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Low Temperature Bonding Technology
Low Temperature Cu-Cu Direct Bonding
Cu / Polymer Hybrid Bonding
Cu / Dielectric Hybrid Bonding
Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
3DIC Enabling Technology
Novel Material – Polyimide
Monolithic 3DIC
Wafer-level Bumpless Through-Silicon-Via (TSV)
Advanced Packaging Applications & Heterogeneous Integration
Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
Advanced Wafer-level Packaging for MEMS Applications
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Postdocs 博士後研究員
蔡逸杰 (Yi-Chieh Tsai)
Ph.D. Students 博士班學生
施伯政 (Bo-Jheng Shih)
黃元九 (Yuang-Chiu Huang)
許穆平 (Mu-Ping Hsu)
潘昱銘 (Yu-Ming Pan)
王喬彥 (Chiao-Yen Wang)
劉昱論 (Yu-Lun Liu)
張謝平 (Shei-Ping Chang)
林佳叡 (Jia-Rui Lin)
Ph.D. Students 在職博士班學生
彭柏舜 (Bruce Peng)
熊健剛 (Kuma Hsiung)
Master Students 碩士班學生
邱煥祐 (Huan-Yu Chiu)
林泰宇 (Tai-Yu Lin)
蔡文慈 (Wen-Tsu Tsai)
陳藝璇 (Yi-Hsuan Chen)
孫紫涵 (Tzu-Han Sun)
李佩儒 (Pei-Ru Lee)
鄭鈞澤 (Chun-Che Cheng)
陳慶霖 (Ching-Lin Chen)
鄭立昕 (Li-Hsin Cheng)
陳亭妤 (Ting-Yu Chen)
陳昱均 (Yu-Chun Chen)
魏呈宇 (Cheng-Yu Wei)
李俊達 (Chun-Ta Li)
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