Advanced Packaging Applications & Heterogeneous Integration

Our group proposed the wafer-level packaging solution to realize hermetic encapsulation of quartz resonators based on the technologies of TSV, metal bonding, and wafer thinning. Comparing to conventional quartz resonators assembled by ceramic package, this advanced packaging solution shows the higher electrical performance, lower leakage current, higher reliability, and higher throughput, which can allow the device passing the standard of MIL-STD-883. The schematic illustration of this packaging based on silicon substrate is shown in Figure 1. In addition, the packaging solution using the glass substrate has been also developed, which can further reduce the leakage current and provide tunable CTE, as shown in Figure 2.