ISSCC/IEDM/VLSI
20
期刊
151
國際會議
262
專利
97
專書專章
10
受邀演講
88
受邀技術報告
7
- “The Future of 3DIC and Heterogeneous Integration / Advanced Packaging,” IMSE Day 2026, University of Texas at El Paso, El Paso, Texas, Apr. 22, 2026.
- “以半導體為核心的台日產業合作新架構 從供應鏈互補到共同育才,” 東亞經濟會議, Taipei, Taiwan, Mar. 13, 2026.
- “Innovative Research and Future Prospects of 3D Packaging Technology at NYCU,” 臺日半導體 3D 封裝技術國際研討會, Taipei, Taiwan, Sep. 10, 2025.
- “Enabling Semiconductor Innovation with 3D IC, Heterogeneous Integration, and Advanced Packaging,” Reliability in 3D IC Technology, Hsinchu, Taiwan, Aug. 28, 2025.
- “Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications,” IEEE EPS Dallas Chapter, online, May 19, 2025.
- “Advanced Packaging: Enabling the Next Era of Semiconductor Innovation,” IEEE EPS Malaysia Chapter, online, May 8, 2025.
- “先進封裝的技術發展、應用與未來趨勢,” 閎康技術研討會, Hsinchu, Taiwan, Mar. 27, 2025.
- “Unlocking the Potential of 3DIC and Advanced Packaging: Latest Developments and Research Breakthroughs,” Tokyo Institute of Technology, Yokohama, Japan, Mar. 18, 2025.
- “Recent Advances on Cu-Cu and Hybrid Bonding for Advanced Packaging Platforms and Applications,” IEEE EPS Webinar, online, Jun. 26, 2024. (https://resourcecenter.eps.ieee.org/education/webinars/epsvid1160)
- “From Backend 3D to Frontend 3D: 3D IC, Advanced Packaging, and Heterogeneous Integration,” Purdue University, West Lafayette, IN, May 31, 2024.
- “Nanopackaging for Hybrid Bonding,” IEEE EPS Nanopackaging Webinar, Dec. 13, 2023.
- “The Solution to Extend Moore’s Law: Using 3D IC and Advanced Packaging to Realize Innovative Electronic Applications,” Asia Industry-Academia Cooperation Exchange Forum, Kuala Lumpur, Malaysia, Nov. 9, 2022.
- “The Solution to Extend Moore’s Law: Using 3D IC and Advanced Packaging to Realize Innovative Electronic Applications,” Asia Industry-Academia Cooperation Exchange Forum, Penang, Malaysia, Nov. 7, 2022.
- “3D IC, Advanced Packaging, and Heterogeneous Integration: A Sustainability Semiconductor Research in NYCU,” Asia Industry-Academia R&D Cooperation Trend Exchange Conference on Sustainability, Singapore, Nov. 4, 2022.
- “Low Temperature Cu-Cu and Hybrid Bonding for 3D Integration and Advanced Packaging,” Georgia Institute of Technology, Atlanta, GA, USA, Jul. 21, 2022.
- “3D IC and Advanced Packaging,” Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, Jan. 17, 2022.
- “三維積體電路與先進封裝技術介紹,” 半導體前瞻技術國際研討會, Kaohsiung, Taiwan, Sep. 23, 2021.
- “3D Integration, Advanced Packaging, and Heterogeneous Integration,” Department of Mechanical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan, Mar. 4, 2021.
- “3D Integration, Advanced Packaging, and Heterogeneous Integration,” IEEE Taipei Chapter, Tainan, Taiwan, Sep. 24, 2020.
- “Low Temperature Cu-Cu Hybrid Bonding: The Evolution of Bonding Technology,” JEITA, Yokohama, Japan, Sep. 9, 2020.
- “Technology Roadmap and Difficulties of Advanced Packaging,” Nomura Forum, Virtual, Aug. 19, 2020.
- “3D IC/Heterogeneous Integration Research Group,” JEITA, Yokohama, Japan, Nov. 27, 2019.
- “Research Advances, Technologies, and Current Status of 3D IC and Heterogeneous Integration,” Technology Forum of Semiconductor Moonshot Project, Hsinchu, Taiwan, Apr. 25, 2019.
- “3D Integration and Advanced Packaging,” Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, Mar. 7, 2019.
- “Technologies and Current Status of 3D Integration and Advanced Packaging,” Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, Taiwan, Dec. 14, 2018.
- “3D Integration and Advanced Packaging,” Tsing Hua University, Beijing, China, Oct 9, 2018.
- “Research Activities in NCTU 3D IC Group,” Tokyo Institute of Technology, Japan, Jun. 26, 2018.
- “Introduction of 3D IC and Cu-Cu Bonding Technology,” National Sun Yat-Sen University, Kaohsiung, Taiwan, May 22, 2018.
- “3D Integration and Advanced Packaging,” Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, Taiwan, May 18, 2018.
- “3D IC/Heterogeneous Integration Research Group,” The University of Tokyo, Tokyo, Japan, Dec. 21, 2017.
- “3D IC/Heterogeneous Integration Research Group,” Tokyo Institute of Technology, Yokohama, Japan, Nov. 16, 2017.
- “Technologies and Applications of 3D IC and Heterogeneous Integration,” University of Colorado at Boulder, Boulder, CO, USA, Aug 16, 2017.
- “Research Advances, Technologies, and Current Status of 3D Packaging and Heterogeneous Integration,” IEEE Joint CPMT/CAS & SMTA Oregon Chapters, Portland, OR, USA, Jul. 28, 2016.
- “Research Advances, Technologies, and Applications of 3D IC and Heterogeneous Integration,” Taiwan India Nanodevice Workshop, IIT-Bombay, Mumbai, India, May 17, 2016.
- “Research Advances, Technologies, and Applications of 3D IC and Heterogeneous Integration,” Department of Electrical Engineering, Columbia University, New York, NY, USA, Oct. 28, 2015.
- “Recent Advances on Technologies and Applications in Heterogeneous and 3D Integration,” NCTU-UC Berkeley I-RiCE Workshop, University of California at Berkeley, Berkeley, CA, USA, Oct. 9, 2015.
- “3D IC/Heterogeneous Integration Research Group in NCTU,” Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA, USA, Jul. 21, 2015.
- “3D IC 關鍵技術與發展現況介紹,” Department of Electrophysics, National Chiao Tung University, Hsinchu, Taiwan, Mar. 19, 2015.
- “3D IC – A Game Changer to OSAT Market, or Not?” Nomura Expert Series, Taipei, Taiwan, Jan. 15, 2015.
- “3D/2.5D IC 及異質整合的技術發展及新應用介紹,” 3D SiP 技術研討會, Ad-STAC, Hsinchu, Taiwan, Dec. 25, 2014.
- “3D IC 關鍵技術與應用,” 國立交通大學先進材料中心, Hsinchu, Taiwan, Dec. 15, 2014.
- “3D IC Technology,” Department of Mechanical Engineering, Chung Yuan Christian University, Taoyuan, Taiwan, Nov. 26, 2014.
- “3D IC 關鍵技術與發展現況介紹,” 儀科中心, Hsinchu, Taiwan, Nov. 19, 2014.
- “Recent Advances on Key Technologies, Schemes, and Applications in 3D/2.5D Integration,” Institute of Electronics Engineering, National Tsing Hua University, Hsinchu, Taiwan, Nov. 14, 2014.
- “High Density and Miniaturization Applications Utilizing 3D Integration Key Technologies,” National Chung Hsing University, Taichung, May 29, 2014.
- “三維積體電路製程設備與交通大學奈米中心介紹,” 103年度半導體製程設備研討會, Chungli, Taoyuan, Taiwan, May 23, 2014.
- “Development of 3D IC Technologies and Collaboration with Toray,” Toray Seminar, Tokyo, Tokyo, Japan, May 15, 2014.
- “3D IC 技術發展與相關領域應用的介紹,” 次世代半導體構裝技術-3D IC 技術發展研討會, Hsinchu, Taiwan, Apr. 23, 2014.
- “Wafer-Level Metal Bonding Technology,” Microsystem Technology Center, Industrial Technology Research Institute, Hsinchu, Taiwan, Jan. 16, 2014.
- “2.5D/3D IC 發展現況與關鍵技術介紹,” 台灣半導體設備產業的機會與挑戰研討會, Kaohsiung, Taiwan, Dec. 9, 2013.
- “Development and Investigation of 3D Integration Schemes Using TSV, Bonding and Thinning Technologies,” 半導體論壇, Nantou, Taiwan, Nov 28, 2013.
- “Recent Advances on Key Technologies, Schemes, and Applications in 3D/2.5D Integration,” 三維積體電路技術研討會, 國家奈米元件實驗室, Nov. 12, 2013.
- “3D IC Technology,” College of Engineering, National Chiao Tung University, Nov. 9, 2013.
- “Introduction of 3D IC Technology,” Institute of Communications Engineering, National Sun Yat-sen University, Kaohsiung, Taiwan, Nov. 5, 2013.
- “3D IC 關鍵技術介紹,” 3DIC設備技術發展研討會, Hsinchu, Taiwan, Jun. 26, 2013.
- “Taiwan 3D IC Development, Challenge, and Opportunities,” DuPont Seminar, Hsinchu, Taiwan, Apr. 14, 2013.
- “Three-Dimensional Integrated Circuits: Key Technologies and Research Achievements,” The Chinese University of Hong Kong, Hong Kong, Apr. 4, 2013.
- “Research, Technology, and Course Development of 3D IC,” Department of Electrical Engineering, National Central University, Taoyuan, Taiwan, Dec. 5, 2012.
- “3D IC 技術介紹及應用,” 光電半導體創新技術研討會, 經濟部加工出口區管理處, Kaohsiung, Taiwan, Nov. 29, 2012.
- “Three-dimensional integrated circuits (3D IC): Concept, Technology, and Research Achievements,” Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, Nov. 14, 2012.
- “TSV and Bonded Structure for 3D Integration,” Ad-STAC Workshop, Industrial Technology and Research Institute (ITRI), Oct. 23, 2012.
- “3D IC 的技術、應用、成果與展望,” Nikon 2012 半導體應用研討會, Hsinchu, Taiwan, Oct. 5, 2012.
- “Three-dimensional integrated circuits (3D IC): Concept, Schemes, and Research Achievements,” National Chip Implementation Center, Hsinchu, Taiwan, Sep. 21, 2012.
- “3D Integration: Technologies, Schemes, and Research Achievements,” Material and Chemical Research Laboratories, Industrial Technology and Research Institute (ITRI), Sep. 4, 2012.
- “Three-dimensional integrated circuits (3D IC): Concept, Technology, and Research Achievements,” Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan, Jun. 11, 2012.
- “Three-dimensional integrated circuits (3D IC): Concept, Technology, and Research Achievements,” Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, Apr. 11, 2012.
- “Three-dimensional integrated circuits (3D IC): Concept, Technology, and Current Status,” The University of British Columbia, Vancouver, BC, Canada, July 21, 2011.
- “Three-Dimensional Integrated Circuits (3D IC): Concept, Technology, and Outlook,” Institute of Electronic Engineering, Ming-Hsin Univ. of Science and Technology, Apr. 18, 2011.
- “3D IC 技術,” Material and Chemical Research Laboratories, Industrial Technology Research Institute (ITRI), Mar. 23, 2011.
- “From 2D IC to 3D IC: Next Generation Devices and Technologies,” Department of Chemical and Materials Engineering, National Central University, Hsinchu, Taiwan, Nov. 12, 2010.
- “Next Generation Devices and Technologies: From 2D IC to 3D IC,” Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan, Mar. 19, 2010.
- “Enabling Technologies of 3D IC and Packaging 三維積體電路的促成科技,” 3D IC SIG – 3D IC Forum (I), 經濟部工業局, Hsinchu, Taiwan, Mar. 18, 2010.
- “Three-Dimensional Integrated Circuits: Research and Industry Perspectives,” 3D IC 技術趨勢-由技術研發邁向商品化應用研討會, 經濟部技術處, Hsinchu, Taiwan, Jan. 13, 2010.
- “3D IC Integration and Technology,” 3D-IC Forum, The Electronics Devices and Materials Association, Hsinchu, Taiwan, Dec. 18, 2009.
- “Three-Dimensional Integrated Circuits,” Department of Electrical Engineering, National Central University, Chung-Li, Taoyuan, Taiwan, Dec. 2, 2009.
- “Three-Dimensional Integrated Circuits (3D IC),” Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan, Nov. 25, 2009.
- “3D IC Technologies and Research Achievements,” 3D IC 材料與技術研討會, Hsinchu, Taiwan, May 13, 2009.
- “Three-Dimensional Integrated Circuits: Concept and Technology,” Institute of Electronic Engineering, National Taiwan University, Taipei, Taiwan, May 11, 2009.
- “3D IC Concept and Technology,” Institute of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan, May 5, 2009.
- “Three-Dimensional Integrated Circuits (3D IC),” Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, Apr. 29, 2009.
- “3-D Integration Technology,” Nanyang Technological University, Singapore, Apr. 3, 2009.
- “3D IC 研究成果與發展現況,” 3D IC 鼎談會, 中華民國經濟部工業局, 台北國際會議中心, Taipei, Taiwan, Mar. 20, 2009.
- “3D IC Technology,” National Taiwan University, Taipei, Taiwan, March 24, 2008.
- “3D IC Technology,” Industrial Technology and Research Institute (ITRI), Hsinchu, Taiwan, March 21, 2008.
- “Programmable Via Using Indirectly Heated Phase-Change Switch for Reconfigurable Applications,” Carnegie Mellon University, July 2007.
- “3-D Integration Technology using Copper Wafer Bonding,” ITRI, Hsinchu, Taiwan, January 2005.
- “3-D Integration Technology with Copper Wafer Bonding,” National Central University, Chung-Li, Taiwan, January 2002.
- “Three-Dimensional Integrated Circuits and Copper Wafer Bonding,” National Tsing Hua University, Hsinchu, Taiwan, January 2001.
