Low Temperature Bonding Technology
Low Temperature Cu-Cu Direct Bonding
- Bonding Method：Thermocompression bonding
- Bonding Material：Cu-Cu direct bonding
- Bonding Temperature：70-180℃
- Bonding Method：Cu pillar-concave bonding
- Bonding Material：Cu-Cu direct bonding
- Bonding Temperature：150℃
Cu / Polymer Hybrid Bonding
- Bonding Method：Thermocompression bonding
- Bonding Material：IMC (Cu, Sn) / Polymer
- Bonding Temperature：250℃
Cu / Dielectric Hybrid Bonding
- Bonding Method：Thermocompression bonding
- Bonding Material：IMC (Cu, Sn) / SiO2
- Bonding Temperature：120℃
Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
- Bonding Method：Thermocompression bonding
- Bonding Material：IMC (Cu, In, Sn)
- Bonding Temperature：150-250℃
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