– Publications –

Conference

ISSCC/IEDM/VLSI

Journal

140

Conference

237

Patent

Books

[Invited] Kuan-Neng Chen, “Hybrid Bonding Innovations: Ultra-Low Temperature Cu-Cu Bonding Based Passivation Technology and HRDL Platform Development for RDL Interposer Applications”, IEEE Hybrid Bonding Symposium, Milpitas, CA, Jan. 16-17, 2025.
Yi-Hsuan Chen, Yuan-Chiu Huang, Ya-Ting Chang, Jumpei Fujikata, Keiko Abe, Naoko Araki, Takayuki Ohba, and Kuan-Neng Chen, “A Novel Polymer Material for Low-Temperature Hybrid Bonding and Flexible Substrate Applications,” IMPACT 2024, Taipei, Taiwan, Oct. 22-25, 2024.
[Invited] Kuan-Neng Chen, “Development of Hybrid Bonding: Perspectives on Material Selection, Structural Design, and Applications”, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024
Yu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung, Yuan-Chiu Huang, and Kuan-Neng Chen, “Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology”, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024.
Tzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai, Mu-Ping Hsu, and Kuan-Neng Chen, “Low-temperature Adhesive Hybrid Bonding Technology with Novel Aera-selective Passivation Layer”, IEEE International 3D Systems Integration Conference (3D IC), Sendai, Japan, Sep. 25-27, 2024.
Wen-Tzu Tsai, Mu-Ping Hsu, Yi-Hsuan Chen, Yuan-Chiu Huang, and Kuan-Neng Chen, “Development of Hybrid Bonding Using Area-Selective Passivation Layer Deposition Technology on Various Substrates for Heterogeneous Integrated Structure”, 2024 IEEE International Conference on Solid State Devices and Materials (SSDM), Hyogo, Japan, Sep 1-4, 2024.
Yu-Ming Pan, Huan-Yu Chiu, Nien-Chih Lin, Hao-Tung Chung, Bo-Jheng Shih, Chih-Chao Yang, Po-Tsang Huang, Chang-Hong Shen, Po-Jung Sung, Wen-Fa Wu, Kuan-Neng Chen, and Chenming Hu, “Large-Area Single-Crystal Ge Using Elevated Epitaxy Technique for Monolithic 3D Integration”, 2024 IEEE International Conference on Solid State Devices and Materials (SSDM), Hyogo, Japan, Sep 1-4, 2024.
[Invited] Kuan-Neng Chen, “Research and Technology Advances of 3D IC”, IEDMS & SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024.
Kai-Fang Lai, Li-Hsin Cheng, Chiao-Yen Wang, and Kuan-Neng Chen, “Investigation of Low Temperature Wafer-level Cobalt-to-Cobalt Bonding with Passivation Structure for Three-dimensional Integrated Circuits Applications”, IEDMS & SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024.
Ching-Lin Chen, Yu-Chun Chen, Huan-Yu Chiu, Yu-Ming Pan, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, Kuan-Neng Chen, and Chenming Hu, “Investigating the Impact of Nitride Capping Thickness on Monolithic 3DICs Through Thermal Simulation”, IEDMS & SNDCT 2024, Taichung, Taiwan, Aug. 19-21, 2024
Chien Kang Hsiung, Terry Wang, Sarah Wozny, Marvvin L Bernt, and Kuan-Neng Chen, “Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure,” 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 – May 31, 2024.
Mu-Ping Hsu, Wen-Tsu Tsai, Ou-Hsiang Lee, Chi-Yu Chen, Tzu-Ying Kuo, Hsiang-Hung Chang, Hsin-Chi Chang, Zhong-Jie Hong, and Kuan-Neng Chen, “Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective Metal Passivation (Interface Metal) Technology for 3D IC and Advanced Packaging,” 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 – May 31, 2024.
Bo-Jheng Shih, Yu-Ming Pan, Chiao-Yen Wang, Huan-Yu Chiu, Chih-Chao Yang, Chang-Hong Shen, and Kuan-Neng Chen, “Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique on Different Oriented Wafers for Monolithic 3DIC Integration,” 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 – May 31, 2024.
Chiao-Yen Wang, Tzu-Heng Hung, Ping-Jung Liu, and Kuan-Neng Chen, “Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging,” 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, Co, May 28 – May 31, 2024.
Y. T. Hung, J. Z. Huang, H. H. Chang, K. P. Huang, O. H. Lee, H. C. Chien, C. H. Wang, W. C. Lo, C. I. Wu, and K. N. Chen, “Reliability Investigation of Cobalt and Copper Damascene Interconnects with Capped Graphene,” 2024 International Conference on Electronics Packaging (ICEP) Conference, Toyama, Japan, Apr. 17-20, 2024.
Kai-Yu Chao, Chiao-Yen Wang, Ping-Jung Liu, Tzu-Heng Hung, and Kuan-Neng Chen, “Evaluation of Copper Nitride Passivation Layer by Plasma Pretreatment for Low Temperature Copper-to-Copper Bonding,” International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.
Huan-Yu Chiu, Chen-Wen Chou, Yu-Ming Pan, Hao-Tung Chung, Chih-Chao Yang, Chang-Hong Shen, and Kuan-Neng Chen, “Location-controlled-grain Technique using Green Nanosecond Laser to Germanium Crystallization for Monolithic 3D IC,” International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.
Yao-Cheng Yang, Jui-Han Liu, Yuan-Chiu Huang, and Kuan-Neng Chen, “Low-Temperature Wafer-Level Polyimide to Polyimide Bonding in Advanced Packaging”, International Electron Devices and Materials Symposium (IEDMS), Kaohsiung, Taiwan, Oct. 19-20, 2023.
[Invited] Kuan-Neng Chen, “From Backend 3D to Frontend 3D: New Platforms for 3DIC and Advanced Packaging,” Heterogeneous Integration Global Summit, SEMICON Taiwan, Taipei, Taiwan, Sep. 5-8, 2023.
Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Nei-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Wen-Fa Wu, Kuan-Neng Chen, and Chenming Hu, “Middle-End of Line Si FinFETs Using Laser-Liquid-Phase-Epitaxy Technique for Monolithic 3DIC”, 2023 IEEE International Conference on Solid State Devices and Materials (SSDM), Nagoya, Japan, Sep 5-8, 2023.
Mu-Ping Hsu, Hsin-Chi Chang, Yi-Chieh Tsai, and Kuan-Neng Chen, “Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Glass Substrate and Area-Selective Passivation Technology”, 2023 IEEE International Conference on Solid State Devices and Materials (SSDM), Nagoya, Japan, Sep 5-8, 2023.
[Invited] Kuan-Neng Chen, “Hybrid Bonding: The Key Technology to Reach Fine Pitch and High Density Stacking in Heterogeneous Integration,” 2023 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 17-20, 2023.
[Invited] Kuan-Neng Chen, “3DIC Introduction and What Can ALD Do in 3DIC,” 7th Area Selective Deposition (ASD) Workshop, Incheon, Korea, Apr. 2-5, 2023.
[Invited] Kuan-Neng Chen, “3D IC and Advanced Packaging,” 2022 IEEE Asian Solid-State Circuit Technology Conference (A-SSCC), Taipei, Taiwan, Nov. 6-9, 2022.
[Invited] Tzu-Heng Hung, and Kuan-Neng Chen, “Surface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration,” 2022 IEEE 15th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Virtual Conference, Nov. 3-6, 2022.
Ming-Wei Weng, Zhong-Jie Hong, Tai-Yu Lin, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of the Effect of Crystallinity on Low-temperature Cu-Cu Bonding with Passivation Layer”, International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Oct. 27-28, 2022.
Chun-Ta Li, Ming-Chih Chen, Jui-Han Liu, and Kuan-Neng Chen, “Investigation of Roomtemperature Adhesive Bonding in 3D Integration and Packaging”, International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Oct. 27-28, 2022.
[Invited] Kuan-Neng Chen, “Development of Hybrid Bonding, Innovation Applications and Platform for 3DIC,” IMPACT 2022, Taipei, Taiwan, Oct. 26-28, 2022.
Demin Liu, Kuan-Chun Mei, Han-Wen Hu, Yi-Chieh Tsai, Huang-Chung Cheng, and Kuan-Neng Chen, “Investigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct Bonding,” 2022 IEEE 72th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 31 – Jun. 3, 2022.
Yu-Tao Yang, Haoxiang Ren, Su Kong Chong, Gang Qiu, Shu-Yun Ku, Yang Cheng, Chaowei Hu, Tiema Qian, Kuan-Neng Chen, Ni Ni, Kang L. Wang, and Subramanian S. Iyer, “RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for future large-scale quantum applications,” 2022 IEEE 72th Electronic Components and Technology Conference (ECTC), San Diego, CA, May 31 – Jun. 3, 2022.
[Invited] Kuan-Neng Chen, “Low Temperature Cu-Cu Hybrid Bonding: The Evolution from 400°C to Near Room Temperature,” 2022 International Conference on Electronics Packaging (ICEP) Conference, Hokkaido, Japan, May 11-14, 2022.
[Invited] Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding and Platform Development,” IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.
Demin Liu, Yi-Chieh Tsai, Han-Wen Hu, Po-Chi Chen, Chia-Yong Lim, and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding and Platform Development,” IMPACT 2021, Taipei, Taiwan, Dec. 21-23, 2021.
Hao-Tung Chung, Yu-Ming Pan, Bo-Jheng Shih, Han-Wen Hu, Chih-Chao Yang, Chang-Hong Shen, Huang-Chung Cheng, Kuan-Neng Chen, and Chenming Hu, “Green Nanosecond Laser Crystallized Ge FinFETs for Monolithic 3-D ICs”, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.
Jui-Han Liu, Demin Liu, Han-Wen Hu, Bruce Peng, Yuang-Chiu Huang, and Kuan-Neng Chen, “Adjustable Curing Parameters for Flexible Polymer Adhesive Bonding in 3DIC Applications”, International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov. 18-19, 2021.
Chia-Hsin Lee, Baron Huang, Jennifer See, Xiao Liu, Yu-Min Lin, Chao-Jung Chen, and Kuan-Neng Chen, “Versatile laser release material development for chip-first and chip-last fan-out wafer level packaging,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4,
Tzu-Heng Hung, Ting-Cih Kang, Shan-Yu Mao, Tzu-Chieh Chou, Han-Wen Hu, Hsih-Yang Chiu, Chiang-Lin Shih, and Kuan-Neng Chen, “Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4,
Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Ming-Chang Lin, Tsau-Hua Hsieh, and Kuan-Neng Chen, “Ultra-High Strength Cu-Cu Bonding under Low Thermal Budget for Chiplet Heterogeneous Applications,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4,
Yuan-Chiu Huang, Demin Liu, Kuma Hsiung, Tzu-Chieh Chou, Han-Wen Hu, Arvind Sundarrajan, Hsin-Chi Chang, Yi-Yu Pan, Ming-Wei Weng, and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4,
Shu-Yun Ku, Tzu-Chieh Chou, Yi-Chieh Tsai, Han-Wen Hu, Yu-Ren Fang, Yu-Ju Lin, Po-Tsang Huang, Jin-Chern Chiou, and Kuan-Neng Chen, “Advanced 2.5D Heterogeneous Integrated Platform Using Flexible Biocompatible Substrate for Biomedical Sensing System,” 2021 IEEE 71th Electronic Components and Technology Conference (ECTC), Virtual, Jun. 1 – Jul. 4,
[Invited] Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding: The Evolution of Bonding Technology,” SNDCT 2021, Hsinchu, Taiwan, May 20-21, 2021.
Ming-Wei Weng, Shan-Yu Mao, Demin Liu, Han-Wen Hu, and Kuan-Neng Chen, “Asymmetric Low Temperature Cu-Polymer Hybrid Bonding with Au Passivation Layer,” 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 19-22, 2021.
[Invited] Han-Wen Hu, and Kuan-Neng Chen, “Low Bonding Temperature Development for High Throughput 3D Heterogeneous Integration Platform,” 2020 IEEE 14th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Virtual Conference, Nov. 3-6, 2020.
[IEDMS 2020 Best Paper Award] Yu-Wei Liu, Yi-Jui Chang, Chih-Chao Yang, Chang-Hong Shen, Kuan-Neng Chen, and Chenming Hu, “Investigation of Cooling Hole Structure in Location-Controlled-Grain Technique for Monolithic 3DIC”, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.
Jui-Han Liu, Hsin-Chi Chang, Yi-Chieh Tsai, Chia-Hsuan Lee, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and Kuan-Neng Chen, “Highly Accelerated Stress Test Reliability of WOW Bumpless Through Silicon Vias”, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.
Hsin-Chi Chang, Ming-Wei Weng, Yi-Yu Pan, Demin Liu, Yuan-Chiu Huang, Han-Wen Hu, and Kuan-Neng Chen, “Using Annealing Process to Improve Electrical Properties in Low-Temperature Cu-to-Cu Bonding with Passivation Layer”, International Electron Devices and Materials Symposium (IEDMS), Taoyuan, Taiwan, Oct. 15-16, 2020.
Yu-Wei Liu, Yi-Jui Chang, Chih-Chao Yang, Chang-Hong Shen, Kuan-Neng Chen, and Chenming Hu, “Effect of Dielectric Layer Scheme for High-Quality Silicon Channel in Monolithic 3DIC”, 2020 IEEE International Conference on Solid State Devices and Materials (SSDM), Sep. 27-30, 2020.
Demin Liu, Po-Chih Chen, and Kuan-Neng Chen, “A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation Layer,” 2020 IEEE Electronic Components and Technology Conference (ECTC), Jun. 3 – 30, 2020.
Ming-Yu Huang, Hung-Ming Chen, Kuan-Neng Chen, Shih-Hsien Wu, Yu-Min Lee, and An-Yu Su, “A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design,” 2020 IEEE Electronic Components and Technology Conference (ECTC), Jun. 3 – 30, 2020.
[Invited] Kuan-Neng Chen, “Cu-Based Bonded Interconnects for 3D Integration and Advanced Packaging Applications,” 2019 MRS-T Annual Meeting, Tainan, Taiwan, Nov. 15-16, 2019.
[Invited] Kuan-Neng Chen, Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, “Applications and Schemes based on 3D Heterogeneous Integration,” The 13^thInternational Conference on ASIC (ASICON 2019), Chonqing, China, Oct. 29-Nov.1, 2019.
Pin-Jun Chen, Chih-Ming Shen, Chih-Chao Yang, Ming-Chi Tai, Wei-Chung Lo, Chang-Hong Shen, Chenming Hu, and Kuan-Neng Chen, “Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC”, IMPACT-IAAC 2019, Taipei, Taiwan, Oct. 23-25, 2019.
[Invited] Kuan-Neng Chen, Tzu-Chieh Chou, Yi-Chieh Tsai, and Demin Liu, “Low Temperature Cu-Cu Direct Bonding for 3D Integration and Advanced Packaging,” ADMETA Plus 2019, Tokyo, Japan, Oct. 10 – Oct. 11, 2019.
Yi-Chieh Tsai, Chia-Hsuan Lee, and Kuan-Neng Chen, “Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
Po-Chih Chen, Demin Liu, and Kuan-Neng Chen, “Low-Temperature Wafer-Level Au-Au Bonding at 100°C”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, and Kuan-Neng Chen, “Low Temperature Cu-Cu Direct Bonding Below 150°C with Au Passivation Layer”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young Suk Kim, Kuan-Neng Chen, and Takayuki Ohba, “Temperature Cycling Reliability of Wow Bumpless Through Silicon Vias”, IEEE 3D System Integration Conference, Sendai, Japan, Oct 8 – Oct 10, 2019.
Yu-Min Lin, Sheng-Tsai Wu, Chun-Min Wang, Chia-Hsin Lee, Shin-Yi Huang, Ang-Ying Lin, Tao-Chih Chang, Puru Bruce Lin, Cheng-Ta Ko, Yu-Hua Chen, Jay Su, Xiao Liu, Qi Wu, and Kuan-Neng Chen, “An RDL-First Fan-out Panel Level Package for Heterogeneous Integration Applications,” 2019 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 – May 31, 2019.
Kai-Ming Yang, Tzu-Chieh Chou, Cheng-Ta Ko, Chen-Hao Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Wen-Wei Wu, and Kuan-Neng Chen, “Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package,” 6th International Workshop on Low Temperature Bonding for 3D Integration, Kanazawa, Japan, May 21-25, 2019.
Yi-Lun Yang, Jia-Ling Liu, Guan Wei Chen, Shoichi Kodama, Kyosuke Kobinata, Kuan-Neng Chen, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, “Highly Reliable Four-Point Bending Test Using Stealth Dicing Method for Adhesion Evaluation,” 2019 International Conference on Electronics Packaging (ICEP) Conference, Toki Messe, Niigata, Japan, Apr. 17-20, 2019.
Shu-Yun Ku, Yi-Chieh Tsai, and Kuan-Neng Chen, “Investigation of Fine-pitch Chip-level Cu-Cu Bonding Under Low Temperature,” International Electron Devices and Materials Symposium (IEDMS), Keelung, Taiwan, Nov 14-16, 2018.
[Invited] Kuan-Neng Chen, “Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration,” 2018 IEEE 14th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Qingdao, China, Oct. 31 – Nov. 3, 2018.
Yu-Ming Pan, Yu-Tao Yang, Tzu-Chieh Chou, Ting-Yang Yu, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Simulation Analysis of Structure Design for Low Temperature Cu-Cu Direct Bonding in Heterogeneous Integration and Advanced Packaging Systems”, IMPACT 2018, Taipei, Taiwan, Oct. 25-27, 2018.
[Invited] Kuan-Neng Chen, “Low Temperature Bonding Technology for Advanced Packaging and 3D Integration,” ADMETA Plus 2018, Beijing, China, Oct. 10 – Oct. 12, 2018.
Yi-Lun Yang, Cheng-Hsien Lu, Yu-Pei Chen, Chiao-Pei Chen, Tsung-Tai Hung, Chiu-Feng Chen and Kuan-Neng Chen, “Effect of Electroplating on Adhesion between Copper/Titanium and Polyimide in Redistribution Layers and Hybrid Bonding Scheme for Advanced Packaging Applications”, 2018 IEEE International Conference on Solid State Devices and Materials (SSDM), Tokyo, Japan, Sep 9-13, 2018.
Chia-Hsin Lee, Jay Su, Xiao Liu, Qi Wu, Jim-Wein Lin, Puru Lin, Cheng-Ta Ko, Yu-Hua Chen, Wen-Wei Shen, Tzu-Ying Kou, Yu-Min Lin, and Kuan-Neng Chen, “Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging,” 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 – Jun. 1, 2018.
Yu-Min Lin, Sheng-Tsai Wu, Wen-Wei Shen, Shin-Yi Huang, Tzu-Ying Kuo, Ang-Ying Lin, Tao-Chih Chang, Hsiang-Hung Chang, Shu-Man Lee, Chia-Hsin Lee, Jay Su, Xiao Liu, Qi Wu, and Kuan-Neng Chen, “An RDL-First Fan-out Wafer Level Package for Heterogeneous Integration Applications,” 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 – Jun. 1, 2018.
Cheng-Hsien Lu, Yi-Tung Kho, Yu-Tao Yang, Yu-Pei Chen, Chiao-Pei Chen, Tsung-Tai Hung, Chiu-Feng Chen, and Kuan-Neng Chen, “Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration,” 2018 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 – Jun. 1, 2018.
[Invited] Kuan-Neng Chen, “Low Temperature Bonding Technology for 3D Integration and Advanced Packaging,” 2018 International Conference on Electronics Packaging (ICEP) Conference, Kuwana, Mie, Japan, Apr. 17-21, 2018.
[Invited] Kuan-Neng Chen, “Research Achievements of Key Technologies in 3D Integration and Heterogeneous Integration,” China Semiconductor Technology International Conference, Shanghai, China, Mar. 11-12, 2018.
-T. Huang, Y.-C. Huang, S.-L. Wu, Y.-C. Hu, M.-W. Lu, T.W. Sheng, F.K. Chang, C.-P. Lin, N.-S. Chang, H.-L. Chne, C.-S. Chen, T.-W. Chiu, W. Hwang, K. N. Chen, C.-T. Chuang and J.-C. Chiou, “Wireless Neural-Sensing Microsystem using TSV-Embedded Dissolvable μ-Needle Array and Flexible Interposer,” 2018 Symposium on Engineering, Medicine, and Biology Applications (SEMBA), Taipei, Taiwan, Feb. 2-4, 2018.
Hsiu-Chi Chen, Yi-Tung Kho, Yen-Jun Huang, Yu-Sheng Hsieh, Yao-Jen Chang, Ya-Sheng Tang, Ting-Yang Yu and Kuan-Neng Chen, “Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications”, IMPACT 2017, Taipei, Taiwan, Oct. 25-27, 2017.
Yen-Jun Huang, Hsiu-Chi Chen, Ting-Yang Yu, Bo-Hung Lai, Yu-Chiao Shih, and Kuan-Neng Chen, “Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications”, IMPACT 2017, Taipei, Taiwan, Oct. 25-27, 2017.
[Invited] Kuan-Neng Chen, “Research Advances and Applications of 3D Integration,” The 12^thInternational Conference on ASIC (ASICON 2017), Guiyang, China, Oct. 25-28, 2017.
Tzu-Chieh Chou, Yu-Tao Yang, Ting-Yang Yu, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Low Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration”, 2017 IEEE International Conference on Solid State Devices and Materials (SSDM), Sendai, Japan, Sep 19-22, 2017.
Yu-Wei Liu, Shih-Feng Liu, Cheng-Hsien Lu, De-Min Liu, and Kuan-Neng Chen, “Study of Adhesion Strength and Reliability between Ti/Cu, Cu RDL and Polyimide in 3D Integration and Advanced Packaging”, International Electron Devices and Materials Symposium (IEDMS), Hsinchu, Taiwan, Sep 5-7, 2017.
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Yung-Kuei Wang, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou, “A 64-Channel Neural-Sensing Microsystem with TSV-Embedded Micro-Probe Array for Neural Signal Acquisition,” The 19th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2017), Kaohsiung, Taiwan, Jun. 18-22, 2017.
Yu-Tao Yang, Ting-Yang Yu, Shu-Chiao Kuo, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration,” 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 – Jun. 2, 2017.
Nai-Chen Chi, Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and Kuan-Neng Chen, “High Transmittance Broadband THz Polarizer Using 3D-IC Technologies,” 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 – Jun. 2, 2017.
Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Shu-Man Lee, Ang-Ying Lin, Hsiang-Hung Chang, Tao-Chih Chang, Alvin Lee, Jay Su, Baron Huang, Ram Trichur, Dongshun Bai, Xiao Liu, and Kuan-Neng Chen, “Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP,” 2017 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 30 – Jun. 2, 2017.
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou, “An Implantable 128-Channel Wireless Neural-Sensing Microsystem Using TSV-Embedded Dissolvable m-Needle Array and Flexible Interposer,” 2017 IEEE International Symposium on Circuits and Systems (ISCAS), Baltimore, MD, USA, May 28-31, 2017.
Cheng-Ta Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, Tzu-Chieh Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, and Tzyy-Jang Tseng, “Study on Low Temperature Cu Bonding and Temporary Bond/De-Bond for RDL-First Fan-Out Panel Level Package,” 5th International Workshop on Low Temperature Bonding for 3D Integration, Tokyo, Japan, May 16-18, 2017.
Geng-Ming Chang, Shih-Wei Lee, Ching-Yun Chang, and Kuan-Neng Chen, “Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration,” 2017 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 24-27, 201
Nai-Chen Chi, Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and Kuan-Neng Chen, “High Transmittance and Broaden Bandwidth through the Morphology of Anti-Reflective Layers on THz Polarizer with Si Substrate,” SPIE Optics + Optoelectronics 2017, Prague, Czech Republic, Apr. 24-27, 201
Cheng-Hsien Lu, Yi-Tung Kho, Chuan-An Cheng, Yen-Jun Huang, and Kuan-Neng Chen, “Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration,” 2017 International Conference on Electronics Packaging (ICEP), Tendo, Yamagata, Japan, Apr. 19-21, 2017.
[Invited] Kuan-Neng Chen, “Key Technologies and Application Demonstrations of 3D Heterogeneous Integration and FOWLP,” China Semiconductor Technology International Conference, Shanghai, China, Mar. 12-13, 2017.
[Invited] Chih Chen, Chien-Min Liu, Tien-Lin Lu, Han-wen Lin, Yi Cheng Chu, Chia-Ling Lu, Jing-Ye Juang, Kuan-Neng Chen, and King-Ning Tu, “Low-Temperature Cu-to-Cu Direct Bonding Enabled by Highly (111)-oriented and Nanotwinned Cu,” TMS 2017 146^th Annual Meeting and Exhibition, San Diego, CA, USA, Feb. 27- Mar. 2, 2017.
Yan-Pin Huang, and Kuan-Neng Chen, “Dry-Film Technology Development for Advanced 3D IC and Heterogeneous Integration Applications,” International Electron Devices and Materials Symposium (IEDMS), Taipei, Taiwan, Nov 24-25, 2016.
Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer,” IEEE 3D System Integration Conference, San Francisco, CA, USA, Nov. 8-11, 2016.
Yu-Tao Yang, Yu-Chen Hu, and Kuan-Neng Chen, “Reliability Investigation and Mechanism Analysis for a Novel Bonding Method of Flexible Substrate in 3D Integration,” IEEE 3D System Integration Conference, San Francisco, CA, USA, Nov. 8-11, 2016.
[Invited] Kuan-Neng Chen, “Key Technologies and Materials Investigation for FOWLP and 3D Integration,” 2016 IEEE 13th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Hangzhou, China, Oct. 25-28, 2016.
Ching-Yun Chang, Shih-Wei Lee, Geng-Ming Chang, and Kuan-Neng Chen, “Single Sided Heating Method for Chip-to-Wafer Bonding with Submicron Cu/In Interconnects,” IMPACT 2016, Taipei, Taiwan, Oct. 26-28, 2016.
Alvin Lee, Jay Su, Baron Huang, Ram Trichur, Dongshun Bai, Xiao Liu, Wen-Wei Shen, Yu-Min Lin, Tao-Chih Chang, Hsiang-Hung Chang, Chia-Wei Chiang, Huan-Chun Fu, K. C. Chen, Yu-Lan Lu, and Kuan-Neng Chen, “Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packaging,” IMAPS 2016, Pasadena, CA, USA, Oct. 11-13, 2016.
Ting-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, and Kuan-Neng Chen, “Quality and Reliability Investigation of Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique,” 2016 IEEE International Conference on Solid State Devices and Materials (SSDM), Tsukuba, Japan, Sep 26-29, 2016.
Hsiao-Chun Chang, Yu-Chen Hu, and Kuan-Neng Chen, “Uneven-Topography-Chip 3D Heterogeneous Integration Using Double Self Assembly Technology for MEMS and Biomedical Microsystem Applications,” The 42th International Conference on Micro and Nano Engineering (MNE 2016), Vienna, Austria, Sep. 19-23, 2016.
[IPFA 2016 Best Paper Award] Hao-Wen Liang, Ting-Yang Yu, Yao-Jen Chang, and Kuan-Neng Chen, “Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer layer Technique for 3D Integration,” 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016), Singapore, Jul. 18-21, 2016.
Yu-Chen Hu, and Kuan-Neng Chen, “Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substrate Integration,” IEEE Silicon Nanoelectronics Workshop (SNW), Honolulu, HI, USA, Jun. 12-13, 2016.
Yu-Hsiang Huang, Hao-Wen Liang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology,” 2016 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 31 – Jun. 3, 2016.
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou, “An Ultra-High-Density 256-channel/25mm² Neural Sensing Microsystem using TSV-embedded Neural Probes,” 2016 IEEE International Symposium on Circuits and Systems (ISCAS), Montreal, Canada, May 22-25, 2016.
Chuan-An Cheng, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application,” 2016 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 25-27, 201
Shih-Wei Lee, Shu-Chiao Kuo, and Kuan-Neng Chen, “Electrical Testing Structure for Stacking Error Measurement in 3D Integration,” 2016 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 25-27, 2016.
[Invited] Kuan-Neng Chen, “Development of 3D IC Technologies for Heterogeneous Integration and Neural Sensing Applications,” 2016 International Conference on Electronics Packaging (ICEP) Conference, Sapporo, Japan, Apr. 20-22, 2016.
[Invited] Kuan-Neng Chen, “Research Advances of Low Temperature Bonding Technology in 3D Integration and Heterogeneous Integration,” China Semiconductor Technology International Conference, Shanghai, China, Mar. 13-14, 2016.
[Invited] Chien-Hung Lin, and Kuan-Neng Chen, “Submicron Polymer Temporary Bonding with Ultra-Fast Laser Ablation Application in 3D Semiconductor Package,” China Semiconductor Technology International Conference, Shanghai, China, Mar. 13-14, 2016.
Yu-Hsiang Huang, Yan-Pin Huang, and Kuan-Neng Chen, “Electrical and Stability Investigation of Copper Pillars in 3D LSI Technologies,” International Electron Devices and Materials Symposium (IEDMS), Tainan, Taiwan, Nov 19-20, 2015.
Hsiao-Chun Chang, Cheng-Han Fan, Yi-Chia Chou, and Kuan-Neng Chen, “Study of Self-Assembly Technology for 3D Integration Applications,” IMPACT 2015, Taipei, Taiwan, Oct. 21-23, 2015.
[Invited] Kuan-Neng Chen, “3D IC and Heterogeneous Integration: A Game Changer to Semiconductor, or Not?”, CIE-GNYC 2015 Annual Convention, New York, NY, USA, Oct 17, 2015.
Shu-Lin Lu, Yen-Pin Huang, Yu-Shang Huang, Yi-Hsiu Tseng, Min-Fong Shu, and Kuan-Neng Chen, “Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications,” 2015 IEEE International Conference on Solid State Devices and Materials (SSDM), Sapporo, Japan, Sep 27-30, 2015.
Cheng-Hsien Lu, Jian-Yu Shih, Yu-Wei Chang, Yi-Tung Kho, and Kuan-Neng Chen, “A Novel Packaging Approach of SAW Devices Using 3D IC Technology,” Symposium on Nano Device Technology, Hsinchu, Taiwan, Sep. 10, 2015.
Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, and Kuan-Neng Chen, “Electrical Investigation of Cu Pumping in Through-Silicon Vias for BEOL Reliability in 3D Integration,” IEEE 3D System Integration Conference, Sendai, Japan, Aug. 31-Sep 2, 2015.
Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration,” IEEE 3D System Integration Conference, Sendai, Japan, Aug. 31-Sep 2, 2015.
Ting-Yang Yu, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and Kuan-Neng Chen, “High Transmittance Silicon Terahertz Polarizer Using Wafer Bonding Technology,” SPIE Optics + Photonics 2015, San Diego, CA, USA, Aug. 9-13, 2015.
Yu-Wei Chang, and Kuan-Neng Chen, “Fabrication and Reliability Investigation of Copper Pillar and Tapered Through Silicon Via (TSV) for Direct Bonding in 3D Integration,” The 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015), Hsinchu, Taiwan, Jun. 29 – July 2, 2015.
Tsung-Yen Tsai, Yao-Jen Chang, and Kuan-Neng Chen, “Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology,” The 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2015), Hsinchu, Taiwan, Jun. 29 – July 2, 2015.
Yu-Sheng Hsieh, Ting-Ting Shen, Yu-San Chien, Yuko Shinozaki, Naohiko Kawasaki, and Kuan-Neng Chen, “Investigation of Low Temperature Cu/In Bonding in 3D Integration,” 2015 IEEE Conference on Electron Devices and Solid-State Circuits (EDSSC), Singapore, Jun. 1-4, 2015.
Wen-Wei Shen, Hsiang-Hung Chang, Cheng-Ta Ko, Leon Tsai, Bor Kai Wang, Aric Shorey, Alvin Lee, Jay Su, Baron Chen, Wei-Chung Lo, and Kuan-Neng Chen, “Ultra-thin Glass Wafer Lamination and Laser De-bonding to Enable Glass Interposer Fabrication,” 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 – 29, 2015.
Yu-Chen Hu, Yu-Sheng Hsieh, Anthony J. Gallegos, Wei-Chia Chen and Kuan-Neng Chen, “3D Heterogeneous Integration Structure Based on 40 nm- and 0.18 μm- Technology Nodes,” 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 – 29, 2015.
S. Hsieh, Y. J. Chang, and K. N. Chen, “Development and Electrical Investigation of Novel Fine-Pitch Cu/Sn Pad Bumping Using Ultra-Thin Buffer Layer Technique in 3D Integration,” 2015 IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 26 –29, 2015.
Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, and Kuan-Neng Chen, “Low Temperature Bonding of Cu/Pd-Pd/Cu Interconnects for Three-Dimensional Integration Applications”, 2015 IEEE International Interconnect Technology Conference (IITC), Grenoble, France, May 18 -21, 2015.
[Invited] Kuan-Neng Chen, “Research Achievements and Application Demonstrations of 3D IC and Heterogeneous Integration,” China Semiconductor Technology International Conference, Shanghai, China, Mar 15-16, 2015.
Cheng-Hsien Lu, Yao-Jen Chang, Yu-Sheng Hsieh, Chuan-An Cheng, and Kuan-Neng Chen, “Heterogeneous Integration of Si/GaAs Wafer-Level Polyimide Bonding,” International Electron Devices and Materials Symposium (IEDMS), Hualien, Taiwan, Nov 20-21, 2014.
Jian-Yu Shih, Shih-Wei Lee, Yu-Chen Hu, Yen-Chi Chen, Chih-Hung Chiu, Chi-Chung Chang, and Kuan-Neng Chen, “Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure,” IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.
[IMPACT-EMAP 2014 Paper Award] Shih-Wei Lee, Jian-Yu Shih, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, and Kuan-Neng Chen, “Polymer TSV Fabrication Scheme with Its Electrical and Reliability Test Vehicle,” IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.
[IMPACT-EMAP 2014 Paper Award] Chien-Min Liu, Han-wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and K. N. Tu, “Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces,” IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.
Cheng-Han Fan, Yao-Jen Chang, Yi-Chia Chou, and Kuan-Neng Chen, “Interdiffusion of Cu-Sn System with Ni Ultra-thin Buffer Layer and Material Analysis of IMC Growth Mechanism,” IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.
Yu-Chen Hu, Yao-Jen Chang, Chun-Shen Wu, Yung Mao Cheng, Wei Jen Chen, and Kuan-Neng Chen, “Research of Electroplating and Electroless Plating for Low Temperature Bonding in 3D Heterogeneous Integration,” IMPACT-EMAP 2014, Taipei, Taiwan, Oct. 22-24, 2014.
Yao-Jen Chang, and Kuan-Neng Chen, “Development and Material Analyses of Novel Sub-10μm Cu/Sn Wafer Bonding Technology for 3D Integration,” The 40th International Conference on Micro and Nano Engineering (MNE 2014), Lausanne, Switzerland, Sep 22-26, 2014.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, and Kuan-Neng Chen, “Improvement of Motional Resistance through Concave TSV Design and Modification for Static Capacitance of TSV-Based Resonator,” 2014 International Conference on Solid State Devices and Materials (SSDM), Tsukuba, Japan, Sep 8-11, 2014.
Yao-Jen Chang, Yu-Sheng Hsieh, Cheng-Ta Ko, Wei-Chung Lo, Fan-Yi Ouyang, Chun-Shen Wu, Yung Mao Cheng, Wei Jen Chen, and Kuan-Neng Chen, “Joule Heating Induced Bonding Interface Improvement and Ti Breakthrough by Electron Bombardment for 40-μm Pitch of Cu TSV and Cu/Sn μ-Bump Pair”, 2014 International Conference on Solid State Devices and Materials (SSDM 2014), Tsukuba, Japan, Sep 8-11, 2014.
[Invited] Kuan-Neng Chen, “Material Design for Challenging Heterogeneous Applications of 3D IC and Low Temperature Wafer Bonding,” IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.
[Invited] Chien-Min Liu, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and K. N. Tu, “Low-Temperature and Low-Pressure Direct Copper-to-copper Bonding,” IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.
Yao-Jen Chang, Cheng-Han Fan, and Kuan-Neng Chen, “Mechanism of Novel Sub-Micron Cu/Sn Bond System with Ultra-Thin Ni Buffer Layer for 3D Integration,” IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.
Y. Shih, W. C. Huang, C. T. Ko, Z. Yang, S. X. Hu, J. P. Leu, K. C. Chou, and K. N. Chen, “Investigations of Interfacial Adhesion between Cu, Al, Co or Ti and Benzocyclobutene (BCB) Polymer Dielectric in 3D Integration,” IUMRS-ICEM 2014, Taipei, Taiwan, Jun 10-14, 2014.
Tang-Hsuan Wang, Po-Tsang Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, and Wei Hwang, “Energy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing Applications,” 2014 IEEE International Symposium on Circuits and Systems (ISCAS), Melbourne, Australia, June 1-5, 2014.
Lei-Chun Chou, Shih-Wei Lee, Po-Tsang Huang, Chih-Wei Chang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Kuan-Neng Chen, “Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio-Signal Recording Application,” 2014 IEEE Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, May 27 – May 30, 2014.
Shimin Sun, and Kuan-Neng Chen, “A Temporary Bonding/De-Bonding Solution to Realize High Compatibility and Cost Performance in 3D Integration,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE 2014), Taoyuan, Taiwan, May 7-10, 2014.
Tsung-Han Yu, Shih-Wei Lee, and Kuan-Neng Chen, “Development of Adhesive to Oxide Temporary Bonding for 3-D IC Applications,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Wan-Lin Tsai, Kuang-Yu Wang, Yao-Jen Chang, Yun-Shan Chien, Kuan-Neng Chen, Huang-Chung Cheng, “Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Chih Chen, Chien-Min Liu, Kuan-Neng Chen, King-Ning Tu, “Low-temperature and low-pressure direct copper-to-copper bonding,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Shu-Chiao Kuo, Shih-Wei Lee, Yao-Jen Chang, Yan-Pin Huang, Ting-Yang Yu, and Kuan-Neng Chen, “Electrical Stacking Error Measurement Structure in Three-Dimensional Integration,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, “Novel Quartz Resonator Device Using TSV, 3D Integration, and Si Hermetic Packaging Technologies,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Chuan-An Cheng, Cheng-Hsien Lu, Dian-Rong Lyu, Yu-Sheng Hsieh, and Kuan-Neng Chen, “Investigation of Low Temperature Polymer Wafer Bonding for Heterogeneous Integration in 3D Application,” IEEE The 3rd International Symposium on Next-Generation Electronics (ISNE), Taoyuan, Taiwan, May 7-10, 2014.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, and Kuan-Neng Chen, “A Novel Si-based X’tal Oscillator Device Using 3D Integration Technologies,” 2014 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 28-30, 2014.
Lei-Chun Chou, Shih-Wei Lee, Chuan-An Cheng, Po-Tsang Huang, Chih-Wei Chang, Cheng-Hao Chiang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Kuan-Neng Chen, “A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array,” 2014 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 28-30, 2014.
Shang-Lin Wu, Po-Tsang Huang, Teng-Chieh Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang and Wei Hwang, “Energy-Efficient Low-Noise 16-Channel Analog Front-End Circuit for Bio-potential Acquisition,” 2014 IEEE International Symposium on VLSI Design, Automation and Test (VLSI-DAT), Hsinchu, Taiwan, April 28-30, 2014.
[Invited] Kuan-Neng Chen, “Development of Key Technologies, Schemes, and Applications in 3D/2.5D Integration,” China Semiconductor Technology International Conference, Shanghai, China, Mar 16-17, 2014.
[Invited] Shu-Chiao Kuo, Yao-Jen Chang, Jian-Yu Shih, Cheng-Ta Ko, and Kuan-Neng Chen, “Development and Investigation of 3D Integration Schemes Using TSV, Bonding and Thinning Technologies,” International Electron Devices and Materials Symposium (IEDMS), Nantou, Taiwan, Nov 28-29, 2013.
Ming-Fang Lai, Cheng-Hsien Lu, and Kuan-Neng Chen, “An Overview of ESD Issue with TSV in 3D-IC Fabrication”, 2013 Taiwan ESD and Reliability Conference, Hsinchu, Taiwan, Nov 4-6, 2013.
Teng-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang and Wei Hwang, “Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing Applications,” 2013 IEEE Biomedical Circuits and Systems Conference (BiOCAS), Rotterdam, the Netherlands, Oct. 31 – Nov. 2, 2013, pp. 238-241.
P. Huang, Y. S. Chien, R. N. Tzeng, M. S. Shy, T. H. Lin, K. H. Chen, C. T. Chuang, W. Hwang, C. T. Chiu, H. M. Tong, and K. N. Chen, “Low Temperature (<180C) Bonding for 3D Integration”, IEEE 3D System Integration Conference, San Francisco, CA, USA, Oct. 2-4, 2013.
Yao-Jen Chang, Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, Tsung-Han Yu, Wei-Chung Lo, and Kuan-Neng Chen, “Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding,” 2013 International Conference on Solid State Devices and Materials (SSDM 2013), Fukuoku, Japan, Sep 24-27, 2013.
Ruoh-Ning Tzeng, Yen-Pin Huang, Yu-San Chien, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Kuan-Neng Chen, “Low Temperature Bonding of Sn/In-Cu Interconnects for Three-Dimensional Integration Applications,” 2013 IEEE International Interconnect Technology Conference (IITC), Kyoto, Japan, Jun 13-15, 2013.
Jian-Yu Shih, Yen-Chi Chen, Cheng-Hao Chiang, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, “TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies,” 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 – May 31, 2013.
J. Chang, C. T. Ko, Z. C. Hsiao, J. H. Huang, C. H. Chiang, H. C. Fu, T. H. Yu, F. C. Han, W. C. Lo, K. N. Chen, “Electrical Investigation and Reliability of 3D Integration Platform Using Cu TSVs and μ-bumps with Cu/Sn-BCB Hybrid Bonding,” 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 – May 31, 2013.
S. Chien, Y. P. Huang, R. N. Tzeng, M. S. Shy, T. H. Lin, K. H. Chen, C. T. Chuang, W. Hwang, C. T. Chiu, H. M. Tong, K. N. Chen, “Low Temperature (<180 C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D Integration,” 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 – May 31, 2013, pp. 1146-1152.
Ming-Hung Chang, Wei-Chih Hsieh, Pei-Chen Wu, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang, Chen-Chao Wang, Kuo-Hua Chen, Chi-Tsung Chiu, and Ho-Ming Tong, “Multi-Layer Adaptive Power Management Architecture for TSV 3-D IC Technology,” 2013 IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, May 28 – May 31, 2013, pp. 1179-1185.
Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Olesya Zakoretska, Ching-Te Chuang, Kuan-Neng Chen, Chen-Chao Wang, Kua-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Wei Hwang, “Near-/Sub-Vth Process, Voltage, and Temperature (PVT) Sensors with Dynamic Voltage Selection”, 2013 IEEE International Symposium on Circuits and Systems (ISCAS), Beijing China, May 19-23, 2013, pp. 133-136.
Hsiao-Yu Chen, Sheng-Yao Hsu, and Kuan-Neng Chen, “Co-sputtered Cu/Ti Bonded Interconnects for 3D Integration Applications,” The 20^th International Symposium on VLSI Technology, Systems and Applications (2013 VLSI-TSA), Hsinchu, Taiwan, Apr 22-24, 2013.
Shih-Wei Lee, Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, “Integration, Electrical Performance and Reliability Investigation of TSV”, IMAPS 9th International Conference and Exhibition on Device Packaging, Scottsdale, AZ, USA, Mar 12-14, 2013.
P. Huang, R. N. Tzeng, Y. S. Chien, M. S. Shy, H. S. Chang, T. H. Lin, K. H. Chen, C. T. Chiu, Y. E. Yeh, W. Hwang, C. T. Chuang, J. C. Chiou, H. M. Tong, K. N. Chen, “Low Temperature Cu-Sn and Sn-Sn Bonding Development for 3D Interconnect Applications”, International Electron Devices and Materials Symposium (IEDMS) 2012, Kaohsiung, Taiwan, Nov 29-30, 2012.
Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, “Study of TSV Formation with ICP Parameter Control”, Proceedings of the 34th International Symposium on Dry Process, Tokyo, Japan, Nov 15-16, 2012, pp. 127-128.
[Invited] Kuan-Neng Chen, “Fabrication and Evaluation of TSV and Bonded Structures for 3D Integration,” The 7^th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.
Cheng-Hao Chiang, Yu-Chen Hu, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, “Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration”, Proceedings of the 7^th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012, pp. 56-59.
Yu-Chen Hu, Cheng-Hao Chiang, Kuo-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, “Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations”, Proceedings of the 7^th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012, pp. 367-369.
Hsing-Han Ho, Cheng-Ta Ko, Yao-Jen Chang, Kuan-Neng Chen, “Investigation of Oxide Bonding from Different Species for 3D Integration and MEMS Applications”, The 7^th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.
[Invited] C. Lo, C. Ta Ko, and K. N. Chen, “3D Integration with Wafer-to-Wafer Bonding,” 2012 International Conference on Solid State Devices and Materials (SSDM 2012), Kyoto, Japan, Sep 25-27, 2012.
Chuan-An Cheng, Cheng-Hsien Lu, Chia-Hua Ho, and Kuan-Neng Chen, “Investigation of Electrical Performances for n-MOSFET Devices Integrating with Bonding and Thinning Technologies in 3D Integration,” 2012 International Conference on Solid State Devices and Materials (SSDM 2012), Kyoto, Japan, Sep 25-27, 2012.
[Invited] Kuan-Neng Chen, “Material Analyses and Morphology Investigations of Cu-Based Bonding Technology for 3D Integration,” IUMRS-ICEM 2012, Yokohama, Japan, Sep 23-28, 2012.
Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong and Wei Hwang, “On-Chip Self-Calibrated Process-Temperature Sensor For TSV 3D Integration” 2012 IEEE International SoC Conference (SOCC), Niagara Falls, NY, USA, Sept. 12 -14, 2012, pp. 370-375.
Po-Tsang Huang, Tzu-Ting Chiang, Herming Chiueh, Ching-Te Chuang, Jin-Chern Chiou, Kuan-Neng Chen, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Wei Hwang, “Thermal Management with In-Situ Process-Temperature Sensor for TSV 3D-ICs”, The 23^rd VLSI Design/CAD Symposium, Kenting, Taiwan, Aug 7-10, 2012.
[Invited] Kuan-Neng Chen, “Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects,” 2012 IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA, Jun 03-06, 2012.
T. Ko, Z. C. Hsiao, Y. J. Chang, P. S. Chen, J. H. Huang, H. C. Fu, Y. J. Huang, C. W. Chiang, C. K. Lee, H. H. Chang, W. L. Tsai, S. H. Wu, S. S. Sheu, Y. H. Chen, W. C. Lo, and K. N. Chen, “Structural Design, Process, and Reliability of a Wafer-Level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Wafer Bonding,” Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, May 29 – Jun 1, 2012.
J. Chang, C. T. Ko, Z. C. Hsiao, T. H. Yu, Y. H. Chen, W. C. Lo, and K. N. Chen, “Electrical Characterization and Reliability Investigations of Cu TSVs with Wafer-Level Cu/Sn-BCB Hybrid Bonding,” The 19^th International Symposium on VLSI Technology, Systems and Applications (2012 VLSI-TSA), Hsinchu, Taiwan, Apr. 23-25, 2012.
[Invited] Kuan-Neng Chen, “Key Technologies of 3D Integration: Schemes, Achievements, and Outlook”, China Semiconductor Technology International Conference 2012, Shanghai, China, Mar 18-19, 2012.
K. N. Chen, Z. Xu, F. Liu, C. T. Ko, C. A. Cheng, W. C. Huang, H. L. Lin, C. Cabral, Z. C. Hsiao, N. Klymko, H. C. Fu, Y. H. Chen, J. Q. Lu, and W. C. Lo “Cu-Based Bonding Technology for 3D Integration Applications”, IEEE 3D System Integration Conference, Osaka, Japan, Jan 31 – Feb 2, 2012.
T. Ko, Z. C. Hsiao, Y. J. Chang, P. S. Chen, J. H. Huang, H. C. Fu, Y. J. Huang, C. W. Chiang, W. L. Tsai, Y. H. Chen, W. C. Lo, and K. N. Chen, “Wafer-Level 3D Integration with Cu TSV and Micro-bump/Adhesive Hybrid Bonding Technologies”, IEEE 3D System Integration Conference, Osaka, Japan, Jan 31 – Feb 2, 2012.
[Invited] Kuan-Neng Chen, “Three-Dimensional Integrated Circuits (3D IC): Schemes, Technologies, and Recent Research Achievements”, International Electron Devices and Materials Symposium (IEDMS) 2011, Taipei, Taiwan, Nov 17-18, 2011.
Yen-Pin Huang, Chuan-An Cheng, Cho-Lun Hsu, Chia-Hua Ho, and Kuan-Neng Chen, “Achievement of Dense Through Silicon Via (TSV) for 3D Integration by Micro-Masking Free Process”, International Electron Devices and Materials Symposium (IEDMS) 2011, Taipei, Taiwan, Nov 17-18, 2011.
[Invited] Kuan-Neng Chen, “Schemes, Achievements, and Challenges of Key Technologies in Three-Dimensional Integrated Circuits (3D IC)”, The 13^th Photonics and Semiconductor Device Reliability Workshop, Hsinchu, Taiwan, Nov 4, 2011.
C. Huang, C. T. Ko, S. H. Hu, J. P. Leu, and K. N. Chen, “Investigations of Adhesion between Cu and Benzocyclobutene (BCB) Polymer Dielectric for 3D Integration Applications”, International Microsystems, Packaging, Assembly, and Circuit Technology Conference (IMPACT 2011), Taipei, Taiwan, Oct. 18-21, 2011.
[Invited] Kuan-Neng Chen, “Wafer-Level Hybrid Bonding for 3D Integration”, IUMRS-ICA 2011, Taipei, Taiwan, Sep 19-22, 2011.
[Invited] Kuan-Neng Chen and Chuan Seng Tan, “3-D Integration: Materials, Technologies, Schemes, and Applications”, 2011 IEEE Custom Integrated Circuits Conference (CICC), San Jose, CA, Sep 18-21, 2011.
Y. Hsu, J. Y. Shih, and K. N. Chen, “Diffusion Behavior and Mechanism of Co-Sputtering Metals as Bonding Materials for 3D IC Interconnects during Annealing Treatment”, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.
L. Lin, W. C. Huang, and K. N. Chen, “Studies of Oxide to Polymer Bonding for 3D IC”, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.
A. Cheng, C. T. Ko, and K. N. Chen, “Investigation of bonding temperature for SU-8 materials in wafer-level hybrid bonding technology for 3D IC”, 2011 IEEE International Nano Electronic Conference (INEC), Tao-Yuan, Taiwan, Jun 21-24, 2011.
[Invited] Kuan-Neng Chen, “Three-Dimensional Integrated Circuits (3D IC): Concept, Technology, and Outlook”, 18^TH Symposium on Nano Device Technology (SNDT), Hsinchu, Taiwan, Apr. 21-22, 2011.
K. N. Chen, C. A. Cheng, W. C. Huang, and C. T. Ko, “Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration”, 2011 TMS Meeting, San Diego, CA, Feb 27-Mar. 3, 2011.
[Invited] Kuan-Neng Chen, “Taiwan Research and Development Activities for 3D Integrated Circuits”, 2010 International Conference of 3-D Architectures for Semiconductor Integration and Packaging, San Francisco CA, Dec. 8-10, 2010.
Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, and Yu-Hua Chen, “Wafer-Level 3D Integration Using Hybrid Bonding”, IEEE 3D IC International Conference, Munich, Germany, Nov. 16-18, 2010.
Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kuan-neng Chen, Kenneth Rose, and Jian-Qiang Lu, “Crosstalk Evaluation, Suppression and Modeling in 3D Through-Strata-Via (TSV) Network”, IEEE 3D IC International Conference, Munich, Germany, Nov. 16-18, 2010.
Ming-Fang Lai, Shu-Chuan Chen, Yen-Hsien Chen, Yu-Ti Su, Che-Hung Chen, Po-An Chen, Hung-Ming Chen and Kuan-Neng Chen, “Area Efficient I/O Circuit in High Pin Count IC”, 2010 Taiwan ESD and Reliability Conference, Hsinchu, Taiwan, Oct. 25-27, 2010.
Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, Kuan-Neng Chen, Wei-Chung Lo, and Yu-Hua Chen, “Wafer-to-Wafer Hybrid Bonding Technology for 3D IC”, Electronics System Integration Technology Conferences (ESTC 2010), Berlin, Germany, Sep. 13-16, 2010.
Kuan-Neng Chen, Ming-Fang Lai, and Hung-Ming Chen, “Wafer-Level Three-Dimensional Integrated Circuits (3D IC): Schemes and Key Technologies”, IUMRS-ICEM, Seoul, Korea, Aug. 22-27, 2010.
K. N. Chen, C. Cabral, Jr., S. H. Lee, P. S. Andry, and J. Q. Lu, “Investigations of Cu Bond Structures and Demonstration of a Wafer-Level 3D Integration Scheme with W TSVs”, The 17^th International Symposium on VLSI Technology, Systems and Applications (2010 VLSI-TSA), Hsinchu, Taiwan, Apr. 26-28, 2010.
K. N. Chen, Y. Zhu, W.W. Wu, and R. Reif, “Investigation and Effects of Wafer Bow in Different 3D Stacking Schemes”, 2010 TMS, Seattle, WA, Feb 14-18, 2010.
Cheng-Ta Ko, Wei-Chung Lo, Kuan-Neng Chen, Huan-Chun Fu, Zhi-Cheng, Hsiao, and Yu-Hua Chen “Polymers Investigation for 3D IC Stacking Technology”, 2010 TMS Meeting, Seattle, WA, Feb 14-18, 2010.
K. N. Chen, Y. Zhu, W. W. Wu, C. K. Tsang, S. H. Lee, and J. Q. Lu, “Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications”, IEEE International NanoElectronics Conference (INEC) 2010, Hong Kong, Jan 3-8, 2010.
W. Wu, K. C. Lu, K. N. Chen, and C. W. Wang, “Controlled large strain of Si in the NiSi/Si/NiSi nanowire heterostructure”, IEEE International NanoElectronics Conference (INEC) 2010, Hong Kong, Jan 3-8, 2010.
K. N. Chen, Y. Zhu, W.W. Wu, and R. Reif, “Copper Thin Film Research and Development for Wafer Bonding”, TACT 2009 International Thin Films Conference, Taipei, Taiwan, Dec 14-16, 2009.
W. Wu, K.N. Chen, and C. W. Wang, “Enhanced growth of low-resistivity titanium silicides on epitaxial Si_0.7Ge_0.3on (001)Si with a sacrificial amorphous Si interlayer”, TACT 2009 International Thin Films Conference, Taipei, Taiwan, Dec 14-16, 2009.
[Invited] Kuan-Neng Chen, “Wafer-Level Alignment Technology for 3D Integration”, The 4^th IMPACT 2009 Conference and International 3D IC Conference, Taipei, Taiwan, Oct. 21-23, 2009.
[Invited] Chuan Seng Tan and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding and Hybrid Cu/Dielectric Bonding: An Enabling Technology for 3-D ICs Application”, The 4^th IMPACT 2009 Conference and International 3D IC Conference, Taipei, Taiwan, Oct. 21-23, 2009.
[Invited] Kuan-Neng Chen, “Wafer-Level Copper Bonding Technology in 3D ICs”, 21^6th ECS Meeting, Vienna, Austria, Oct. 4-9, 2009.
K. N. Chen and L. Krusin-Elbaum, “CMOS-Technology Compatible Programmable Via using Phase-Change Materials”, 2009 Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Hamilton, Ontario, Canada, Aug 10-14, 2009.
K. N. Chen, E.A. Joseph, J.C. Arnold, and N. Ruiz, “Fabrication of robust self-aligned nano-scale tubular structures and templates for device applications”, 2009 Nano and Giga Challenges in Electronics, Photonics and Renewable Energy, Hamilton, Ontario, Canada, Aug 10-14, 2009.
K. N. Chen, C. Cabral Jr., L. Krusin-Elbaum, “Segregation of Te and Irreversible Modification in Ge₂Sb₂Te₅ Phase Change Material”, E-MRS 2008 Spring Meeting, Strasburg, France, May 26-30, 2008.
Sang Hwui Lee, Kuan-Neng Chen, Douglas C. La Tulipe, Albert M. Young, and Jian-Qiang Lu, “Thermal Process Induced Wafer-to-Wafer Misalignment for 3D Interconnects”, 2008 International Conference and Exhibition on Device Packaging, Scottsdale AZ, March 17-20, 2008.
Albert M. Young, Douglas C. La Tulipe, Leathen Shi, Kuan-Neng Chen, Roy R. Yu, and Steven J. Koester, “Critical process technologies in 3D integration”, Government Microcircuit Applications & Critical Technology Conference, Las Vegas NV, March 17-20, 2008.
[Invited] Kuan-Neng Chen, “Science, Materials, and Process Technology of Cu Bonding for 3D Integration”, 2007 International Conference and Exhibition on Device Packaging, Scottsdale AZ, March 19-22, 2007.
Cabral Jr., L. Krusin-Elbaum, K.N. Chen, M. Copel, J. Bruley, V.R. Deline, “Evidence for segregation of Te in “phase-change” thin chalcogenide Ge-Sb-Te films”, APS March Meeting 2007, Denver CO, March 5-9, 2007.
[Invited] S. Tan, K. N. Chen, A. Fan, A. Chandrakasan, and R. Reif, “Silicon Layer Stacking Enabled by Wafer Bonding,” Materials Research Society Symposium Proceedings 970, pp. 193-204, Boston, MA, Nov 27 – Dec 1, 2006
[Invited] K. N. Chen, C.K. Tsang, A.W. Topol, S.H. Lee, B.K. Furman, D.L. Rath, J.-Q. Lu, A.M. Young, S. Purushothaman, and W. Haensch, “Improved Manufacturability of Cu Bond Pads and Implementation of Seal Design in 3D Integrated Circuits and Packages”, 23^rd International VLSI Multilevel Interconnection (VMIC) Conference, Fremont CA, Sep.25-28, 2006.
Kuan-Neng Chen, Muhannad Bakir, James Meindl, and Rafael Reif, “Copper Interconnect Bonding for Polymer Pillar I/O Interconnects and Three-Dimensional (3D) Integration Application”, 2006 Electronic Materials Conference, University PA, June 28-30, 2006.
K. N. Chen, and R. Reif, “Wafer Bow and Copper Wafer Bonding”, APS March Meeting 2006, Baltimore MD, March 13-17, 2006.
[Invited] Kuan-Neng Chen, “Copper Wafer Bonding for 3D Integration,” IBM 3D Silicon Workshop on Silicon, Through Vias, Packaging and Module Assemblies, Yorktown Heights NY, March 7, 2006.
K. N. Chen, L Krusin-Elbaum, C. Cabral, C. Lavoie, J. Sun, S. Rossnagel, “Thermal stress evaluation of a PCRAM material Ge₂Sb₂Te₅”, 21st IEEE NVSMW (Non-Volatile Semiconductor Memory Workshop), pp. 97-98, Monterey CA, February 12-16, 2006.
S. Tan, K. N. Chen, A. Fan, and R. Reif, “A Back-to-Face Silicon Layer Stacking for Three-Dimensional Integration”, Proceedings of 2005 IEEE International SOI Conference, pp. 87-89, Honolulu Hi, October 3-6, 2005.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Copper Wafer Bonding: Interface Analysis and Characterization”, Microscopy and Microanalysis 2005, Honolulu Hi, July 31 –Aug. 4, 2005.
[Invited] Gutmann, J. Lu, J. Yu, K. N. Chen, and R. Reif, “Copper Metallization Needs for Wafer-Level, Three-Dimensional Integration”, 207th ECS meeting, Quebec City, Canada, May 15-20, 2005.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Effects of surface roughness and oxide formation of Cu film on the quality of Cu wafer bonding”, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.
[Invited]K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Bonding parameters of Cu wafer bonding for 3D Integration”, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.
K. N. Chen, S. M. Chang, L. C. Shen and R. Reif, “Using different test techniques to investigate the bond strength of Cu wafer bonding”, 2005 TMS meeting, San Francisco CA, February 13-17, 2005.
S. Tan, A. Fan, K. N. Chen, and R. Reif, “Multilayered Three-Dimensional Integration Enabled by Wafer Bonding,” SRC/ISMT 7^th Annual Topical Research Conference on Reliability, University of Texas, Austin, TX, October 25-27, pp. 27, 2004.
[Invited] Reif, C. S. Tan, A. Fan, K. N. Chen, S. Das, and N. Checka, “Technology and Applications of Three-Dimensional Integration,” 206^th Electrochemical Society Fall Meeting, Honolulu, Hawaii, October 3-8, 2004. In Dielectrics for Nanosystems: Materials, Science, Processing, Reliability, and Manufacturing, R. Singh, H. Iwai, R. R. Tummala, and S. C. Sun, Editors, PV 2004-04, The Electrochemical Society Proceedings Series, Pennington, NJ, 2004.
[Invited] Reif, S. Das, A. Fan, K.-N. Chen, C. S. Tan, and N. Checka, “Technology, Performance, and Computer-Aided Design of Three-Dimensional Integrated Circuits,” International Symposium on Physical Design (ISPD 2004), Phoenix, Arizona, April 18-21, 2004.
[Invited] Reif, C.S. Tan, A. Fan, K. N. Chen, S. Das, and N. Checka, “Technology and Applications of Three-Dimensional Integration,” Pre-conference Symposium, RTI/ISMT 3D Architectures for Semiconductor Integration and Packaging Conference, April 13-15, 2004, Burlingame, CA.
[Invited] Reif, C. S. Tan, A. Fan, and K. N. Chen, “Three-dimensional Integration Enabled by Wafer Bonding and Layer Transfer,” Applied Materials Inc Workshop, Santa Clara, CA, January 16, 2004.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Abnormal Contact Resistance Reduction in Bonded Cu Interconnects Using Pre-Bonding HCl Cleaning”, MRS Fall Meeting, Boston MA, December 2003.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Relation of Contact Resistance Reduction and Process Parameters of Bonded Copper Interconnects in Three-Dimensional Integration Technology”, Proceedings of 2003 ECS meeting, Orlando FL, October 2003.
K. N. Chen, Andy Fan, Chuan Seng Tan, and Rafael Reif, “Evolution of Microstructure During Copper Wafer Bonding”, 2003 TMS meeting, San Diego CA, March 2003.
[Invited] Reif, C. S. Tan, A. Fan, K. N. Chen, S. Das, and N. Checka, “3-D Interconnects Using Cu Wafer Bonding : Technology and Applications,” Adcanced Metallization Conference (AMC), October 1-3, 2002, San Diego, CA. In Melnick et al, Advanced Metallization Conference 2002, Materials Research Society, pp 37-45, Spring 2003.
[Invited] Reif, C. S. Tan, A. Fan, K. N. Chen, S. Das, and N. Checka, “3-D Integration using Cu-Cu Wafer Bonding,” DARPA 3-D Microelectronics Integration Workshop, San Diego, CA, July 10, 2002.
Fan, S. Das, K. N. Chen, and R. Reif, “Fabrication Technologies for Three-Dimensional Integrated Circuits,” IEEE International Symposium on Quality Electronic Design, pp. 33-37, 2002.
[Invited] Fan, K. N. Chen, and R. Reif, “Three-Dimensional Integration with Copper Wafer Bonding”, Electrochemical Society Spring Meeting, ULSI Process Integration Symposium, pp. 124-132, Proceedings Volume 2001-2, Washington D.C., March 25-29, 2001.
Woei Wu Pai, Y. H. Peng, W. F. Chung, S. Y. Wang, K. N. Chen, and H. H. Cheng, “Unusual Surface Undulations Observed in Low Temperature Ge/Si(100) Epitaxy”, MRS fall meeting proceedings, Session P10.7, Boston MA, December 2000.
H. Lin, K. N. Chen, S. L. Cheng, Y.C. Peng, G.H. Shen, L.J. Chen, and C.R. Chen, “Interfacial Reaction of Metal Thin Films on Ion Implanted Silicon Under High Current Density”, IUMRS-ICEM-98, Korea.
[Invited] J. Chen, K. N. Chen, H. H. Lin; S. L. Cheng, Y. C. Peng, G. H. Shen, C.R. Chen, “Silicide Formation in Implanted Channels and Polarity Effects of Ni and Co Contacts Under High Current Density”, IEEE International Conference on Ion Implantation Technology, Kyoto, Japan, pp. 837-840, June 1998.

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