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Hybrid Bonding & TCB Technologies
Low Temperature Cu-Cu Direct Bonding
Cu / Polymer Hybrid Bonding
Cu / Dielectric Hybrid Bonding
Low Temperature/Ultra Fast Cu/Polymer Hybrid Bonding
Novel Material – Polyimide
Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
3D IC Platforms
Monolithic 3DIC
Novel Low-Warpage Hyper RDL (HRDL) Interposer
Wafer-level Bumpless Through-Silicon-Via (TSV)
Through-Glass Via (TGV)
Innovative Applications
Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
Advanced Wafer-level Packaging for MEMS Applications
Innovative Materials & Solutions to Challenges
Advanced Thermal Management for Thin 3D Using AlN and a 3D Heat Dissipation Network
High-Precision Wafer-Level Alignment with Moiré Patterns and Deep Learning
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– Hybrid Bonding & TCB Technologies –
Low Temperature/Ultra Fast Cu/Polymer Hybrid Bonding
Novel Material – Polyimide
Optimization of lithography process
Evaluation and improvement of adhesion
Reliability test: chemical resist test, TCT, u-HAST
Design and verification of electrical characteristics
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