國立陽明交通大學 電子所 3DIC LAB
  • About
  • Projects
    • Government
    • Collaboration
  • Technology
    • Low Temperature Bonding Technology
      • Low Temperature Cu-Cu Direct Bonding
      • Cu / Polymer Hybrid Bonding
      • Cu / Dielectric Hybrid Bonding
      • Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
    • 3DIC Enabling Technology
      • Novel Material – Polyimide
      • Monolithic 3DIC
      • Wafer-level Bumpless Through-Silicon-Via (TSV)
      • Novel Low-Warpage Hyper RDL (HRDL) Interposer
    • Advanced Packaging Applications & Heterogeneous Integration
      • Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
      • Advanced Wafer-level Packaging for MEMS Applications
  • Publications
    • ISSCC/IEDM/VLSI
    • Journal
    • Conference
    • Patent
    • Books
  • Professor
  • Members
    • Students
    • Alumni
  • Activities
  • Contact
  • 繁體中文
  • Menu Menu

LINE_ALBUM_2022春酒_220509_69

2022-05-09/by jeremyhong.icst07g

Share this entry
  • Share on Facebook
  • Share on Twitter
  • Share on WhatsApp
/wp-content/uploads/2022/03/3dic-logo.png 0 0 jeremyhong.icst07g /wp-content/uploads/2022/03/3dic-logo.png jeremyhong.icst07g2022-05-09 17:03:532022-05-10 14:09:54LINE_ALBUM_2022春酒_220509_69

 

Professor

National Yang Ming Chiao Tung University
Chiaotung Campus ED506
TEL｜(03)5712121 ext: 31558
FAX｜(03)5724261
E-mail｜knchen@nycu.edu.tw

Laboratory

National Yang Ming Chiao Tung University
Chiaotung Campus ED521

TEL｜(03)5712121 or ext: 54241

© 2022 Copyright - 國立陽明交通大學 電子所
- made by bouncin
Scroll to top