Kuan-Neng Chen (陳冠能)
NAI Fellow (National Academy of Inventors)
IEEE Fellow “for contributions to 3D integrated circuit and packaging technologies”
IET Fellow
IMAPS Fellow
- Ph.D., Department of Electrical Engineering and Computer Science
- M.S., Department of Materials Science and Engineering
Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, and a Research Staff Member at IBM Thomas J. Watson Research Center.
In addition to his faculty position, Dr. Chen is currently Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Professional Experiences
Organization | Title | Year |
---|---|---|
Micro-Electronics Program, National Science and Technology Council (Taiwan) | Program Director | 2021-now |
Institute of Electronics, National Yang Ming Chiao Tung University | Chair Professor | 2021-now |
Institute of Innovative Research, Tokyo Institute of Technology | Specially Appointed Professor | 2017-now |
Industrial Technology and Research Institute (ITRI) | R&D Director (Joint-Appointment) | 2016-now |
International College of Semiconductor Technology, National Yang Ming Chiao Tung University | Associate Dean | 2015-2022 |
National Yang Ming Chiao Tung University / National Chiao Tung University | Vice President for International Affairs | 2019-2022 |
IEEE Transactions on Components, Packaging and Manufacturing Technology | Guest Editor | 2018-2021 |
Micron | Chair Professor | 2018-2021 |
Department of Electronics Engineering, National Chiao Tung University | Distinguished Professor | 2018-2021 |
Indian Institute of Technology Bombay (IIT Bombay) | Visiting Professor | 2018-2020 |
University of Colorado at Boulder | Visiting Professor | 2017-2018 |
Department of Electronics Engineering, National Chiao Tung University | Professor | 2012-2018 |
National Chip Implementation Center (CIC) | Adjunct Research Staff Member | 2011-2016 |
Industrial Technology and Research Institute (ITRI) | Consultant | 2009-2016 |
Massachusetts Institute of Technology (MIT) | Visiting Scientist | 2015 |
“Materials Challenges in Three-Dimensional Integrated Circuits”, MRS Bulletin | Guest Editor | 2015 |
The Electronics Devices and Materials Association (EDMA) | Secretary-general | 2011-2014 |
ASE-NCTU R&D Center | Deputy Director | 2011-2013 |
Department of Electronics Engineering, National Chiao Tung University | Associate Professor | 2009-2012 |
IBM T.J. Watson Research Center | Academic Visitor | 2010 |
Nanyang Technological University, Singapore | Visiting Researcher | 2009 |
IBM T.J. Watson Research Center | Research Staff Member | 2005-2009 |
INTEL | Component Research | 2002 |
Fellows
Organization | Title |
---|---|
National Academy of Inventors (NAI) | Fellow |
IEEE | Fellow, “for contributions to 3D integrated circuit and packaging technologies” |
IET | Fellow |
IMAPS | Fellow |
Honors and Awards
Award | Year |
---|---|
Futuristic Breakthrough Technology Award, Future Tech (NSTC) | 2022 |
Outstanding Research Award, Pan Wen Yuan Foundation | 2022 |
MOST Outstanding Research Award, Ministry of Science and Technology | 2021, 2018 |
IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award | 2021 |
National Industrial Innovation Award, Ministry of Economic Affairs | 2021 |
Futuristic Breakthrough Technology Award, Future Tech (MOST) | 2019 |
IEEE EPS Exceptional Technical Achievement Award | 2018 |
Outstanding Engineering Professor Award, The Chinese Institute of Engineers (CIE) | 2017 |
Outstanding Electrical Engineering Professor Award, The Chinese Institute of Electrical Engineering (CIEE) | 2014 |
EDMA Outstanding Service Award | 2014 |
Outstanding Youth Electrical Engineer Award, The Chinese Institute of Electrical Engineering (CICC) | 2012 |
Adventech Young Professor Award | 2012、2011、2010 |
EDMA Outstanding Youth Award | 2010 |
IBM Invention Achievement Award | Aug 2008, Dec 2007, Sep 2007, May 2007, Dec 2006 |
NYCU Honors and Awards
Award | Year |
---|---|
NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Award | 2022, 2021, 2020, 2017, 2014, 2012, 2011 |
Excellent Teaching Award, College of EE, NYCU/NCTU | 2021, 2015 |
Excellent Teaching Award, NCTU | 2020 |
NCTU Excellent Academic Advisor Award | 2016, 2015, 2013 |
EECS Outstanding Young Scholar Award, NCTU | 2016 |