Kuan-Neng Chen (陳冠能)
NAI Fellow (National Academy of Inventors)
IEEE Fellow “for contributions to 3D integrated circuit and packaging technologies”
IET Fellow
IMAPS Fellow
CIEE Fellow
- Ph.D., Department of Electrical Engineering and Computer Science
- M.S., Department of Materials Science and Engineering
Dr. Kuan-Neng Chen is Chair Professor at the Institute of Electronics at the National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, as well as his M.S. degree in Materials Science and Engineering, both from the Massachusetts Institute of Technology (MIT). Dr. Chen has held several prominent positions including Vice President for International Affairs and Associate Dean of the International College of Semiconductor Technology at NYCU, Program Director of the Micro-Electronics Program at the National Science and Technology Council in Taiwan, and Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen has received numerous awards and honors throughout his career, including the IEEE EPS Exceptional Technical Achievement Award, the IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, the National Industrial Innovation Award, the MOST/NSTC Outstanding Research Award (twice), the MOST/NSTC Futuristic Breakthrough Technology Award (twice), the Pan Wen Yuan Foundation Outstanding Research Award, the CIE Outstanding Professor Award, the CIEE Outstanding Professor Award, and the IBM Invention Achievement Awards (5 times). He is the author of over 400 publications, including 3 books and 7 book chapters, and holds 87 patents. Dr. Chen has also served as a Guest Editor for the MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology, and has held leadership roles in various conferences and committees, such as IEEE IITC General Chair. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, IMAPS, and CIEE, as well as a member of Phi Tau Phi Scholastic Honor Society.
Additionally, Dr. Chen holds the position of Specially Appointed Professor at the Tokyo Institute of Technology (Tokyo Tech) and serves as an Adjunct R&D Director at the Industrial Technology and Research Institute (ITRI). His current research interests focus on three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Professional Experiences
Organization | Title | Year |
---|---|---|
Institute of Electronics, National Yang Ming Chiao Tung University | Chair Professor | 2021-now |
Institute of Innovative Research, Tokyo Institute of Technology | Specially Appointed Professor | 2017-now |
Industrial Technology and Research Institute (ITRI) | R&D Director (Joint-Appointment) | 2016-now |
Micro-Electronics Program, National Science and Technology Council (Taiwan) | Program Director | 2021-2023 |
International College of Semiconductor Technology, National Yang Ming Chiao Tung University | Associate Dean | 2015-2022 |
National Yang Ming Chiao Tung University / National Chiao Tung University | Vice President for International Affairs | 2019-2022 |
IEEE Transactions on Components, Packaging and Manufacturing Technology | Guest Editor | 2018-2021 |
Micron | Chair Professor | 2018-2021 |
Department of Electronics Engineering, National Chiao Tung University | Distinguished Professor | 2018-2021 |
Indian Institute of Technology Bombay (IIT Bombay) | Visiting Professor | 2018-2020 |
University of Colorado at Boulder | Visiting Professor | 2017-2018 |
Department of Electronics Engineering, National Chiao Tung University | Professor | 2012-2018 |
National Chip Implementation Center (CIC) | Adjunct Research Staff Member | 2011-2016 |
Industrial Technology and Research Institute (ITRI) | Consultant | 2009-2016 |
Massachusetts Institute of Technology (MIT) | Visiting Scientist | 2015 |
“Materials Challenges in Three-Dimensional Integrated Circuits”, MRS Bulletin | Guest Editor | 2015 |
The Electronics Devices and Materials Association (EDMA) | Secretary-general | 2011-2014 |
ASE-NCTU R&D Center | Deputy Director | 2011-2013 |
Department of Electronics Engineering, National Chiao Tung University | Associate Professor | 2009-2012 |
IBM T.J. Watson Research Center | Academic Visitor | 2010 |
Nanyang Technological University, Singapore | Visiting Researcher | 2009 |
IBM T.J. Watson Research Center | Research Staff Member | 2005-2009 |
INTEL | Component Research | 2002 |
Fellows
Organization | Title |
---|---|
National Academy of Inventors (NAI) | Fellow |
IEEE | Fellow, “for contributions to 3D integrated circuit and packaging technologies” |
IET | Fellow |
IMAPS | Fellow |
CIEE | Fellow |
Honors and Awards
Award | Year |
---|---|
Futuristic Breakthrough Technology Award, Future Tech (NSTC) | 2022 |
Outstanding Research Award, Pan Wen Yuan Foundation | 2022 |
MOST Outstanding Research Award, Ministry of Science and Technology | 2021, 2018 |
IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award | 2021 |
National Industrial Innovation Award, Ministry of Economic Affairs | 2021 |
Futuristic Breakthrough Technology Award, Future Tech (MOST) | 2019 |
IEEE EPS Exceptional Technical Achievement Award | 2018 |
Outstanding Engineering Professor Award, The Chinese Institute of Engineers (CIE) | 2017 |
Outstanding Electrical Engineering Professor Award, The Chinese Institute of Electrical Engineering (CIEE) | 2014 |
EDMA Outstanding Service Award | 2014 |
Outstanding Youth Electrical Engineer Award, The Chinese Institute of Electrical Engineering (CICC) | 2012 |
Adventech Young Professor Award | 2012、2011、2010 |
EDMA Outstanding Youth Award | 2010 |
IBM Invention Achievement Award | Aug 2008, Dec 2007, Sep 2007, May 2007, Dec 2006 |
NYCU Honors and Awards
Award | Year |
---|---|
NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Award | 2022, 2021, 2020, 2017, 2014, 2012, 2011 |
Excellent Teaching Award, College of EE, NYCU/NCTU | 2021, 2015 |
Excellent Teaching Award, NCTU | 2020 |
NCTU Excellent Academic Advisor Award | 2016, 2015, 2013 |
EECS Outstanding Young Scholar Award, NCTU | 2016 |