3DIC Lab is led by Prof. Chen, Kuan-Neng . We are focused on three-dimensional integrated circuits, heterogeneous integration, and advanced packaging technology. As the scaling of transistor size faces its physical limits, More than Moore becomes the mainstream of world-class semiconductor component conferences in recent years. To us, More than Moore is not only a goal but a vision that we pursue. We firmly believe 3DIC is the key to leading semiconductor technology in the post-Moore generation.

The research team obtained lots of academic achievement. We have published many IEEE journal papers, top international conferences IEDM, VLSI, and even ISSCC. This is all attributed to our innovation and diligence. In addition to our outstanding academic achievement, 3DIC Lab is also highly recognized by industries due to its capability of co-developing and upgrading advanced manufacture techniques. Despite the achievement we have, we will not slow our pace down. After all, the sky is the limit of 3DIC!

3DIC Lab is an American-style learning environment, we strongly encourage no matter who you are to boldly speak out their dreams or any form of innovation because new ideas often come after an inspiring conversation. We welcome motivated undergraduate, master, and Ph.D. students who have aspirations for 3DIC. Join us! Let us enlighten you to become the person you want to be!