– 研發成果 –

Innovative Materials & Solutions to Challenges

Advanced Thermal Management for Thin 3D IC Using AlN and a 3D Heat Dissipation Network

Ultra-Thin AlN Heat-Spreading Layer — 300 nm AlN
Localized Laser Annealing — 532 nm laser annealing
High-Thermal-Conductivity AlN Film — Up to 45.5 W/m·K
3D Vertical Thermal Pathways — Dummy TLVs
Advanced 3D Thermal Architecture — ~30% temperature reduction

High-Precision Wafer-Level Alignment with Moiré Patterns and Deep Learning

Moiré-Based 3-DoF Alignment — X, Y, and θ three-degree-of-freedom alignment
90 μm Working Distance — Non-contact optical alignment
Digital Twin + DLOMA — Deep learning-based automated alignment
W2W Alignment — 8-inch wafer-to-wafer alignment
300 nm Multi-Tier Alignment — Three-tier device stacking demonstration