– Publications –

Journal

ISSCC/IEDM/VLSI

Journal

140

Conference

237

Patent

Books

Shie-Ping Chang, Zih-I Chuang, Yun-Jung Wu, E-Ming Ho, Yuan-Chiu Huang, and Kuan-Neng Chen, “Low-temperature Photo Imageable Dielectric for Redistribution Layers in Advanced Packaging Application”, To be published in Materials Science in Semiconductor Processing.
Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, HuangChung Cheng, Chang-Hong Shen, Wen-Fa Wu, Tuo-Hung Hou, Kuan-Neng Chen, and Chenming Hu, “Elevated-Epi Technique for 3D IC with Stacked FinFETs, Inter-Level Metal, and 25x33mm² Single-Crystalline Silicon on SiO₂,” To be published in IEEE Transactions on Electron Devices.
[Invited Paper] Yu-Lun Liu, Chien-Kang Hsiung, Tzu-Han Sun, Chun-Ta Li, Yuan-Chiu Huang, Yu-Tao Yang, and Kuan-Neng Chen, “The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics,” IEEE Transactions on Materials for Electron Devices,1(1), pp. 15-22, Dec. 2024. DOI: 10.1109/TMAT.2024.3417888
Mu-Ping Hsu, Chih-Han Chen, Zhong-Jie Hong, Tai-Yu Lin, Ying-Chan Hung, and Kuan-Neng Chen, “Enhancement of Low Temperature Cu-to-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere,” IEEE Electron Devices Letters, 45(8), pp. 1500-1503, Aug. 2024. DOI: 10.1109/LED.2024.3416180
Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Huang-Chung Cheng, Chang-Hong Shen, Jia-Min Shieh, Wen-Fa Wu, Kuan-Neng Chen, and Chenming Hu, “Advancements in Single-Crystal Silicon with Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) for Monolithic 3D ICs”, Japanese Journal of Applied Physics, 63(4), 04SP30, Apr. 2024. DOI: 10.35848/1347-4065/ad2fdc
Mu-Ping Hsu, Wen-Tsu Tsai, Chi-Yu Chen, Tzu-Ying Kuo, Ou-Hsiang Lee, Hsiang-Hung Chang, and Kuan-Neng Chen, “Low-Temperature Area-Selective Metal Passivation Bonding Platform for Heterogeneous Integration,” IEEE Electron Devices Letters, 45(7), pp. 1273-1276, Jul. 2024. DOI: 10.1109/LED.2024.301222
[Invited Paper] Chien-Kang Hsiung, and Kuan-Neng Chen, “A Review on Hybrid Bonding Interconnection and Its Characterization”, IEEE Nanotechnology Magazine, 18(2), pp.41-50, Apr. 2024. DOI: 10.1109/MNANO.2024.3358714
Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Yu-Tao Yang, Tzu-Heng Hung, and Kuan-Neng Chen, “A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications”, IEEE Electron Devices Letters, 45(3), pp.452-455, Mar. 2024. DOI:10.1109/LED.2024.3352252
Yuan-Chiu Huang, Han-Wen Hu, Yun-Hsi Liu, Hui-Ching Hsieh, and Kuan-Neng Chen, “Investigation of Photosensitive Polyimide with Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications”, IEEE Journal of the Electron Devices Society, 12, pp. 96-103, Jan. 2024. DOI: 10.1109/JEDS.2024.3358830
Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, Zhong-Jie Hong, Ming-Wei Weng, and Kuan-Neng Chen, “Development of Low-Temperature Bonding Platform Using Ultra-Thin Area Selective Deposition for Heterogeneous Integration”, Applied Surface Science, 635, 157645, Oct. 2023.
[Invited Paper] Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, and Kuan-Neng Chen, “Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application,” Nanomaterials, 13(17), 2490, Sep. 2023. DOI: 10.3390/nano13172490
Tzu-Heng Hung, Ping-Jung Liu, Chiao-Yen Wang, Tsai-Fu Chung, and Kuan-Neng Chen, “A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-deposited Cu3N”, IEEE Journal of the Electron Devices Society, 11, pp.473-479, Sep. 2023. DOI:10.1109/JEDS.2023.3308368
Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, and Kuan-Neng Chen, “Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu/Polymer Hybrid Bonding”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(8), pp.1316-1323, Aug. 2023. DOI:10.1109/TCPMT.2022.3301005
Tzu-Heng Hung, James Yi-Jen Lo, Tzu-Ying Kuo, Shing-Yih Shih, Sheng-Fu Huang, Yen-Ling Lin, Hsih-Yang Chiu, Wei-Zhong Li, Han-Wen Hu, Hsiang-Hung Chang, Chiang-Lin Shih, Jeff J.P. Lin, and Kuan-Neng Chen, “TSV Integration with Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking”, IEEE Electron Devices Letters, 44(7), pp. 1176-1179, Jul. 2023. DOI: 10.1109/LED.2023.3279828
Hao-Tung Chung, Yu-Ming Pan, Nein-Chih Lin, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, Po-Tsang Huang, Huang-Chung Cheng, Kuan-Neng Chen, and Chenming Hu, “Single-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) Technique for Monolithic 3D ICs”, IEEE Electron Devices Letters, 44(7), pp. 1036-1039, Jul. 2023. DOI:10.1109/LED.2023.3275181
Tzu-Heng Hung, Yu-Ming Pan, and Kuan-Neng Chen, “Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications”, Memories – Materials, Devices, Circuits and Systems, 4, 100024, Jul. 2023.
Hao-Tung Chung, Yu-Ming Pan, Nein-Chih Lin, Bo-Jheng Shih, Chih-Chao Yang, Chang-Hong Shen, Huang-Chung Cheng, and Kuan-Neng Chen, “High-Performance P-Type Germanium Tri-Gate FETs via Green Nanosecond Laser Crystallization and Counter Doping for Monolithic 3-DICs”, IEEE Journal of the Electron Devices Society, 11, pp. 262-268, Apr. 2023. DOI:10.1109/JEDS.2023.3270634
Zhong-Jie Hong, Ming-Wei Weng, Chih-Han Chen, Mu-Ping Hsu, Han-Wen Hu, Tai-Yu Lin, Ying-Chan Hung, and Kuan-Neng Chen, “Scheme for Multi-Chiplet Integration with Low Thermal Budget by Asymmetric Cu-Cu Bonding with Au Passivation Bonding Structure”, IEEE Electron Devices Letters, 44(3), pp. 492-495, Mar. 2023. DOI: 10.1109/LED.2023.32390112
Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Chien-Kang Hsiung, Chih-I Cho, Chih-Han Chen, Ming-Wei Weng, Jui-Han Liu, Mu-Ping Hsu, Ying-Chan Hung, and Kuan-Neng Chen, “Lowtemperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration”, Applied Surface Science, 610, 155470, Feb. 2023.
Yu-Ting Huang, Yi-Chieh Tsai, Yi-Cheng Huang, Han-Wen Hu, and Kuan-Neng Chen, “Ultra-Thin Glass-based Wafer-level Integration for Miniaturized Hermetic MEMS Application”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 13(1), pp. 120-126, Jan.2023.
Han-Wen Hu, Yu-Wei Huang, Yi-Chieh Tsai, Meng-Kai Shih and Kuan-Neng Chen, “Hybrid Soldering 2.3D Assembly With High Reliability and Low Cost,” in IEEE Journal of the Electron Devices Society, Sep 2022.
Zhong-Jie Hong, Demin Liu, Han-Wen Hu, Chih-I Cho, Ming-Wei Weng, Jui-Han Liu, and Kuan-Neng Chen, “Investigation of Bonding Mechanism for Low-Temperature Cu-Cu Bonding with Passivation Layer”, Applied Surface Science, 592, 153243, Aug. 2022.
Chia-Hsin Lee, Baron Huang, Jennifer See, Luke Prenger, Yu-Min Lin, Wei-Lan Chiu, Ou-Hsiang Lee, and Kuan-Neng Chen, “Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-first and Die-first Fan-Out Wafer-Level Packaging (FOWLP)”, To be published in IEEE Transactions on Components, Packaging and Manufacturing Technology.
Leh-Ping Chang, Jian-Jie Wang, Tzu-Heng Hung, Kuan-Neng Chen, and Fan-Yi Ouyang, “Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration”, Applied Surface Science, 576, 151845, Feb 2022.
[Invited Paper] Han-Wen Hu, and Kaun-Neng Chen, “Development of low temperature Cu-Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)”, Microelectronics Reliability, 127, 114412, Nov. 2021.
Yi-Chieh Tsai, Yi-Cheng Huang, Yu-Ting Huang, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of Metal Interconnect for Wafer-level and Sealable Miniaturized MEMS Encapsulation”, IEEE Transactions on Electron Devices, 68(11), pp. 5779-5783, Nov. 2021. DOI: 10.1109/TED.2021.3113628
Demin Liu, Po-Chih Chen, Tzu-Chieh Chou, Han-Wen Hu, and Kuan-Neng Chen, “Demonstration of Low-Temperature Fine-Pitch Cu/SiO₂ Hybrid Bonding by Au Passivation”, IEEE Journal of Electron Devices Society, 9, pp. 868-875, Oct. 2021. DOI:10.1109/JEDS.2021.3114648
Demin Liu, Po-Chih Chen, Yu-Wei Liu, Han-Wen Hu, and Kuan-Neng Chen, “Low-Temperature (70°C) Cu-to-Cu Direct Bonding by Capping Metal Layers”, IEEE Electron Devices Letters, 42(10), pp. 1524-1527, Oct. 2021. DOI: 10.1109/LED.2021.3105434
Yu-Wei Liu, Han-Wen Hu, Ping-Yi Hsieh, Hao-Tung Chung, Shu-Jui Chang, Jui-Han Liu, Po-Tsang Huang, Chih-Chao Yang, Chang-Hong Shen, Jia-Min Shieh, Kuan-Neng Chen, and Chenming Hu, “Single-crystal islands (SCI) for monolithic 3D and back-end-of-line FinFET circuits”, IEEE Transactions on Electron Devices, 68(10), pp. 5257-5262, Oct. 2021.
Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Hao-Tung Chung, Wei-Shuo Li, Chun-Yu Liao, Pin-Guang Chen, Kuan-Neng Chen, Min-Hung Lee, and Huang-Chung Cheng, “Atomic Layer Deposition Plasma-Based Undoped-HfO₂ Ferroelectric FETs for Non-Volatile Memory”, IEEE Electron Devices Letters, 42(8), pp. 1152-1155, Aug. 2021.
Yi-Chieh Tsai, Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Han-Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and Kuan-Neng Chen, “Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through Silicon Via”, IEEE Transactions on Electron Devices, 68(7), pp. 3520-3525, Jul. 2021. DOI: 10.1109/TED.2021.3082497
Demin Liu, Tsung-Yi Kuo, Yu-Wei Liu, Zhong-Jie Hong, Ying-Ting Chung, Tzu-Chieh Chou, Han-Wen Hu, and Kuan-Neng Chen, “Investigation of Low Temperature Cu-Cu Direct Bonding with Pt Passivation layer in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(4), pp. 573-578, Apr. 2021.
Jun-Dao Luo, Yu-Ying Lai, Kuo-Yu Hsiang, Chia-Feng Wu, Yun-Tien Yeh, Hao-Tung Chung, Yi-Shao Li, Kai-Chi Chuang, Wei-Shuo Li, Chun-Yu Liao, Pin-Guang Chen, Kuan-Neng Chen, and Huang-Chung Cheng, “Ferroelectric Undoped HfOx Capacitor with Symmetric Synaptic for Neural Network Accelerator”, IEEE Transactions on Electron Devices, 68(3), pp. 1374-1377, Mar. 2021.
Hao-Tung Chung, Chun-Ting Chen, Yi-Shao Li, Yu-Wei Liu, Chan-Yu Liao, Wen-Hsien Huang, Jia-Min Shieh, Jun-Dao Luo, Wei-Shuo Li, Kai-Chi Chuang, Kuan-Neng Chen, and Huang-Chung Cheng, “Effect of Crystallinity on the Electrical Characteristics of Poly-Si Tunneling FETs via Green Nanosecond Laser Crystallization”, IEEE Electron Devices Letters, 42(2), pp. 164-167, Feb. 2021.
Tzu-Chieh Chou, Shin-Yi Huang, Pin-Jun Chen, Han-Wen Hu, Demin Liu, Chih-Wei Chang, Tzu-Hsuan Ni, Chao-Jung Chen, Yu-Min Lin, Tao-Chih Chang, and Kuan-Neng Chen, “Electrical and Reliability Investigation of Cu-to-Cu Bonding with Silver Passivation Layer in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(1), pp. 36-42, Jan. 2021.
Tzu-Chieh Chou, Kai-Ming Yang, Jian-Chen Li, Ting-Yang Yu, Yu-Tao Yang, Han-Wen Hu, Yu-Wei Liu, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Investigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D/2.5D Heterogeneous Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(8), pp. 1296-1303, Aug. 2020.
Yi-Chieh Tsai, Han-Wen Hu, and Kuan-Neng Chen, “Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar with Passivation”, IEEE Electron Devices Letters, 41(8), pp. 1229-1232, Aug. 2020. DOI: 10.1109/LED.2020.3001163
Yi-Lun Yang, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, and Kuan-Neng Chen, “Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(6), pp. 956-962, Jun. 2020.
Cheng-Hsien Lu, Yi-Lun Yang, Chiao-Pei Chen, Bin-Ling Tsai, and Kuan-Neng Chen, “Adhesion Properties of Electroplating Process Between Polyimide and Metal Layer for Polymer/Metal Hybrid Bonding”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10(1), pp. 168-175, Jan. 2020.
Cheng-Hsien Lu, Shu-Yan Jhu, Chiao-Pei Chen, Bin-Ling Tsai, and Kuan-Neng Chen, “Asymmetric Wafer-Level Polyimide and Cu/Sn Hybrid Bonding for 3-D Heterogeneous Integration,” IEEE Transactions on Electron Devices, 66(7), pp. 3073-3079, Jul. 2019. DOI: 10.1109/TED.2019.2915332
Cheng-Hsien Lu, Yi-Tung Kho, Chiao-Pei Chen, Bin-Ling Tsai, and Kuan-Neng Chen, “Adhesion and Material Properties between Polyimide and Passivation Layers for Polymer/Metal Hybrid Bonding in 3D Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(3), pp. 412-418, Mar. 2019.
Wen-Wei Shen, Yu-Min Lin, Sheng-Tsai Wu, Chia-Hsin Lee, Shin-Yi Huang, Hsiang-Hung Chang, Tao-Chih Chang, and Kuan-Neng Chen, “Warpage Characteristics and Process Development of TSV-less Interconnection Technology”, Journal of Nanoscience and Nanotechnology, 18(8), pp. 5558-5565, Aug. 2018.
Ting-Yang Yu, Hao-Wen Liang, Yao-Jen Chang, and Kuan-Neng Chen, “Asymmetric Low Temperature Bonding Structure with Thin Solder Layers Using Ultra-thin Buffer Layer”, Journal of Nanoscience and Nanotechnology, 18(8), pp. 5397-5403, Aug. 2018.
Ya-Sheng Tang, Hsiu-Chi Chen, Yi-Tung Kho, Yu-Sheng Hsieh, Yao-Jen Chang, and Kuan-Neng Chen, “Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(7), pp. 1225-1230, Jul. 2018.
Wen-Wei Shen, Yu-Min Lin, Shang-Chun Chen, Hsiang-Hung Chang, Tao-Chih Chang, Wei-Chung Lo, Chien-Chung Lin, Yung-Fa Chou, Ding-Ming Kwai, Ming-Jer Kao, and Kuan-Neng Chen, “3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)”, IEEE Journal of the Electron Devices Society, 6, pp. 396-402, Mar. 2018.
[Invited Paper] Asisa Kumar Panigrahy and Kuan-Neng Chen, “Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review”, Journal of Electronic Packaging, 140(1), pp. 010801-1-010801-11, Mar. 2018.
Yen-Hui Hsieh, Yen-Jun Huang, Jian-Yu Shih, Jih-Perng Leu, and Kuan-Neng Chen, “Exploring the correspondence between chemical states and adhesion property for Cr, Co metal /AZ 4620, BCB polymer interface”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(2), pp. 195-201, Feb. 2018.
Wen-Wei Shen, Hsiao-Chun Chang, Yu-Tao Yang, Yu-Chen Hu, and Kuan-Neng Chen, “Uneven-Topography-Chip Packing Approach Using Double Self-Assembly Technology for 3-D Heterogeneous Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(2), pp. 310-316, Feb. 2018.
Shih-Wei Lee, Shu-Chiao Kuo, and Kuan-Neng Chen, “A Novel Method of Electrical Measurement for Stacking Error in 3D/2.5D Integration”, Journal of Nanoscience and Nanotechnology, 18(2), pp. 1066-1069, Feb. 2018.
Ting-Yang Yu, Nai-Chen Chi, Hsin-Cheng Tsai, Shiang-Yu Wang, Chih-Wei Luo, and Kuan-Neng Chen, “Robust Terahertz Polarizers with High Transmittance at Selected Frequencies through Si Wafer Bonding Technologies”, Optics Letters, 42(23), pp. 4917-4920, Dec. 2017.
[Invited Paper] Wen-Wei Shen, and Kuan-Neng Chen, “Three-Dimensional Integrated Circuits (3D IC) Key Technology: Through-Silicon-Via (TSV),” Nanoscale Research Letters, 12, pp. 56-64, Dec. 2017.
Yan-Pin Huang, Shu-Lin Lu, Yu-Shiang Huang, Yi-Hsiu Tseng, Min-Fong Shu, and Kuan-Neng Chen, “Investigation of Cu/In Thermosonic Bonding”, Journal of Nanoscience and Nanotechnology, 17(12), pp. 8890-8893, Dec. 2017.
Ya-Sheng Tang, Jaber Derakhshandeh, Yi-Tung Kho, Yao-Jen Chang, John Slabbekoorn, Inge De Preter, Kris Vanstreels, Kenneth June Rebibis, Eric Beyne, and Kuan-Neng Chen, “Investigation of Co Thin-Film as Buffer Layer Applied to Cu/Sn Eutectic Bonding and UBM with Sn, SnCu and SAC Solders Joints”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(11), pp. 1899-1905, Nov. 2017.
Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, and Jin-Chern Chiou, “Ultra-High-Density 256-channel Neural Sensing Microsystem using TSV-embedded Neural Probes,” IEEE Transactions on Biomedical Circuits and Systems, 11(5), pp. 1013-1025, Oct. 2017.
Yu-Tao Yang, Tzu-Chieh Chou, Ting-Yang Yu, Yu-Wei Chang, Tai-Yuan Huang, Kai-Ming Yang, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng, and Kuan-Neng Chen, “Low Temperature Cu-Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3D Heterogeneous Integration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(9), pp. 1560-1566, Sep. 2017.
Shih-Wei Lee, Jian-Yu Shih, Kuo-Hua Chen, Chi-Tsung Chiu, and Kuan-Neng Chen, “Polymer-Based Liner TSV Fabrication Scheme and Its Resistance Variation”, Journal of Nanoscience and Nanotechnology, 17(7), pp. 4712-4715, Jul. 2017.
Yu-Chen Hu, Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Hsiao-Chun Chang, Yu-Tao Yang, Yan-Huei You, Jr-Ming Chen, Yan-Yu Huang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Ching-Te Chuang, Jin-Chern Chiou, and Kuan-Neng Chen, “An Advanced 2.5D Heterogeneous Integration Packaging for High Density Neural Sensing Microsystem,” IEEE Transactions on Electron Devices, 64(4), pp. 1666-1673, Apr. 2017.
Shih-Wei Lee, and Kuan-Neng Chen, “Development of Bump-less Stacking with Bottom-up TSV Fabrication,” IEEE Transactions on Electron Devices, 64(4), pp. 1660-1665, Apr. 2017.
Chuan-An Cheng, Tsung-Yen Tsai, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “Characterization of Temporary Bonding and Laser Release Using a Polyimide and 300-nm Photolysis Polymer System for High-Throughput 3D IC Applications”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(3), pp. 456-462, Mar. 2017.
Chuan-An Cheng, Yu-Hsiang Huang, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, and Kuan-Neng Chen, “Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3D Integration and FOWLP Scheme”, IEEE Journal of the Electron Devices Society, 5(2), pp. 136-140, Mar. 2017.
Shih-Wei Lee, Geng-Ming Chang, Ching-Yun Chang, and Kuan-Neng Chen, “A Novel Sealing Redistribution Layer Approach for Through-Glass Via Fabrication”, IEEE Journal of the Electron Devices Society, 5(2), pp. 132-135, Mar. 2017.
Shih-Wei Lee, Ching-Yun Chang, Geng-Ming Chang, and Kuan-Neng Chen, “Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology”, IEEE Journal of the Electron Devices Society, 5(2), pp. 128-131, Mar. 2017.
Yu-Chen Hu, and Kuan-Neng Chen, “A Novel Bonding Approach and Its Electrical Performance for Flexible Substrate Integration,” IEEE Journal of the Electron Devices Society, 4(4), pp. 185-188, Jul. 2016.
Yen-Jun Huang, Yen-Hui Hsieh, Jian-Yu Shih, Han-Chun Chen, Jihperng Leu, and Kuan-Neng Chen, “Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric,” Journal of Nanoscience and Nanotechnology, 16(7), 7546-7550, Jul. 2016.
Yu-Chen Hu, Chun-Pin Lin, Yao-Jen Chang, Nien-Shyang Chang, Ming-Hwa Sheu, Chi-Shi Chen, and Kuan-Neng Chen, “A Novel Flexible 3-D Heterogeneous Integration Scheme Using Electro-less Plating on Chips with Advanced Technology Node,” IEEE Transactions on Electron Devices, 62(12), 4148-4153, Dec. 2015.
Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, and Kuan-Neng Chen, “Demonstration and Electrical Performance of Cu–Cu Bonding at 150 °C With Pd Passivation,” IEEE Transactions on Electron Devices, 62(8), pp. 2587-2592, Aug. 2015.
Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Yu-Sheng Hsieh, and Kuan-Neng Chen, “Modeling and Characterization of TSV Capacitor and Stable Low Capacitance Implementation for Wide-I/O Application”, IEEE Transactions on Device and Materials Reliability, 15(2), pp. 129-135, Jun. 2015.
Chien-Min Liu, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and King-Ning Tu, “Low-temperature Direct Copper-to-Copper Bonding Enabled by Creep on (111) Surfaces of Nanotwinned Cu”, Scientific Reports, 5, 9734, May 2015.
[Invited Paper] Chih Chen, Doug Yu, and Kuan-Neng Chen, “Vertical Interconnects of Microbumps in 3D Integration”, MRS Bulletin, 40(3), pp. 257-263, Mar. 2015.
Kuan-Neng Chen, and King-Ning Tu, “Materials Challenges in Three-Dimensional Integrated Circuits”, MRS Bulletin, 40(3), pp. 219-222, Mar. 2015.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, “Device Characteristics of TSV-Based Piezoelectric Resonator with Load Capacitance and Static Capacitance Modification,” IEEE Transactions on Electron Devices, 62(3), pp. 927-933, Mar. 2015.
Chih-Wei Chang, Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Jin-Chern Chiou, “A Double-Sided, Single-Chip Integration Scheme Using Through-Silicon-Via for Neural Sensing Applications,” Biomedical Microdevices, 17(1), 11, Feb. 2015.
Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, and Ho-Ming Tong, “2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications,” IEEE Transactions on Biomedical Circuits and Systems, 8(6), pp. 810-823, Dec. 2014.
Yao-Jen Chang, Yu-Sheng Hsieh, and Kuan-Neng Chen, “Submicron Cu/Sn Bonding Technology with Transient Ni Diffusion Buffer Layer for 3DIC Application”, IEEE Electron Device Letters, 35(11), pp. 118-120, Nov. 2014.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Chung-Lun Lo, Chi-Chung Chang and Kuan-Neng Chen, “Quartz Resonator Assembling with TSV Interposer Using Polymer Sealing or Metal Bonding,” Nanoscale Research Letters, 9, pp. 541-548, Oct. 2014.
Jian-Yu Shih, Wen-Chun Huang, Cheng-Ta Ko, Zheng Yang, Sheng-Hsiang Hu, Jih-Perng Leu, Keng C. Chou, and Kuan-Neng Chen, “Adhesion Investigation between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications,” IEEE Transactions on Device and Materials Reliability, 14(3), pp. 914-920, Sep. 2014.
Wan-Lin Tsai, Kuang-Yu Wang, Yao-Jen Chang, Yu-Ren Li, Po-Yu Yang, Kuan-Neng Chen, and Huang-Chung Cheng, “Conductivity enhancement of multiwalled carbon nanotube thin film via thermal compression method,” Nanoscale Research Letters, 9, pp. 451-456, Aug. 2014.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, and Kuan-Neng Chen, “Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement with a Concave Cu TSV Structural Design,” IEEE Electron Device Letters, 35(8), pp. 865-867, Aug. 2014.
Cheng-Ta Ko, Zhi-Cheng Hsiao, Hsiang-Hung Chang, Dian-Rong Lyu, Chao-Kai Hsu, Huan-Chun Fu, Chun-Hsien Chien, Wei-Chung Lo, and Kuan-Neng Chen, “A novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices,” IEEE Transactions on Device and Materials Reliability, 14(2), pp. 715-720, Jun. 2014.
Chien-Min Liu, Han-wen Lin, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and K. N. Tu, “Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces,” Scripta Materialia, 78-79, pp. 65-68, May 2014.
Yu-San Chien, Yan-Pin Huang, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Ching-Te Chuang, Wei Hwang, Jin-Chern Chiou, Ho-Ming Tong, and Kuan-Neng Chen, “Low-Temperature Bonded Cu/In Interconnect with High Thermal Stability for 3-D Integration,” IEEE Transactions on Electron Devices, 61(4), pp. 1131-1136, Apr. 2014.
Li-Min Kuo, Yi-Chia Chou, Kuan-Neng Chen, Chien-Chia Lu, and Shuchi Chao, “A precise pH microsensor using RF-sputtering IrO₂ and Ta₂O₅ films on Pt-electrode,” Sensors and Actuators B: Chemical, 193, pp. 687-691, Mar. 2014.
Lei-Chun Chou, Shih-Wei Lee, Po-Tsang Huang, Chih-Wei Chang, Cheng-Hao Chiang, Shang-Lin Wu, Ching-Te Chuang, Jin-Chern Chiou, Wei Hwang, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, and Kuan-Neng Chen, “A TSV-Based Bio-Signal Package with μ-probe Array,” IEEE Electron Device Letters, 35(2), pp. 256-258, Feb. 2014.
Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng, Ming-Shaw Shy, Teu-Hua Lin, Kou-Hua Chen, Chi-Tsung Chiu, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Ho-Ming Tong, and Kuan-Neng Chen, “Novel Cu-to-Cu Bonding with Ti Passivation at 180C in 3D Integration”, IEEE Electron Device Letters, 34(12), pp. 1551-1553, Dec. 2013.
Hsiao-Yu Chen, Sheng-Yao Hsu, and Kuan-Neng Chen, “Electrical Performance and Reliability Investigation of Co-sputtered Cu/Ti Bonded Interconnects”, IEEE Transactions on Electron Devices, 60(10), pp. 3521-3526, Oct. 2013.
Jian-Yu Shih, Yen-Chi Chen, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, and Kuan-Neng Chen, “Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme with Hermetic Sealing”, IEEE Electron Device Letters, 34(8), pp. 1041-1043, Aug. 2013.
Cheng-Hao Chiang, Li-Min Kuo, Yu-Chen Hu, Wen-Chun Huang, Cheng-Ta Ko, and Kuan-Neng Chen, “Sealing Bump with Bottom-up Cu TSV Plating Fabrication in 3-D Integration Scheme”, IEEE Electron Device Letters, 34(5), pp. 671-673, May 2013.
Yao-Jen Chang, Cheng-Ta Ko, Tsung-Han Yu, Cheng-Hao Chiang, and Kuan-Neng Chen, “Backside-Process-Induced Junction Leakage and Process Improvement of Cu TSV Based on Cu/Sn and BCB Hybrid Bonding”, IEEE Electron Device Letters, 34(3), pp. 435-437, Mar. 2013.
Li-Min Kuo, Kuan-Neng Chen, Yi-Lin Chuang, and Shuchi Chao, “Flexible pH-Sensing Structure using WO₃/IrO₂ Junction with Al₂O₃ Encapsulation Layer”, ECS Solid-State Letters, 2(3), pp. 28-30, 2013.
Yao-Jen Chang, Cheng-Ta Ko, and Kuan-Neng Chen, “Electrical and Reliability Investigation of Cu TSVs with Low-Temperature Cu/Sn and BCB Hybrid Bond Scheme”, IEEE Electron Device Letters, 34(1), pp. 102-104, Jan. 2013.
Yew Heng Tan, Kwang Sing Yew, Kwang Hong Lee, Yao-Jen Chang, Kuan-Neng Chen, Diing Shenp Ang, Eugene A. Fitzgerald, and Chuan Seng Tan “Al₂O₃ Interface Engineering of Germanium Epitaxial Layer Grown Directly on Silicon”, IEEE Transactions on Electron Devices, 60(1), pp. 56-62, Jan. 2013.
[Invited Paper] Cheng-Ta Ko, and Kuan-Neng Chen, “Reliability of Key Technologies in 3D Integration”, Microelectronics Reliability, 53(1), pp. 7-16, Jan. 2013.
Cheng-Hsien Lu, Chuan-An Cheng, Chia-Hua Ho, and Kuan-Neng Chen, “Effects of Bonding Technology and Thinning Process in Three-Dimensional Integration on Device Characteristics”, Journal of Nanoscience and Nanotechnology, 12, pp. 8050-8054, Oct. 2012.
Sheng-Yao Hsu, Hsiao-Yu Chen, and Kuan-Neng Chen, “Co-sputtered Cu/Ti Bonded Interconnects with a Self-formed Adhesion Layer for 3D Integration Applications”, IEEE Electron Device Letters, 33(7), pp. 1048-1050, July 2012.
Cheng-Ta Ko, Zhi-Cheng Hsiao, Yao-Jen Chang, Peng-Shu Chen, Yu-Jiau Hwang, Huan-Chun Fu, Jui-Hsiung Huang, Chia-Wen Chiang, Shyh-Shyuan Sheu, Yu-Hua Chen, Wei-Chung Lo, and Kuan-Neng Chen, “A Wafer-level 3D Integration Scheme with Cu TSVs Based on Micro-bump/Adhesive Hybrid Bonding for 3D Memory Application”, IEEE Transactions on Device and Materials Reliability, 12(2), pp.209-216, June 2012.
Y. Hsu, H. Y. Chen and K. N. Chen, “Diffusion of Co-Sputtered Metals as Bonding Materials for 3D Interconnects during Thermal Treatments,” Journal of Nanoscience and Nanotechnology, 12, pp.2467-2471, Mar 2012.
Kuan-Neng Chen, Cheng-Ta Ko, Zhi-Cheng Hsiao, Huan-Chun Fu, and Wei-Chung Lo, “Adhesive Selection and Bonding Parameter Optimization for Hybrid Bonding in 3D Integration,” Journal of Nanoscience and Nanotechnology, 12, pp.1821-1828, Mar 2012.
L. Lin, W. C. Huang, C. T. Ko, and K. N. Chen, “BCB-to-Oxide Bonding Technology for 3D Integration”, Microelectronics Reliability, 52, pp. 352-355, Feb 2012.
[Invited Paper] Ya-Sheng Tang, Yao-Jen Chang, and Kaun-Neng Chen, “Wafer-Level Cu-Cu Bonding Technology”, Microelectronics Reliability, 52, pp. 312-320, Feb 2012.
[Invited Paper] Cheng-Ta Ko, and Kaun-Neng Chen, “Low Temperature Bonding Technology for 3D Integration”, Microelectronics Reliability, 52, pp. 302-311, Feb 2012.
Ming-Fang Lai, Shih-Wei Li, Jian-Yu Shih, and Kuan-Neng Chen, “Wafer-Level Three-Dimensional Integrated Circuits (3D IC): Schemes and Key Technologies”, Microelectronic Engineering, 88, pp. 3282-3286, Nov 2011.
K. N. Chen, C. A. Cheng, W. C. Huang and C. T. Ko, “Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding,” Journal of Nanoscience and Nanotechnology, 11, pp. 6969-6972, Aug 2011.
Sang Hwui Lee, Kuan-Neng Chen, and Jian-Qiang Lu, “Wafer-to-wafer Alignment for 3D Integration: An Review”, IEEE Journal of Microelectromechanical Systems. 20(4), pp. 885-898, Aug 2011.
Kuan-Neng Chen, Zheng Xu, and Jiang-Qiang Lu, “Electrical Performance and Alignment Investigation of Wafer-level Cu-oxide Hybrid Bonding,” IEEE Electron Device Letters, 32(8), pp. 1119-1121, Aug 2011.
K. N. Chen, A. M. Young, S. H. Lee, and J. -Q. Lu, “Electrical Performances and Structural Designs of Copper Bonding in Wafer-Level Three-Dimensional Integration,” Journal of Nanoscience and Nanotechnology, 11, pp. 5143-5147, June. 2011.
[Invited Paper] Kuan-Neng Chen, and Chuan Seng Tan, “Integration Schemes and Enabling Technologies for Three-Dimensional Integrated Circuits (3D IC)”, IET Computers and Digital Techniques, 5(3), pp. 160-168, May 2011.
K. N. Chen, C. K. Tsang, W. W. Wu, S. H. Lee, and J. Q. Lu, “Fabrication of Nano-Scale Cu Bond Pads with Seal Design in 3D Integration Applications”, Journal of Nanoscience and Nanotechnology, 11, pp. 3336-3339, Apr. 2011.
W. Wu, K. C. Lu, K. N. Chen, P. H. Yeh, C. W. Wang, Y. C. Lin, and Y. Huang “Controlled large strain of Si in the NiSi/Si/NiSi nanowire heterostructure”, Applied Physics Letters, 97, pp 203110-1 – 203110-3, Dec. 2010.
K. N. Chen, Y. Zhu, W.W. Wu, and R. Reif, “Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes”, Journal of Electronic Materials. 39(12), pp. 2605-2610, Dec. 2010.
Kuan-Neng Chen, and John C. Arnold, “Wafer-level Self-aligned Nano Tubular Structures and Templates for Device Applications“, Journal of Nanoscience and Nanotechnology, 10, pp. 8145-8150, Dec. 2010.
W. Wu, C. W. Wang, K.N. Chen, S. L. Cheng, and S. W. Lee, “Enhanced growth of low-resistivity titanium silicides on epitaxial Si_0.7Ge_0.3on (001)Si with a sacrificial amorphous Si interlayer”, Thin Solid Films, 518, pp. 7279-7282, Oct. 2010.
[Invited Paper] Cheng-Ta Ko and Kuan-Neng Chen, “Wafer Level Bonding/Stacking Technology for 3D Integration”, Microelectronics Reliability, 50 (4), pp. 481-488, April 2010.
Kuan-Neng Chen, and Lia Krusin-Elbaum, “The fabrication of a programmable via using phase-change material in CMOS-compatible technology“, Nanotechnology, 21 (13), 134001, April 2010.
K. N. Chen, C. Cabral Jr. and L. Krusin-Elbaum, “Thermal stress effects of Ge₂Sb₂Te₅ phase change material: Irreversible modification with Ti adhesion layers and segregation of Te”, Microelectronic Engineering, 85, pp 2346-2349, Dec. 2008.
J. Koester, A. M. Young, R. R. Yu, S. Purushothama, K. N. Chen, D. C. La Tulipe, N. Rana, L. Shi, Matt R. Wordeman, and E. J. Sprogis, “Wafer-Level 3D Integration Technology”, IBM Journal of Research and Development, 52 (6), pp 583-597, Jul. 2008.
K. N. Chen, L. Krusin-Elbaum, D. Newns, B. Elmegreen, R. Cheek, N. Rana, A. Young, S. Koester, and C. Lam, “Programmable Via Using Indirectly Heated Phase-Change Switch for Reconfigurable Applications”, IEEE Electron Device Letters, 29, pp 131-133, Jan. 2008.
Krusin-Elbaum, C. Cabral Jr., K. N. Chen, M. Copel, D. W. Abraham, K. B. Reuter, S. M. Rossnagel, J. Bruley, and V. Deline, “Evidence for segregation of Te in Ge2Sb2Te5 films: Effect on “phase-change” stress”, Applied Physics Letters, 90, pp. 141902-1 – 141902-3, April 2007.
[Selected Paper] Cabral Jr., K.N. Chen, L. Krusin-Elbaum, and V. Deline, “Irreversible modification of Ge₂Sb₂Te₅ phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack”, Virtual Journal of Nanoscale Science & Technology, Feb 2007.
Cabral Jr., K.N. Chen, L. Krusin-Elbaum, and V. Deline, “Irreversible modification of Ge₂Sb₂Te₅ phase change material by nanometers-thin Ti adhesion layers in a device-compatible stack”, Applied Physics Letters, 90, pp. 051908-1 – 051908-3, 2007.
K. N. Chen, S. M. Chang, L. C. Shen, and R. Reif, “Investigations of Strength of Copper Bonded Wafers with Several Quantitative and Qualitative Tests”, Journal of Electronic Materials, 35(5), pp. 1082-1086, 2006.
K. N. Chen, A. Fan, C. S. Tan, and R. Reif, “Bonding Parameters of Blanket Copper Wafer Bonding”, Journal of Electronic Materials, 35(2), pp 230-234, 2006.
[Invited Paper] Kuan-Neng Chen, and R. Reif, “Review Paper: Copper Wafer Bonding: Interface Analysis and Characterization,” Journal of the Chinese Colloid and Interface Society, 28(1), pp. 1-10, 2006.
S. Tan, K. N. Chen, A. Fan, and R. Reif, “The effect of forming gas anneal on the oxygen content in bonded copper layer”, Journal of Electronic Materials, 34(12), pp 1598-1602, 2005.
K. N. Chen, C. S. Tan, A. Fan, and R. Reif, “Copper Bonded Layers Analysis and Effects of Copper Surface Conditions on Bonding Quality for Three-Dimensional Integration”, Journal of Electronic Materials, 34(12), pp 1464-1467, 2005.
K. N. Chen, S. M. Chang, L. C. Shen, C. S. Tan, A. Fan, and R. Reif, “Processing Development and Bonding Quality Investigations of Silicon Layer Stack Using Copper Wafer Bonding”, Applied Physics Letters, 87(3), pp. 031909-1-031909-3, 2005.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Abnormal Contact Resistance Reduction of Bonded Copper Interconnects in 3-D Integration during Current Stressing”, Applied Physics Letters, 86(1), pp. 0011903-1-0011903-3, 2005.
S. Tan, K. N. Chen, A. Fan, and R. Reif, “Low temperature direct chemical-vapor-deposition (CVD) oxides to thermal oxide wafer bonding in silicon layer transfer”, Electrochemical and Solid-State Letters, 8(1), pp. G1-G4, 2005.
Kuan-Neng Chen, Mauro J. Kobrinsky, Brandon Barnett and Rafael Reif, “Comparisons of Conventional, 3D, Optical and RF Interconnect for Clock Distribution,” IEEE Trans. on Electron Devices, 51(2), pp 233-239, 2004.
K. N. Chen, A. Fan, C. S. Tan, and R. Reif, “Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology”, IEEE Electron Devices Letters, 25(1), pp 10-12, 2004.
K. N. Chen, C. S. Tan, A. Fan and R. Reif, “Morphology and bond strength of copper wafer bonding”, Electrochemical and Solid-State Letters, 7(1), pp G14-G16, 2004.
K. N. Chen, A. Fan, C. S. Tan, and R. Reif, “Temperature and Duration Effect on Microstructure Evolution during Copper Wafer Bonding”, Journal of Electronic Materials, 32(12), pp 1371-1374, 2003.
S. Tan, A. Fan, K. N. Chen, and R. Reif, “Low temperature thermal oxide to Plasma Enhanced Chemical Vapor Deposition oxide wafer bonding for thin film transfer application,” Applied Physics Letters, 82(16), pp 2649-2651, 2003.
K. N. Chen, A. Fan, C. S. Tan and R. Reif, “Microstructure evolution and abnormal grain growth during copper wafer bonding,” Applied Physics Letters, 81(20), pp 3774-3776, 2002.
K. N. Chen, A. Fan, and R. Reif, “Interfacial Morphologies and Possible Mechanisms of Copper Wafer Bonding,” Journal of Materials Science, 37(16), pp 3441-3446, 2002.
Kuan-Neng Chen, Andy Fan, and Rafael Reif, “Microstructure Examination of Copper Wafer Bonding,” Journal of Electronic Materials, 30, pp 331-335, 2001.
H. Lin, K. N. Chen, S. L. Cheng, Y.C. Peng, G.H. Shen, L.J. Chen, and C.R. Chen, “Interfacial Reactions of Metal Thin Films on Ion Implanted Silicon under High Current Density,” J. Korean Phys. Soc. 35, pp S264-266, 1999.
K. N. Chen, H.H. Lin, S.L. Cheng, Y.C. Peng, G.H. Shen, L. J. Chen, C.R. Chen, J.S. Huang, and K.N. Tu, ” Silicide Formation in Implanted Channels and Interfacial Reactions of Metal Contacts under High Current Density,” Journal of Materials Research. 14, pp 4720-4726, 1999.
Wen-Ku Chang, Shy-Feng Hsieh, Yuan-Haun Lee, Kuan-Neng Chen, Nan-Chung Wu, A. A WANG, “X-ray Diffraction Studies of Phase Transformations Between Tetragonal and Cubic Phases in Ba(Ti,Sn)O₃ Systems,” Journal of Materials Science, 33(7), pp 1765, 1998.
Po-Fu Yen, Kuan-Neng Chen, and Nan-Chung Wu, “AlN Films Deposited by RF Magnetron Sputtering Techniques,” Proceedings of National Science Council ROC(A) 22, pp. 225-234, 1998.
Kuan-Neng Chen, and Nan-Chung Wu, “The Research and Manufacturing of the Dielectric Materials in (Ba, Ca)(Ti, Sn)O₃ System,” Chinese Journal of Materials Science 29, pp. 72-80, 1997.

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