國立陽明交通大學 電子所 3DIC LAB
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    • Low Temperature Bonding Technology
      • Low Temperature Cu-Cu Direct Bonding
      • Cu / Polymer Hybrid Bonding
      • Cu / Dielectric Hybrid Bonding
      • Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
    • 3DIC Enabling Technology
      • Novel Material – Polyimide
      • Monolithic 3DIC
      • Wafer-level Bumpless Through-Silicon-Via (TSV)
      • Novel Low-Warpage Hyper RDL (HRDL) Interposer
    • Advanced Packaging Applications & Heterogeneous Integration
      • Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
      • Advanced Wafer-level Packaging for MEMS Applications
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Professor

National Yang Ming Chiao Tung University
Chiaotung Campus ED506
TEL｜(03)5712121 ext: 31558
FAX｜(03)5724261
E-mail｜knchen@nycu.edu.tw

Laboratory

National Yang Ming Chiao Tung University
Chiaotung Campus ED521

TEL｜(03)5712121 or ext: 54241

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