About

      3DIC Lab is led by Prof. Kuan-Neng Chen. Our research topics include three-dimensional integrated circuits (3D IC), heterogeneous integration, and advanced packaging technology. As the scaling of transistor size faces its physical limits, 3D IC becomes the mainstream candidate to extend “Moore’s Law” and fulfill “More than Moore” applications. Our vision is to demonstrate a highly prolific spirit of innovation in creating or facilitating outstanding inventions. Our research goal is to make a tangible impact on the quality of life, economic development, and the welfare of society. We firmly believe 3D IC is the key to leading semiconductor technology and electronic applications in the future innovation.

      The research team and Prof. Kuan-Neng Chen have published more than 300 publications, including 3 books and 6 book chapters, and holds 83 patents. Attributed to our innovation and diligence, many of our significant research achievements have been published in IEDM, VLSI, and ISSCC. In addition to our outstanding academic achievements, 3DIC Lab has strong relationship with industries world-wide. Through the formats of joint development project (JDP) and non-exclusive technology transfer, 10+ companies have benefited and further upgraded their technology and products. As a leading research team in 3D IC field, we truly believe that the collaboration is the key to success. International collaboration is one of our major activities. Our international partners include the top universities and research institutes in US, Asia, and Europe!   

      3DIC Lab has an open and interactive learning environment. In our lab, every member is strongly encouraged to speak out their dream, explore any research possibility, discuss an innovative concept because a new direction often comes after an inspiring conversation. We welcome motivated undergraduates, graduate students, and researchers who have aspirations for 3D IC. Join us! Let’s work together and become the person you want to be!