Doctor’s degree
Cheng-Ta Ko 01
- Graduate year：2014
- Work unit：Unimicron
- Thesis title：Investigation of Low-Temperature Wafer Bonding and Its Applications for 3D Integration
Chien-Yu Shih 02
- Graduate year：2014
- Work unit：TSMC
- Thesis title：Study on Characteristics and Applications of Frequency Resonator Devices with 3D IC Integration
Yao-Ren Chang 03
- Graduate year：2015
- Work unit：TSMC
- Thesis title：Development, Electrical Performance, and Reliability Investigations of 3-D ICs Key Technologies and Hybrid Bonding Process Platform
Shi-Wei Li 04
- Graduate year：2017
- Work unit：UMC
- Thesis title：Key Technologies and Platform Development for 3D Integration
Hu-Chen Hu 05
- Graduate year：2017
- Work unit：TSMC
- Thesis title：Ultra-High-Resolution Neural Sensing Biosensor Development with 3D Heterogeneous Integration
Yan-Bin Huang 06
- Graduate year：2017
- Work unit：TSMC
- Thesis title：Development of Low Temperature Cu Bonding and Heterogeneous Integration Platform
Kui-An Zheng 07
- Graduate year：2017
- Work unit：TSMC
- Thesis title：Investigation of Temporary Bonding with Laser Release Technology for 3D Heterogeneous Integration Platform
Wen-Wei Shen 08
- Graduate year：2018
- Work unit：TSMC
- Thesis title：Development and Investigation of 3D-IC Heterogeneous Integration Platforms and Fan-out Wafer Level Package Technologies
Ting-Yang Yu 09
- Graduate year：2018
- Work unit：TSMC
- Thesis title：Development and Applications of Terahertz Optical Components using 3D-IC Technologies
Ya-Sheng Tang 10
- Graduate year：2018
Work unit：J & V Energy Technology Co
Thesis title：Development and Optimization Investigations of Ultra-Thin Buffer Layers Applied to Cu/Sn Bonding
Cheng-Hsien Lu 11
- Graduate year：2019
- Work unit：Macronix
- Thesis title：Application and Material Properties of Low Thermal Budget Polyimide in Asymmetric Cu/Sn Hybrid Bonding in 3D Integration Platform
Tzu-Chieh Chou 12
- Graduate year：2020
- Work unit：TSMC
- Thesis title：Investigation and Discussion on Passivation Bonding and Asymmetric Bonding Structure of Low Temperature Cu-Cu Direct Bonding in 3D Heterogeneous Integration
Yi-Chieh Tsai 13
- Graduate year：2021
- Work unit：TXC
- Thesis title：Development of Advanced Packaging Technology for Heterogeneous Integration Platform and Next-generation Microelectromechanical Systems
De-min Liu 14
- Graduate year：2022
- Work unit：
- Thesis title：Development of Low-temperature Cu-Cu Direct Bonding Technology Based on Passivation Scheme
Zhong-Jie Hong 15
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Investigation of Bonding Mechanism and Novel Scheme Development of Cu-Cu Bonding with the Passivation Structure
Hao-Tung Chung 16
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Study on Laser-Crystallized Silicon and Germanium Field-Effect Transistors for Monolithic Three-Dimensional Integrated Circuits
Tzu-Heng Hung 17
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Development on Low Temperature Hybrid Bonding Technology with TSV Integration for Advanced Memory Packaging Platform
Chia-Hsin Lee 18
- Graduate year：2023
- Work unit：Brewer Science
- Thesis title：Selection of 355-nm Laser Debonding Material to Enable
RDL-first and Die-first Fan-out Integrations
Master’s degree
Sheng-Yao Hsu 01
- Graduate year：2011
- Work unit：ACER
- Thesis title：Study on Cu/Ti bonding and its applications in 3D IC
Cheng-Hao Jiang 02
- Graduate year：2012
- Work unit：TSMC
- Thesis title：Research of Through Silicon Via in Three-Dimensional Integrated Circuits
Hsiao-Yu Chen 03
- Graduate year：2012
- Work unit：UT Austin (Ph.D.)
- Thesis title：Electrical Performance and Reliability Investigation of Co-sputtered Cu/Ti as 3D Bonded Interconnect
Hsiang-Han Ho 04
- Graduate year：2012
- Work unit：VIS
- Thesis title：Ultra-Thin Silicon Layer Transfer with Oxide Bonding for BSI-CIS Application
Wen-Chun Huang 05
- Graduate year：2013
- Work unit：TSMC
- Thesis title：Investigation of Adhesion Strength and Hetero-Bonding for 3D IC Applications
Yu-Shan Chien 06
- Graduate year：2013
- Work unit：TSMC
- Thesis title：Investigation of Low Temperature Cu/In Bonding in 3D IC
Jo-Ning Tseng 07
- Graduate year：2013
- Work unit：TSMC
- Thesis title：Reliability and Low Temperature Bonding (<150 °C) with Cu-In-Sn Based Interconnects for 3D Integration
Tien-Jung Lu 08
- Graduate year：2013
- Work unit：TSMC
- Thesis title：Key Technologies of 3-D ICs for Advanced BSI-CIS Application
Tsung-Han Yu 09
- Graduate year：2014
- Work unit：Winbond
- Thesis title：Low Temperature Hybrid Bonding with 3D IC Heterogeneous Integration for LED Application
Ting-Ting Shen 10
- Graduate year：2014
- Work unit：TSMC
- Thesis title：Investigation of Interfacial Behavior of Low Temperature Cu/In Bonded Structure in 3DIC
Shih-Min Sun 11
- Graduate year：2014
- Work unit：Blesstech Co.Ltd
- Thesis title：Process Integration and Development of Advanced 3D IC Key Technologies with Temporary Bonding and Bottom-Up TSV Formation
Shu-Chiao Kuo 12
- Graduate year：2014
- Work unit：Winbond
- Thesis title：A Novel Direct Cu-to-Cu Bonded Structure and Reliability Investigation in 3-D Integration
Yu-Wei Chang 13
- Graduate year：2015
- Work unit：TSMC
- Thesis title：Fabrication of Copper Pillar and Tapered Through Silicon Via (TSV) for Direct Bonding in 3D integration
Shu-Lin Lu 14
- Graduate year：2015
- Work unit：Rage
- Thesis title：Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications
Tsung-Yen Tsai 15
- Graduate year：2015
- Work unit：TSMC
- Thesis title：Development of Advanced 3D IC Technologies with Photolysis Polymer in Temporary Bonding and Ni/Sn Transient Liquid Phase Interconnect Bonding
Yu-Sheng Hsieh 16
- Graduate year：2015
- Work unit：TSMC
- Thesis title：Development and Electrical Investigation of Fine-Pitch Cu/Sn Pad Bonding Using Ultra-Thin Buffer Layer Technique in 3D Integration
Cheng-Han Fan 17
- Graduate year：2015
- Work unit：Moxa
- Thesis title：Study of Self-Assembly Technology for 3D Integration Applications
Keng-Ming Chang 18
- Graduate year：2016
- Work unit：TSMC
- Thesis title：Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration
Ching-Yun Chang 19
- Graduate year：2016
- Work unit：TSMC
- Thesis title：Investigation of Single Side Heated Chip-to-Wafer Bonding and Low Temperature Asymmetry Hybrid Bonding for 3D Heterogeneous Integration Applications
Hsiao-Chun Chang 20
- Graduate year：2016
- Work unit：TSMC
- Thesis title：Uneven-Topography-Chip 3D Heterogeneous Integration Using Double-Self-Assembly Technology for MEMS and Biomedical Microsystem Applications
Hao-Wen Liang 21
- Graduate year：2016
- Work unit：TSMC
- Thesis title：Polymer Morphology Analysis for Temporary Bonding and Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer in 3D Integration
Yu-Tong Hu 22
- Graduate year：2017
- Work unit：GUC
- Thesis title：Adhesion Property of Polyimide and Passivation Layer with the Usage of Cobalt for Metal/Polymer Hybrid Bonding in 3D Integration
Hsiu-Chi Chen 23
- Graduate year：2017
- Work unit：TSMC
- Thesis title：Development and Investigation of Ultra-Thin Buffer Layers Used in Cu/Sn Bonding for Advanced 3D Integration Applications
Yan-Chun Huang 24
- Graduate year：2017
- Work unit：TSMC
- Thesis title：Investigation of Asymmetry Hybrid Bonding Using Cu/Sn and Cu/Cu Bonding with Polyimide for 3D Heterogeneous Integration Applications
You-Tao Yang 25
- Graduate year：2017
- Work unit：UCLA (Ph.D.)
- Thesis title：Simulation Analysis and Process Development of Low Temperature Cu Direct Bonding Using Pillar-Concave Structure in Advanced Packaging and 3D Heterogeneous Integration
Shu-Yan Jhu 26
- Graduate year：2018
- Work unit：TSMC
- Thesis title：Application of Polyimide in Asymmetry Cu/Sn Hybrid Bonding for 3D Heterogeneous Integration
Jian-Chen Li 27
- Graduate year：2018
- Work unit：NOVATEK
- Thesis title：Process Development and Electrical Investigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D Heterogeneous Integration
Yi-Lun Yang 28
- Graduate year：2018
- Work unit：TSMC
- Thesis title：Adhesion Properties of Polyimide for Metal/Polymer Hybrid Bonding and Copper Electroplating in 3D Integration
Nai-Zhen Ji 29
- Graduate year：2019
- Work unit：Microsoft
- Thesis title：2.5D Heterogeneous Integration Platform of Fingerprint Sensor Using Self-Assembly Technologies
Bo-Zhi Chen 30
- Graduate year：2019
- Work unit：TSMC
- Thesis title：Development of Low Temperature Copper to Copper Bonding Technology Platform for 3D Integrated Circuits
Yi-Jui Chang 31
- Graduate year：2019
- Work unit：TSMC
- Thesis title：Process Development and Device Electrical Investigation of Novel Location-Controlled Grain Technique for Monolithic 3D IC
Pin-Jun Chen 32
- Graduate year：2019
- Work unit：Ericsson
- Thesis title：Process Development and Simulation Analysis for Lowering Thermal Budget on Stacking/Monolithic 3D Integrated Circuits
Chia-Hsuan Lee 33
- Graduate year：2019
- Work unit：Ambarella
- Thesis title：Investigation on the Electrical Characterization and Reliability of Wafer-level Bumpless Through Silicon Via
Ying-Ting Chung 34
- Graduate year：2019
- Work unit：MTK
- Thesis title：Development and Application of AuSn Eutectic and Au-Au Bonding Technology with Diffusion Barrier Layer in 3D Integration Platform
Yu-Wei Liu 35
- Graduate year：2019
- Work unit：
- Thesis title：Development of Well-Defined Single-Grain Silicon Matrix based on novel Location-Controlled-Grain Technology for Monolithic 3D integrated FinFET Circuits
Ming-Yu Huang 36
- Graduate year：2019
- Work unit：MTK
- Thesis title：A Design Flow for Power Stripes and Micro Bumps Planning on Modern Chip-Package Co-Design
Yu-Wen Huang 37
- Graduate year：2019
- Work unit：MTK
- Thesis title：Development of Advanced Frequency Resonator Devices based on Three-Dimensional Integrated Circuit Technology
Chien-Chi Huang 38
- Graduate year：2019
- Work unit：TSMC
- Thesis title：Development and Simulation of Lowering Thermal Budget Technology Platform on Stacking/Monolithic 3D Integrated Circuits
Tzu-Ying Kou 39
- Graduate year：2019
- Work unit：Renesas
- Thesis title：Development of Low Temperature Copper to Copper Bonding Technology with Pt Passivation Platform for 3D Integrated Circuits
Shan-Yu Mao 40
- Graduate year：2019
- Work unit：TSMC
- Thesis title：Development of Strengthened Copper to Copper Bonding Technology for 3D Integrated Circuits
Chia-Jung Lin 41
- Graduate year：2021
- Work unit：ASML
- Thesis title：Application of Ti-wetting and Ag-passivation layer in developing Cu to Cu low temperature bonding for 3D Integrated Circuits
Yi-Cheng Huang 42
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Development of Capacitance Extraction Model and Electrical Performance with Reliability Investigation in Advanced Packaging for 3D Integrated Circuit Applications
Yu-Ting Huang 43
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Miniaturization of Glass-based Advanced Packaging
based on Ultrathin Wafer-level Bonding 3D-IC Technology
Yun-Hsin Liu 44
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Development of Novel Material and Bonding Technology
for Fan-Out Advanced Packaging
Shu-Yun Ku 45
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Development of Biocompatible Heterogeneous Integration Platform based on Three-Dimensional Integrated Technology
Shu-Ting Hsieh 46
- Graduate year：2021
- Work unit：ITRI
- Thesis title：Application of Ti-wetting and Au-passivation layer in developing Cu to Cu low temperature bonding for 3D Integrated Circuits
Kuan-Chun Mei 47
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Development of Non-Copper Metal Bonding Technology Platform for 3D Integrated Circuits
Chih-Wei Chang 48
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Low-Temperature Copper-to-Copper Bonding Technology with Passivation Layer Materials for 3D Integrated Circuits
Yen-Ling Lin 49
- Graduate year：2021
- Work unit：TSMC
- Thesis title：Development of Plasma Activation Technique for Low Temperature Fusion Bonding of Silicon Dioxide in 3D Integration
Chih-I Cho 50
- Graduate year：2022
- Work unit：TSMC
- Thesis title：Development of Low-Temperature Cu-Cu Bonding with Ag-Base Passivation Layer Technology for 3D Integrated Circuits
Hsin-Chi Chang 51
- Graduate year：2022
- Work unit：Media Tek
- Thesis title：Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Using Laser-induced Through Glass Via and Electroless-plated Passivation Technology
Jui-Han Liu 52
- Graduate year：2022
- Work unit：
- Thesis title：Development of wafer-level polymer bonding for 3D heterogeneous integration application
Ming-Wei Weng 53
- Graduate year：2023
- Work unit：TRON FUTURE TECH
- Thesis title：Development of Low Thermal Budget Cu-Cu Bonding by Au Passivation Structure for Multichip Integration Platform
Zong-Liang Chen 54
- Graduate year：2023
- Work unit：
- Thesis title：Development of Plasma-assisted Au-to-Au Bonding Technology and Ultra-thin Wafer Temporary Bonding Technology for Miniaturized MEMS Vacuum Packaging
Chih-Han Chen 55
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Investigation of Bonding Mechanism and Quality Enhancement Approach for Low-Temperature Cu–Cu Bonding with Passivation Technology
Yu-Xian Lin 56
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Development of Low-Temperature Hybrid Bonding Technology by Temporary Bonding Method for Novel Stackable Interposer Integration Platform
Chi-Yu Chen 57
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Development of Novel Electroless-Plated Passivation Layer Deposition Technology Platform for Low-Temperature Copper-to-Copper Bonding Structure with Material Analysis and Reliability Investigation
Ping-Jung Liu 58
- Graduate year：2023
- Work unit：TSMC
- Thesis title：Development of Advanced Dielectric and Metal Material for Hybrid Bonding in 3D Integration
Ya-Ting Chang 59
- Graduate year：2023
- Work unit：Realtek
- Thesis title：Investigation of Room Temperature Polymer Bonding on Flexible Substrate and Low Temperature Polymer-Cu Hybrid Bonding with Au Passivation
Zih-Yang Chen 60
- Graduate year：2024
- Work unit：USYD
- Thesis title：Development of Backside Silicon Removal for Transparent Ultra-thin Wafer-Level Active Layer Transfer by SOI-based Temporary Bonding Scheme
