Advanced Packaging Applications & Heterogeneous Integration
Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
- Bio-system
- Low signal loss, low noise and high reliability
- High density and high channel
- Heterogeneous integration
- Chip-level ENIG bumping technology
Advanced Wafer-level Packaging for MEMS Applications
- MEMS packaging
- Wafer-level-packaged quartz oscillator with TSV fabrication process
- Metal or polymer vacuum sealing technology
- High throughput and low cost
- Silicon substrate or glass substrate packaging
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