About
Projects
Government
Collaboration
Technology
Low Temperature Bonding Technology
Low Temperature Cu-Cu Direct Bonding
Cu / Polymer Hybrid Bonding
Cu / Dielectric Hybrid Bonding
Submicron Cu-Solder Bonding utilizing Ultra-thin Buffer Layers
3DIC Enabling Technology
Novel Material – Polyimide
Monolithic 3DIC
Wafer-level Bumpless Through-Silicon-Via (TSV)
Novel Low-Warpage Hyper RDL (HRDL) Interposer
Advanced Packaging Applications & Heterogeneous Integration
Heterogeneous Integration of Biological Chips and Neuro Sensor Microsystem
Advanced Wafer-level Packaging for MEMS Applications
Publications
ISSCC/IEDM/VLSI
Journal
Conference
Patent
Books
Professor
Members
Students
Alumni
Activities
Contact
繁體中文
Menu
Menu
– 3DIC Lab –
Activities
Class of 2025: Graduation Group Photo
2025 IEEE ECTC
2025 3DIC Summer Retreat
Scroll to top
2025 3DIC Summer Retreat