed on Apr. 20, 2011, Issued Date: Jan. 24, 2013.<\/li>\n<\/ol>\n<\/div><\/section>\n\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='country4'  class='avia-section av-chrzfy-83741fe914bbd6290a770934d4f9c3a8 main_color avia-section-default avia-no-border-styling  avia-builder-el-49  el_after_av_section  el_before_av_section  avia-bg-style-scroll  container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-3ewj4b2-7fcfe61a3368432bb5eaf93b4475822c sc-av_one_full av-equal-height-column-flextable'><div class='flex_column av-3ewj4b2-7fcfe61a3368432bb5eaf93b4475822c av_one_full  avia-builder-el-50  el_before_av_textblock  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-top '   ><style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-c7fgy6-8475fa50344f176c316e41a0556f5966\">\n#top .av-special-heading.av-c7fgy6-8475fa50344f176c316e41a0556f5966{\npadding-bottom:10px;\n}\n<\/style>\n<div  class='av-special-heading av-c7fgy6-8475fa50344f176c316e41a0556f5966 av-special-heading-h2 blockquote modern-quote  avia-builder-el-51  avia-builder-el-no-sibling  '><h2 class='av-special-heading-tag '  itemprop=\"headline\"  >\u5c08\u5229\u570b\u5225\uff1a\u4e2d\u83ef\u6c11\u570b<\/h2><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. Autoclose: 1 --><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u80e1\u701a\u6587, \u8521\u9038\u6770, \u738b\u6bd3\u99d2, \u5f35\u7acb\u7ff0, \u201c\u5929\u7dda\u5c01\u88dd\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229I819923, filed on Dec. 14, 2022, Issued Date: Oct. 21, 2023.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u8521\u9038\u6770, \u5289\u5fb7\u6c11, \u80e1\u701a\u6587, \u201c\u534a\u5c0e\u9ad4\u88dd\u7f6e\u53ca\u5176\u88fd\u9020\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229I819717,\u00a0 filed on Jul. 25, 2022, Issued Date: Oct. 21, 2023.<\/li>\n<li>\u80e1\u701a\u6587, \u5289\u5fb7\u6c11, \u8521\u9038\u6770, <strong>\u9673\u51a0\u80fd<\/strong>,\u201c\u63a5\u5408\u5143\u4ef6\u53ca\u5176\u88fd\u5099\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I769022, filed on Jul. 21, 2021, Issued Date: Jun. 22, 2022<\/li>\n<li>\u66fe\u5b50\u7ae0, \u6797\u6ea5\u5982, \u67ef\u6b63\u9054, \u9673\u88d5\u83ef, <strong>\u9673\u51a0\u80fd<\/strong>,\u201c\u7d44\u88dd\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I614864, filed on Sep. 21, 2016, Issued Date: Feb. 11, 2018.<\/li>\n<li>\u4f59\u6cb3\u6f54, \u5ed6\u653f\u9f8d, \u6797\u4fca\u4f51, <strong>\u9673\u51a0\u80fd<\/strong>,\u201c\u5177\u6709\u539a\u91d1\u5c6c\u677f\u5c64\u7684\u7570\u8cea\u63a5\u5408\u6563\u71b1\u57fa\u677f\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I585915, filed on Dec. 12, 2014, Issued Date: Jun. 1, 2017.<\/li>\n<li>\u6c88\u6587\u7dad, <strong>\u9673\u51a0\u80fd<\/strong>, \u67ef\u6b63\u9054,\u201c\u534a\u5c0e\u9ad4\u5143\u4ef6\u3001\u88fd\u4f5c\u65b9\u6cd5\u53ca\u5176\u5806\u758a\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I556385, filed on Dec. 5, 2014, Issued Date: Feb. 16, 2016.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u5f35\u8000\u4ec1\u201c\u534a\u5c0e\u9ad4\u5143\u4ef6\u4e4b\u5167\u9023\u63a5\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I511257, filed on Jul. 30, 2013, Issued Date: Dec. 1, 2015.<\/li>\n<li>\u8b5a\u76ce\u5357, \u9673\u5b8f\u660e, <strong>\u9673\u51a0\u80fd<\/strong>,\u201c\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I509758, filed on Dec. 26, 2012, Issued Date: Nov. 21, 2015.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u99f1\u97cb\u4ef2, \u67ef\u6b63\u9054,\u201c\u63a5\u5408\u7d50\u69cb\u53ca\u5176\u88fd\u9020\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I502696, filed on Feb. 6, 2010, Issued Date: Oct. 1, 2015.<\/li>\n<li>\u5f35\u797a\u9418, \u90b1\u667a\u5b8f, \u9673\u5f65\u5d0e, <strong>\u9673\u51a0\u80fd<\/strong>, \u65bd\u5efa\u5b87,\u201c\u8cab\u5b54\u5f0f\u632f\u5b50\u88dd\u7f6e\u6676\u5713\u7d1a\u5c01\u88dd\u7d50\u69cb\u53ca\u5176\u88fd\u9020\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I498951, filed on Apr. 27, 2012, Issued Date: Sep. 1, 2015.<\/li>\n<li>\u963f\u5f17\u745e\u65af \u98db\u767b Phaedon Avouris, <strong>\u9673\u51a0\u80fd<\/strong> Kuan-Neng Chen, \u6cd5\u58a8 \u6234\u8499 Damon Farmer, \u6797\u4f51\u660e Yu-Ming Lin, \u201c\u4ee5\u77f3\u58a8\u70ef\u70ba\u57fa\u5e95\u7684\u5143\u4ef6\u53ca\u5176\u88fd\u9020\u65b9\u6cd5Graphene Channel-Based Devices and Methods for Fabrication Thereof\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I497644, filed on May 20, 2011, Issued Date: Aug. 21, 2015.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u5f35\u8000\u4ec1,\u201c\u6676\u5713\u6b21\u5fae\u7c73\u63a5\u5408\u65b9\u6cd5\u53ca\u5176\u63a5\u5408\u5c64,\u201d \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I476839, filed on Jul. 6, 2012, Issued Date: Mar. 11, 2015.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u8cf4\u660e\u82b3, \u9673\u5b8f\u660e,\u201c\u7acb\u9ad4\u7a4d\u9ad4\u96fb\u8def\u88dd\u7f6e\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I467736, filed on Jan. 4, 2012, Issued Date: Jan. 1, 2015.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u674e\u4e16\u5049, \u201c\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I443803, filed on Sep. 9, 2011, Issued Date: Jul. 1, 2014.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u67ef\u6b63\u9054, \u99f1\u97cb\u4ef2, \u201c\u5177\u6709\u7a4d\u9ad4\u96fb\u8def\u8207\u767c\u5149\u4e8c\u6975\u9ad4\u4e4b\u7570\u8cea\u6574\u5408\u7d50\u69cb\u53ca\u5176\u88fd\u4f5c\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I434405, filed on Jun. 7, 2011, Issued Date: Apr. 11, 2014.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>, \u5f90\u8056\u582f, \u201c\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u4e4b\u63a5\u5408\u65b9\u6cd5\u53ca\u5176\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I433268, filed on Sep. 16, 2011, Issued Date: Apr. 1, 2014.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>,\u7f85\u4e2d\u502b,\u85cd\u6587\u5b89,\u967d\u660e\u76ca,\u201c\u5f37\u5316\u6c23\u5bc6\u6027\u4e4b\u632f\u5b50\u88dd\u7f6e\u6676\u5713\u7d1a\u5c01\u88dd\u7d50\u69cb\u201d,\u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I422080, filed on Aug. 20, 2010, Issued Date: Jan. 1, 2014.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>,\u8cf4\u660e\u82b3,\u9673\u5b8f\u660e,\u201c\u4e09\u7dad\u7a4d\u9ad4\u96fb\u8def\u7684\u975c\u96fb\u9632\u8b77\u7d50\u69cb\u201d,\u00a0\u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I416706, filed on Dec. 20, 2010, Issued Date: Nov. 21, 2013.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>,\u7f85\u4e2d\u502b,\u85cd\u6587\u5b89,\u967d\u660e\u76ca,\u201c\u6539\u826f\u5f0f\u632f\u5b50\u6676\u5713\u7d1a\u5c01\u88dd\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I412167, filed on Aug. 20, 2010, Issued Date: Oct. 11, 2013.<\/li>\n<li><strong>\u9673\u51a0\u80fd<\/strong>,\u7f85\u4e2d\u502b,\u85cd\u6587\u5b89,\u967d\u660e\u76ca,\u201c\u8cab\u5b54\u5f0f\u632f\u5b50\u88dd\u7f6e\u6676\u5713\u7d1a\u5c01\u88dd\u7d50\u69cb\u4e4b\u88fd\u9020\u65b9\u6cd5\u201d, \u4e2d\u83ef\u6c11\u570b\u767c\u660e\u5c08\u5229 I396311, filed on Aug. 20, 2010, Issued Date: May 11, 2013.<\/li>\n<li>\u5f35\u797a\u9418, \u90b1\u667a\u5b8f, \u9673\u5f65\u5d0e, <strong>\u9673\u51a0\u80fd<\/strong>, \u65bd\u5efa\u5b87,\u201c\u5177\u6709\u51f9\u69fd\u4e4b\u632f\u5b50\u55ae\u5143\u5c01\u88dd\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u65b0\u578b\u5c08\u5229 M438707, filed on May 1, 2012, Issued Date: Oct. 1, 2012.<\/li>\n<li>\u5f35\u797a\u9418, \u90b1\u667a\u5b8f, \u9673\u5f65\u5d0e, <strong>\u9673\u51a0\u80fd<\/strong>, \u65bd\u5efa\u5b87, \u201c\u8cab\u5b54\u5f0f\u632f\u5b50\u88dd\u7f6e\u6676\u5713\u7d1a\u5c01\u88dd\u7d50\u69cb\u201d, \u4e2d\u83ef\u6c11\u570b\u65b0\u578b\u5c08\u5229 M437527, filed on May 1, 2012, Issued Date: Sep. 11, 2012.<\/li>\n<\/ol>\n<\/div><\/section>\n\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='country5'  class='avia-section av-c8cu0jy-ec133ea8e966d7169b18d7a0af790a9f main_color avia-section-default avia-no-border-styling  avia-builder-el-53  el_after_av_section  avia-builder-el-last  avia-bg-style-scroll  container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n<div class='flex_column_table av-c7dxsse-3b845fc02dd919413cfa8547d253d972 sc-av_one_full av-equal-height-column-flextable'><div class='flex_column av-c7dxsse-3b845fc02dd919413cfa8547d253d972 av_one_full  avia-builder-el-54  el_before_av_textblock  avia-builder-el-first  first flex_column_table_cell av-equal-height-column av-align-top '   ><style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-c4uaz2m-b3303ac733c6fa4fbe2f23205869f3eb\">\n#top .av-special-heading.av-c4uaz2m-b3303ac733c6fa4fbe2f23205869f3eb{\npadding-bottom:10px;\n}\n<\/style>\n<div  class='av-special-heading av-c4uaz2m-b3303ac733c6fa4fbe2f23205869f3eb av-special-heading-h2 blockquote modern-quote  avia-builder-el-55  avia-builder-el-no-sibling  '><h2 class='av-special-heading-tag '  itemprop=\"headline\"  >\u5c08\u5229\u570b\u5225\uff1a\u4e2d\u570b<\/h2><div class='special-heading-border'><div class='special-heading-inner-border'><\/div><\/div><\/div><\/div><\/div><!--close column table wrapper. Autoclose: 1 --><section class=\"av_textblock_section \"  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock  '   itemprop=\"text\" ><ol>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u80e1\u701a\u6587, \u738b\u6bd3\u9a79, \u5f20\u7acb\u7ff0, \u201c\u5929\u7ebf\u5c01\u88c5\u548c\u5236\u9020\u5929\u7ebf\u5c01\u88c5\u7684\u65b9\u6cd5\u201d, CN 118539132 A, filed onFeb. 19, 2024, Issued Date: Aug. 23, 2024.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u6d2a\u4ef2\u9889;\u5353\u5fd7\u7fbf;\u7fc1\u660e\u7ef4;\u9648\u82b7\u6db5;\u738b\u4e54\u5f66;\u6d2a\u82f1\u5c55;\u5434\u5b8f\u4e00;\u8c22\u627f\u8c1a, \u201c\u5f62\u6210\u534a\u5bfc\u4f53\u63a5\u5408\u7ed3\u6784\u7684\u4fdd\u62a4\u5c42\u8584\u819c\u3001\u5f62\u6210\u5176\u7684\u6e85\u9540\u9776\u6750\u3001\u534a\u5bfc\u4f53\u63a5\u5408\u7ed3\u6784\u53ca\u534a\u5bfc\u4f53\u63a5\u5408\u65b9\u6cd5\u201d, CN 118039592 A, filed on Nov. 3, 2022, Issued Date: May. 14, 2024.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u80e1\u701a\u6587, \u8521\u9038\u6770, \u738b\u6bd3\u9a79, \u5f20\u7acb\u7ff0, \u201c\u5929\u7ebf\u5c01\u88c5\u7ed3\u6784\u201d, CN 117239397 A, filed on Feb. 5, 2023, Issued Date: Dec. 15, 2023.<\/li>\n<li>\u80e1\u6b63\u660e, <strong>\u9648\u51a0\u80fd<\/strong>, \u9ec4\u67cf\u82cd, \u937e\u660a\u4e1c, \u65bd\u4f2f\u653f, \u6f58\u6631\u94ed, \u201c\u96c6\u6210\u7535\u8def\u7ed3\u6784\u201d, CN 220382092 U, filed on Jun. 15, 2023, Issued Date: Jan. 23, 2024.<\/li>\n<li>\u66fe\u5b50\u7ae0;\u6797\u6ea5\u5982;\u67ef\u6b63\u8fbe;\u9648\u88d5\u534e;<strong>\u9648\u51a0\u80fd<\/strong>, \u201c\u7ec4\u88c5\u65b9\u6cd5\u201d, CN 107871669 A, filed on Jun. 15, 2023, Issued Date: Jan. 23, 2024.<\/li>\n<li>\u9648\u56fd\u534e;\u6797\u6148\u6866;<strong>\u9648\u51a0\u80fd<\/strong>;\u9ec4\u5f66\u658c, \u201c\u534a\u5bfc\u4f53\u63a5\u5408\u7ed3\u6784\u53ca\u65b9\u6cd5\uff0c\u4ee5\u53ca\u534a\u5bfc\u4f53\u82af\u7247\u201d, CN 104022090 U, filed on Sep. 28, 2016, Issued Date: Apr. 3, 2018.<\/li>\n<li>\u5218\u5c0f\u864e, \u7ebd\u6069\u65af, L. \u514b\u9c81\u8f9b-\u4f0a-\u9c8d\u59c6, G. J. \u9a6c\u4e01\u7eb3, B. G. \u57c3\u5c14\u59c6\u683c\u6797, <strong>\u9648\u51a0\u80fd<\/strong>,\u201c\u8026\u5408\u7ed3\u6784\u53ca\u5176\u5f62\u6210\u65b9\u6cd5\u201d, SIPO Patent CN 102640314 B, filed on Dec. 3, 2010, Issued Date: May 7, 2014.<\/li>\n<li>\u6797\u6148\u6866, \u9648\u56fd\u534e, <strong>\u9648\u51a0\u80fd<\/strong>,\u201c\u5c01\u88c5\u8f7d\u4f53\u7ed3\u6784\u201d, SIPO Patent CN 102623429, filed on Apr. 11, 2012, Issued Date: Aug. 1, 2012.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u67ef\u6b63\u8fbe, \u9a86\u97e6\u4ef2,\u201c\u5177\u6709\u96c6\u6210\u7535\u8def\u4e0e\u53d1\u5149\u4e8c\u6781\u7ba1\u7684\u5f02\u8d28\u6574\u5408\u7ed3\u6784\u53ca\u5176\u5236\u4f5c\u65b9\u6cd5\u201d, SIPO Patent CN 102263097, filed on Jul. 11, 2011, Issued Date: Nov. 30, 2011.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u6797\u949f\u6c49,\u201c\u5f00\u5173\u5355\u5143\u548c\u5f00\u5173\u5355\u5143\u9635\u5217\u201d, SIPO Patent CN 101304040 B, filed on May 5, 2008, Issued Date: Aug 11, 2010.<\/li>\n<li>D\u30fbm\u30fb\u7ebd\u6069\u65af, L\u30fb\u514b\u9c81\u8f9b\u827e\u5c14\u9c8d\u59c6, \u91d1\u5fb7\u8d77, <strong>\u9648\u51a0\u80fd<\/strong>, \u6734\u70b3\u67f1, B\u30fbg\u30fb\u57c3\u5c14\u7c73\u683c\u6797, \u6797\u4ef2\u6c49, C\u30fb\u79d1\u6851\u8fbe\u62c9\u66fc, S\u30fb\u6ce2\u5362\u7d22\u8428\u66fc,\u201c\u53ef\u7f16\u7a0b\u76f8\u53d8\u6750\u6599\u7ed3\u6784\u53ca\u5176\u5f62\u6210\u65b9\u6cd5\u201d, SIPO Patent CN 101383337 B, filed on Jul. 31, 2008, Issued Date: Jul 21, 2010.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, L\u30fb\u514b\u9c81\u8f9b\u827e\u4fdd\u59c6, \u4e39\u5c3c\u65af\u30fbm\u30fb\u7ebd\u6069\u65af, \u8428\u59c6\u5e15\u65af\u30fb\u666e\u9c81\u8096\u8428\u66fc,\u201c\u53ef\u7f16\u7a0b\u901a\u5b54\u5668\u4ef6\u53ca\u5176\u5236\u9020\u65b9\u6cd5\u548c\u96c6\u6210\u903b\u8f91\u7535\u8def\u201d, SIPO Patent CN 101359649, filed on Jul. 29, 2008, Issued Date: Jun 23, 2010.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, L\u30fb\u514b\u9c81\u8f9b\u827e\u4fdd\u59c6, \u4e39\u5c3c\u65af\u30fbm\u30fb\u7ebd\u6069\u65af, S\u30fb\u6ce2\u5362\u7d22\u8428\u66fc,\u201c\u53ef\u7f16\u7a0b\u901a\u5b54\u5668\u4ef6\u53ca\u5176\u5236\u9020\u65b9\u6cd5\u4ee5\u53ca\u96c6\u6210\u903b\u8f91\u7535\u8def\u201d, SIPO Patent CN 100590861 C, filed on Jul. 29, 2008, Issued Date: Feb 17, 2010.<\/li>\n<li><strong>\u9648\u51a0\u80fd<\/strong>, \u6797\u4ef2\u6c49,\u201c\u534a\u5bfc\u4f53\u7ed3\u6784\u53ca\u5176\u5236\u9020\u65b9\u6cd5\u201d, SIPO Patent CN 100567569 C, filed on Apr. 9, 2008, Issued Date: Dec 9, 2009.<\/li>\n<\/ol>\n<\/div><\/section>\n<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='after_section_7'  class='main_color av_default_container_wrap container_wrap sidebar_right'  ><div class='container av-section-cont-open' ><div class='template-page content  av-content-small alpha units'><div class='post-entry post-entry-type-page post-entry-3230'><div class='entry-content-wrapper clearfix'>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":10,"featured_media":0,"parent":3221,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v16.8 - 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