3DIC Lab is led by Prof. Kuan-Neng Chen. Our research focuses on three-dimensional integrated circuits (3DIC), heterogeneous integration, and advanced packaging technologies. As transistor scaling approaches its physical limits, More-than-Moore has emerged as a dominant trend in semiconductor technology development in recent years. For us, More-than-Moore is not only a target but also a vision that drives our work. We firmly believe that 3DIC is the key to leading semiconductor technology in the next era of innovation.

Our research team has achieved significant academic accomplishments. We have published extensively in IEEE journals and presented our work at top international conferences such as IEDM, VLSI, and ISSCC. These achievements reflect our commitment to innovation and sustained effort. Beyond academic excellence, the 3DIC Lab is highly regarded by industry partners for our ability to co-develop and advance cutting-edge manufacturing technologies. Despite our accomplishments, we will never slow down—after all, the sky is the limit for 3DIC.

3DIC Lab fosters an American-style learning environment. We strongly encourage every member—regardless of background—to speak openly about their ambitions and innovative ideas, because breakthroughs often begin with inspiring conversations. We welcome motivated undergraduate, master’s, and Ph.D. students who aspire to shape the future of 3DIC. Join us, and let us help you become the person you aim to be.