專書專章

專書

1. Kuan-Neng Chen, and Chuan Seng Tan, “Wafer Bonding Technology”, ISBN 978-981-120-115-8, World Scientific, Oct 2019.
2. 鄭晃忠, 陳冠能,“電子材料導論”, ISBN 978-986-412-927-0, 高立圖書, Mar 2013.
3. Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester, “3D Integration for VLSI Systems”, ISBN 978-9-814-30381-1, Pan Stanford, Sep 2011.

專章

1. Tzu-Heng Hung, and Kuan-Neng Chen,“Direct Copper Interconnection for Die/Wafer Bonding: Overview”, in Direct Copper Interconnection for Advanced Semiconductor Technology, CRC Press, ISBN9781032528236, Jun. 2024.
2. Kuan-Neng Chen, Ting-Yang Yu, Yu-Chen Hu, and Cheng-Hsien Lu, “Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies”, in 3D Integration in VLSI Circuits, CRC Press, ISBN 9781138710399, Apr. 2018.
3. 柯正達,陳裕華,陳冠能,“第五章 先進封裝電子材料”,電子材料導論,ISBN 978-986-412-927-0, 高立圖書, Mar 2013.
4. Kuan-Neng Chen, Hsiang-Lan Lung, Yu Zhu, Huai-Yu Cheng, and Frederick T. Chen, “Phase Change Materials: Research Developments and Device Applications”, in Nonvalotile Memories: Materials, Devices and Applications, American Scientific Publisher, ISBN 978-1588832504, Mar. 2012.
5. Kuan-Neng Chen, and Chuan Seng Tan, “Chapter 9 Thermo-Compression Cu-Cu Bonding of Blanket and Patterned Wafers”, in Handbook of Wafer Bonding, Wiley VCH, ISBN 9783527326464, Jan 2012.
6. 陳冠能, 陳裕華, 鄭裕庭,“第十三章 三維積體電路製程”,新世代積體電路製程, ISBN 978-957-483-671-0, 東華書局, Sep 2011.
7. Kuan-Neng Chen, Chuan Seng Tan, Andy Fan, and L Rafael Reif, “Chapter 6 Cu wafer bonding for 3D-ICs application”, in Wafer Level 3-D ICs Process Technology, ISBN 978-0-387-76532-7, Springer, Sep 2008.